Abstract: The invention relates to a micromechanical sensor and to a corresponding production method that includes the following steps: a) preparing a doped semiconductor wafer ; b) applying an epitaxial layer that is doped in such a way that a jump in the charge carrier density in the interface between the semiconductor wafer and the epitaxial layer occurs; c) optionally etching ventilation holes traversing the epitaxial layer and optionally filling the ventilation holes with a sacrificial material; d) depositing at least one sacrificial layer, at least one spacing layer, a membrane and optionally a semiconductor circuit on the top side of the epitaxial layer using a technology known per se, wherein the semiconductor circuit may be applied after the membrane is formed or while depositing the layers required to form the membrane; e) etching a hole on the back part of the sensor, wherein the etching method is selected in such a way that etching advances in the direction of the top side and ceases in the interference bet

Abstract: A method of determining an intactness of a configuration having a plurality of sensor groups, includes the steps of forming, for all of the sensor groups, associated test signals by summing up electric signals of all respective other ones of the sensor groups. All the test signals are compared with one another; and it is selectively determined that an intactness exists, if the test signals are all substantially equal to one another, and it is determined that the intactness does not exist if the test signals are not substantially equal to one another. The configuration is provided such that each sensor group can be disconnected so as to exclude its signal from the aggregate signal. The configuration is preferably provided in a CMOS circuit on a single semiconductor chip.

Abstract: A recess is produced in a material layer by creating at least a first and a second structure in various steps. The layers define each other laterally and extend to the bottom of the recess. The first structure and the second structure are so narrow that they can be made by creating conformally produced layers that have an independent thickness and are smaller than the depth of the recess. The conformally produced layers are formed in an appropriate deposition process. A covering structure can be produced on top of the first and second structure. An opening can be made in the covering structure, through which the first structure and the second structure can be removed in an etching step.

Abstract: A bottle is constructed with separate compartments 4, 5 for different liquids. The neck 2 of the bottle is divided internally by a longitudinally extending partition 3, two sides of the each communicating exclusively with one of the compartments 4, 5.