Abstract: A hot water delivery system includes a water heater, a mixing valve that is coupled to the output of the water heater, and a plurality of loads that are coupled to the output of the mixing valve. A load set point temperature of each load that is representative of a maximum temperature of the hot water that is to be delivered to the respective load is set by a user. Responsive to detecting the occurrence of an event associated with a load of the plurality of loads, a controller of the water heater controls the mixing valve to adjust the temperature of the hot water from the water heater to the load set point temperature associated with the load, provided the load set point temperature of the load is different from a water heater set point temperature at which the water heater maintains the hot water therein.

Abstract: A hot water delivery system includes a water heater, a mixing valve that is coupled to the output of the water heater, and a plurality of loads that are coupled to the output of the mixing valve. A load set point temperature of each load that is representative of a maximum temperature of the hot water that is to be delivered to the respective load is set by a user. Responsive to detecting the occurrence of an event associated with a load of the plurality of loads, a controller of the water heater controls the mixing valve to adjust the temperature of the hot water from the water heater to the load set point temperature associated with the load, provided the load set point temperature of the load is different from a water heater set point temperature at which the water heater maintains the hot water therein.

Abstract: A Z-directed capacitor according to one embodiment includes a body having top, bottom and side surfaces, a cross-sectional shape that is insertable into a mounting hole in a printed circuit board, and a plurality of stacked support members. Each support member includes an annular plate mounted on a surface thereof. A first conductive side channel and a second conductive side channel are formed in the side surface and extend along a top-to-bottom dimension of the body. A first set of the annular plates electrically contact the first conductive side channel but not the second conductive side channel and a second set of the annular plates electrically contact the second conductive side channel but not the first conductive side channel. A third conductive side channel is formed in the side surface, extends along the top-to-bottom dimension of the body and is electrically separated from the annular plates.

Abstract: A Z-directed capacitor according to one embodiment includes a body having top, bottom and side surfaces, a cross-sectional shape that is insertable into a mounting hole in a printed circuit board, and a plurality of stacked support members. Each support member includes an annular plate mounted on a surface thereof. A first conductive side channel and a second conductive side channel are formed in the side surface and extend along a top-to-bottom dimension of the body. A first set of the annular plates electrically contact the first conductive side channel but not the second conductive side channel and a second set of the annular plates electrically contact the second conductive side channel but not the first conductive side channel. A third conductive side channel is formed in the side surface, extends along the top-to-bottom dimension of the body and is electrically separated from the annular plates.

Abstract: A Z-directed signal pass-through component for insertion into a printed circuit board while allowing electrical connection from external surface conductors to internal conductive planes or between internal conductive planes. The Z-directed pass-through component is mounted within the thickness of the PCB allowing other components to be mounted over it. The body may contain one or more conductors and may include one or more surface channels or wells extending along at least a portion of the length of the body.

Abstract: A Z-directed signal delay line component for insertion into a printed circuit board while allowing electrical connection to internal conductive planes contained with the PCB. In one embodiment the Z-directed delay line component is housed within the thickness of the PCB allowing other components to be mounted over it. The delay line embodiments include a W-like line and a plurality of spaced apart, semi-circular line segment connected such that current flow direction alternates in direction between adjacent semi-circular line segments, each of which in other embodiments can be varied by use of shorting bars. Several Z-directed delay line components may be mounted into a PCB and serially connected to provide for longer delays. The body may contain one or more conductors and may include one or more surface channels or wells extending along at least a portion of the length of the body. Methods for mounting Z-directed components are also provided.

Abstract: A Z-directed capacitor component for insertion into a printed circuit board while allowing electrical connection to internal conductive planes contained within the PCB. In one embodiment the Z-directed capacitor component utilizes semi-cylindrical metallic sheets. In another embodiment, stack annular metallic disks are used. The Z-directed capacitor component mounts within the thickness of the PCB allowing other components to be mounted over it. The body may contain one or more conductors and may include one or more surface channels or wells extending along at least a portion of the length of the body. Methods for mounting Z-directed components are also provided.

Abstract: A Z-directed filter component for insertion into a printed circuit board while allowing electrical connection to internal conductive planes contained with the PCB. In one embodiment the Z-directed filter component is mounted within the thickness of the PCB allowing other components to be mounted over it. The filter may be T-filter or a Pi-filter within the body of the Z-directed component. The body may also contain one or more conductors and may include one or more surface channels or wells extending along at least a portion of the length of the body. Methods for mounting Z-directed components are also provided.

Abstract: A Z-directed signal pass-through component for insertion into a printed circuit board while allowing electrical connection from external surface conductors to internal conductive planes or between internal conductive planes. The Z-directed pass-through component is mounted within the thickness of the PCB allowing other components to be mounted over it. The body may contain one or more conductors and may include one or more surface channels or wells extending along at least a portion of the length of the body.

Abstract: A Z-directed capacitor component for insertion into a printed circuit board while allowing electrical connection to internal conductive planes contained within the PCB. In one embodiment the Z-directed capacitor component utilizes semi-cylindrical metallic sheets. In another embodiment, stack annular metallic disks are used. The Z-directed capacitor component mounts within the thickness of the PCB allowing other components to be mounted over it. The body may contain one or more conductors and may include one or more surface channels or wells extending along at least a portion of the length of the body. Methods for mounting Z-directed components are also provided.

