Abstract: An ultraviolet light-resistant article that includes: a substrate having a glass or glass-ceramic composition and first and second primary surfaces; an ultraviolet light-absorbing element having a an absorptivity greater than 50% at wavelengths from about 100 nm to about 380 nm and a thickness between about 10 nm and about 100 nm; and a dielectric stack formed with a plasma-enhanced process. Further, the light-absorbing element is between the substrate and the dielectric stack. Alternatively, the light-absorbing element can include one or more ultraviolet light-resistant layers disposed within the dielectric stack over the first primary surface.

Abstract: An article that includes: a glass-based substrate having opposing major surfaces; a crack mitigating stack disposed on one of the major surfaces; and a scratch-resistant film disposed on the crack mitigating stack that has an elastic modulus greater than or equal to the elastic modulus of the substrate. The stack comprises one or more bi-layers defined by: (a) a first layer comprising an organosilicate material, and (b) a second layer comprising an organosilicate material over the first layer, the first layer having a lower elastic modulus than the elastic modulus of the second layer. The film comprises at least one of a metal-containing oxide, a metal-containing oxynitride, a metal-containing nitride, a metal-containing carbide, a silicon-containing polymer, a carbon, a semiconductor, and combinations thereof. In addition, the article is characterized by an average flexural strength that is at least 70% of an average flexural strength of the substrate.

Abstract: An article includes: a transparent substrate having a primary surface; and a protective film disposed on the primary surface, such that each of the substrate and the protective film have an optical transmittance of 20% or more in the visible spectrum, and such that the protective film includes at least one of: (1) a hardness of greater than 13 GPa, as measured by a Berkovich nanoindenter, or (2) an effective fracture toughness (Kc) of greater than 2.5 MPa·m1/2, as measured by indentation fracture at a depth of greater than 1 ?m.

Abstract: A method of making a device substrate article having a device modified substrate supported on a glass carrier substrate, including: treating at least a portion of the first surface of a device substrate, at least a portion of a first surface of a glass carrier, or a combination thereof, wherein the treating produces a surface having: silicon; oxygen; carbon; and fluorine amounts; and a metal to fluorine ratio as defined herein; contacting the treated surface with an untreated or like-treated counterpart device substrate or glass carrier substrate to form a laminate comprised of the device substrate bonded to the glass carrier substrate; modifying at least a portion of the non-bonded second surface of the device substrate of the laminate with at least one device surface modification treatment; and separating the device substrate having the device modified second surface from the glass carrier substrate.

Abstract: A coated article including a substrate and a low emissivity coating. The coated article includes increased TUV and/or actinic transmissivity for use in windows and similar applications.

Abstract: A method for producing a conductive through-via, including applying a seed layer on a surface of a first substrate, and forming a surface modification layer on at least one of the seed layer and a second substrate. Next, the second substrate is bonded to the first substrate with the surface modification layer to form an assembly. A conductive release layer is formed in the at least one through-via by placing a conductive release material into the at least one through-via. The conductive release layer is present on the seed layer and in the at least one through-via. A conductive metal material is applied to the at least one through-via, and the second substrate is removed from the assembly after applying the conductive metal material to the at least one through via.

Abstract: According to one or more embodiments disclosed herein, a coated article may include a substrate and an optical coating. The optical coating may be disposed on a major surface of the substrate and may form an air-side surface. The optical coating may include an optical stack, an adhesion coating, and an easy-to-clean coating. The adhesion coating may comprise an alumina layer and a silica layer. The present disclosure is also directed to methods for depositing optical coatings on substrates and to consumer electronic products which include the coated articles.

Abstract: An article includes a carrier including a carrier bonding surface, a sheet including a sheet bonding surface, and a surface modification layer disposed on at least one of the carrier bonding surface and the sheet bonding surface. The surface modification layer includes a plasma polymerized material. The plasma polymerized material planarizes the at least one of the carrier bonding surface and the sheet bonding surface. The carrier bonding surface and the sheet bonding surface are bonded with the surface modification layer so that the carrier is temporarily bonded with the sheet. A method of making an article includes depositing a surface modification layer on at least one of a carrier bonding surface and a sheet bonding surface. The method further includes bonding the carrier bonding surface and the sheet bonding surface with the surface modification layer to temporarily bond the carrier with the sheet.

Abstract: A method of making a device substrate article having a device modified substrate supported on a glass carrier substrate, including: treating at least a portion of the first surface of a device substrate, at least a portion of a first surface of a glass carrier, or a combination thereof, wherein the treating produces a surface having: silicon; oxygen; carbon; and fluorine amounts; and a metal to fluorine ratio as defined herein; contacting the treated surface with an untreated or like-treated counterpart device substrate or glass carrier substrate to form a laminate comprised of the device substrate bonded to the glass carrier substrate; modifying at least a portion of the non-bonded second surface of the device substrate of the laminate with at least one device surface modification treatment; and separating the device substrate having the device modified second surface from the glass carrier substrate.

Abstract: An ultraviolet light-resistant article that includes: a substrate having a glass or glass-ceramic composition and first and second primary surfaces; an ultraviolet light-absorbing element having a an absorptivity greater than 50% at wavelengths from about 100 nm to about 380 nm and a thickness between about 10 nm and about 100 nm; and a dielectric stack formed with a plasma-enhanced process. Further, the light-absorbing element is between the substrate and the dielectric stack. Alternatively, the light-absorbing element can include one or more ultraviolet light-resistant layers disposed within the dielectric stack over the first primary surface.