Abstract: A Z-directed signal pass-through component for insertion into a printed circuit board while allowing electrical connection from external surface conductors to internal conductive planes or between internal conductive planes. The Z-directed pass-through component is mounted within the thickness of the PCB allowing other components to be mounted over it. The body may contain one or more conductors and may include one or more surface channels or wells extending along at least a portion of the length of the body.

Abstract: A spread spectrum clock generator (SSCG) control and inspection circuit provides a system and method for inspecting and controlling an external SSCG, and for verifying the modulation profile waveform of an external SSCG. An electronic circuit is included that can check for the presence of an optimal SSCG modulation profile in product subsystems, and in attached modular systems, including electronic plug-in features such as internal network adapters and cartridges. In one mode of the invention, an electronic circuit ensures continued radiated emissions compliance for field replaceable units or consumable parts within a product, such as a printer, a scanner, or a combination (or all-in-one) printer/scanner. In another mode of the invention, an electronic circuit may also act as a secondary security device for consumable products, such as toner cartridges or ink jet cartridges. In yet another mode of the invention, an electronic circuit may also adjust the attached SSCG clock.

Abstract: A Z-directed signal pass-through component for insertion into a printed circuit board while allowing electrical connection from external surface conductors to internal conductive planes or between internal conductive planes. The Z-directed pass-through component is mounted within the thickness of the PCB allowing other components to be mounted over it. The body may contain one or more conductors and may include one or more surface channels or wells extending along at least a portion of the length of the body.

Abstract: A Z-directed filter component for insertion into a printed circuit board while allowing electrical connection to internal conductive planes contained with the PCB. In one embodiment the Z-directed filter component is mounted within the thickness of the PCB allowing other components to be mounted over it. The filter may be T-filter or a Pi-filter within the body of the Z-directed component. The body may also contain one or more conductors and may include one or more surface channels or wells extending along at least a portion of the length of the body. Methods for mounting Z-directed components are also provided.

Abstract: A Z-directed signal delay line component for insertion into a printed circuit board while allowing electrical connection to internal conductive planes contained with the PCB. In one embodiment the Z-directed delay line component is housed within the thickness of the PCB allowing other components to be mounted over it. The delay line embodiments include a W-like line and a plurality of spaced apart, semi-circular line segment connected such that current flow direction alternates in direction between adjacent semi-circular line segments, each of which in other embodiments can be varied by use of shorting bars. Several Z-directed delay line components may be mounted into a PCB and serially connected to provide for longer delays. The body may contain one or more conductors and may include one or more surface channels or wells extending along at least a portion of the length of the body. Methods for mounting Z-directed components are also provided.

Abstract: A Z-directed ferrite bead component for insertion into a printed circuit board while allowing electrical connection to internal conductive planes contained with the PCB. In one embodiment the Z-directed component is housed within the thickness of the PCB allowing other components to be mounted over it. Signal and dual conductor Z-directed ferrite bead component embodiments are provided. The body may include one or more surface channels or wells extending along at least a portion of the length of the body. Methods for mounting Z-directed components are also provided.

Abstract: A design for a Z-directed component for insertion into a printed circuit board while allowing electrical connection to internal conductive planes contained with the PCB. In one embodiment the Z-directed component is mounted within the thickness of the PCB allowing other components to be mounted over it. The body may contain one or more conductors and may include one or more surface channels or wells extending along at least a portion of the length of the body. Z-directed components include high frequency signal pass throughs, capacitors, diodes, transistors, transmission lines, delay lines. Methods for mounting Z-directed components are also provided.

Abstract: A Z-directed capacitor component for insertion into a printed circuit board while allowing electrical connection to internal conductive planes contained within the PCB. In one embodiment the Z-directed capacitor component utilizes semi-cylindrical metallic sheets. In another embodiment, stack annular metallic disks are used. The Z-directed capacitor component mounts within the thickness of the PCB allowing other components to be mounted over it. The body may contain one or more conductors and may include one or more surface channels or wells extending along at least a portion of the length of the body. Methods for mounting Z-directed components are also provided.

Abstract: A spread spectrum clock generator (SSCG) control and inspection circuit provides a system and method for inspecting and controlling an external SSCG, and for verifying the modulation profile waveform of an external SSCG. An electronic circuit is included that can check for the presence of an optimal SSCG modulation profile in product subsystems, and in attached modular systems, including electronic plug-in features such as internal network adapters and cartridges. In one mode of the invention, an electronic circuit ensures continued radiated emissions compliance for field replaceable units or consumable parts within a product, such as a printer, a scanner, or a combination (or all-in-one) printer/scanner. In another mode of the invention, an electronic circuit may also act as a secondary security device for consumable products, such as toner cartridges or ink jet cartridges. In yet another mode of the invention, an electronic circuit may also adjust the attached SSCG clock.

Abstract: For EMI reduction the current modulation profile is preferably used for frequencies over 1 GHz while the frequency deviation is increased at least to ±2.5 MHz and the modulation frequency is increased to at least 150 kHz, preferably about 260 kHz. In an alternative embodiment, the modification frequency is 1 MHz or greater so that a segmented spectrum is achieved. For clocks having basic frequency below 1 GHz, but having strong harmonics higher than 1 GHz, modulation of the foregoing is combined with the slower modulation currently used. EMI reduction is realized both at the lower and the higher harmonics.