Abstract: Surface modification layers and associated heat treatments, that may be provided on a sheet, a carrier, or both, to control both room-temperature van der Waals (and/or hydrogen) bonding and high temperature covalent bonding between the thin sheet and carrier. The room-temperature bonding is controlled so as to be sufficient to hold the thin sheet and carrier together during vacuum processing, wet processing, and/or ultrasonic cleaning processing, for example. And at the same time, the high temperature covalent bonding is controlled so as to prevent a permanent bond between the thin sheet and carrier during high temperature processing, as well as maintain a sufficient bond to prevent delamination during high temperature processing.

Abstract: Methods of forming vias in substrates having at least one damage region extending from a first surface etching the at least one damage region of the substrate to form a via in the substrate, wherein the via extends through the thickness T of the substrate while the first surface of the substrate is masked. The mask is removed from the first surface of the substrate after etching and upon removal of the mask the first surface of the substrate has a surface roughness (Rq) of about less than 1.0 nm.

Abstract: According to one or more embodiments described herein, a coated article may comprise a transparent substrate and an optical coating. The transparent substrate may have a major surface, and the optical coating may be disposed on the major surface of the transparent substrate and form an air-side surface. The optical coating may comprise one or more layers of deposited material and one or more light-altering features which may reduce oscillations in the reflectance spectrum of the coated article. The coated article may exhibit a maximum hardness of about 8 GPa or greater, have an average photopic transmittance of about 50% or greater, and exhibit an angular color shift of less than about 10 from a reference illumination angle in a range of 0-10 degrees to an incident illumination angle in a range of 30-60 degrees relative to the air-side surface.

Abstract: Embodiments of this disclosure pertain to articles that exhibit scratch-resistance and improved optical properties. In some examples, the article exhibits a color shift of about 2 or less, when viewed at an incident illumination angle in the range from about 0 degrees to about 60 degrees from normal under an illuminant. In one or more embodiments, the articles include a substrate, and an optical film disposed on the substrate. The optical film includes a scratch-resistant layer and an optical interference layer. The optical interference layer may include one or more sub-layers that exhibit different refractive indices. In one example, the optical interference layer includes a first low refractive index sub-layer and a second a second high refractive index sub-layer. In some instances, the optical interference layer may include a third sub-layer.

Abstract: Embodiments of this disclosure pertain to a coating material comprising silicon and/or aluminum, hydrogen and any two or more of oxygen, nitrogen, carbon, and fluorine. The coating material exhibits a hardness of about 17 GPa or greater and an optical band gap of about 3.5 eV or greater. In some embodiments, the coating material includes, in atomic %, silicon and/or aluminum in an amount of about 40 or greater, hydrogen in an amount in the range from about 1 to about 25, nitrogen in an amount of about 30 or greater, oxygen in an amount in the range from about 0 to about 7.5, and carbon in an amount in the range from about 0 to about 10. The coating material may optionally include fluorine and/or boron. Articles including the coating material are also described and exhibit an average transmittance of about 85% or greater over an optical wavelength regime in the range from about 380 nm to about 720 nm and colorlessness.

Abstract: An article that includes: a glass, glass-ceramic or ceramic substrate comprising a primary surface; and an easy-to-clean (ETC) coating disposed over the primary surface, the coating comprising a bound ETC component and a mobile ETC component. Further, the bound ETC component comprises a perfluoropolyether (PFPE) silane. In addition, the mobile ETC component is disposed on or within the bound ETC component and comprises a fluorinated material, the mobile ETC component configured for movement relative to the bound ETC component.

Abstract: Methods of forming vias in substrates having at least one damage region extending from a first surface etching the at least one damage region of the substrate to form a via in the substrate, wherein the via extends through the thickness T of the substrate while the first surface of the substrate is masked. The mask is removed from the first surface of the substrate after etching and upon removal of the mask the first surface of the substrate has a surface roughness (Rq) of about less than 1.0 nm.

Abstract: According to one or more embodiments described herein, a coated article may comprise a transparent substrate and an optical coating. The transparent substrate may have a major surface, and the optical coating may be disposed on the major surface of the transparent substrate and form an air-side surface. The optical coating may comprise one or more layers of deposited material and one or more light-altering features which may reduce oscillations in the reflectance spectrum of the coated article. The coated article may exhibit a maximum hardness of about 8 GPa or greater, have an average photopic transmittance of about 50% or greater, and exhibit an angular color shift of less than about 10 from a reference illumination angle in a range of 0-10 degrees to an incident illumination angle in a range of 30-60 degrees relative to the air-side surface.

Abstract: Embodiments of this disclosure pertain to articles that exhibit scratch-resistance and improved optical properties. In some examples, the article exhibits a color shift of about 2 or less, when viewed at an incident illumination angle in the range from about 0 degrees to about 60 degrees from normal under an illuminant. In one or more embodiments, the articles include a substrate, and an optical film disposed on the substrate. The optical film includes a scratch-resistant layer and an optical interference layer. The optical interference layer may include one or more sub-layers that exhibit different refractive indices. In one example, the optical interference layer includes a first low refractive index sub-layer and a second a second high refractive index sub-layer. In some instances, the optical interference layer may include a third sub-layer.

Abstract: One or more aspects of the disclosure pertain to an article including a film disposed on a glass substrate, which may be strengthened, where the interface between the film and the glass substrate is modified, such that the article has an improved average flexural strength, and the film retains key functional properties for its application. Some key functional properties of the film include optical, electrical and/or mechanical properties. In one or more embodiments, the interface exhibits an effective adhesion energy of about less than about 4 J/m2. In some embodiments, the interface is modified by the inclusion of a crack mitigating layer containing an inorganic material between the glass substrate and the film.