Abstract: Embodiments include enclosures for protecting electronics such as circuit board and battery assemblies in high-pressure environments. Customized pressure distribution structures are positioned around the electronics. The pressure distribution structures include cavities that are sized to distribute pressure across the electronics in a predetermined manner based on known pressure tolerances of components or portions of the electronics. The pressure distribution structures may include various features such as vias for enhancing thermal conductivity. The enclosure may be sealed and surrounded by an envelope. Methods for manufacturing such enclosures are disclosed.

Abstract: A system enabling safe manned and unmanned operations at extremely high altitudes (above 70,000 feet). The system utilizes a balloon launch system and parachute and/or parafoil recovery.

Abstract: Embodiments include enclosures for protecting electronics such as circuit board and battery assemblies in high-pressure environments. Customized pressure distribution structures are positioned around the electronics. The pressure distribution structures include cavities that are sized to distribute pressure across the electronics in a predetermined manner based on known pressure tolerances of components or portions of the electronics. The pressure distribution structures may include various features such as vias for enhancing thermal conductivity. The enclosure may be sealed and surrounded by an envelope. Methods for manufacturing such enclosures are disclosed.

Abstract: An enclosure structure suitable for high-pressure environments includes a feedthrough for coupling components housed within the enclosure structure to components external to the enclosure structure. The enclosure structure includes a housing comprising one or more cavities for receiving one or more electronic components within an interior of the housing and a bore through the housing. The one or more electronic components comprises a connector element and the bore comprises a non-tapered portion and a tapered portion. The non-tapered portion is proximate to the interior of the housing and the tapered portion is proximate to the exterior of the housing. The bore is configured to receive a feedthrough pin for coupling the connector element to an external component external to the enclosure structure. The enclosure structure also includes a feedthrough pin extending through the bore and a potting material disposed within the tapered portion surrounding the feedthrough pin.

Abstract: A method for surveying a body of water includes providing a plurality of vehicles to a body of water. Each the plurality of vehicles includes a vehicle body, an electric-propulsion motor system mounted on the vehicle body, a rechargeable battery, at least one sonar device attached to the vehicle body, and a first communication device. The method also includes submerging each of the plurality of vehicles in the body of water, surveying an area, using the at least one sonar device, to map the body of water and to determine a location of each of the plurality of vehicles, and determining, based on the surveying, that a target object is detected within the area. The method also includes resurfacing each of the plurality of vehicles and transferring data, using the first communication device, between at least two of the plurality of vehicles at the surface of the body of water.

Abstract: A system enabling safe manned and unmanned operations at extremely high altitudes (above 70,000 feet). The system utilizes a balloon launch system and parachute and/or parafoil recovery.

Abstract: An enclosure structure suitable for high-pressure environments includes a feedthrough for coupling components housed within the enclosure structure to components external to the enclosure structure. The enclosure structure includes a housing comprising one or more cavities for receiving one or more electronic components within an interior of the housing and a bore through the housing. The one or more electronic components comprises a connector element and the bore comprises a non-tapered portion and a tapered portion. The non-tapered portion is proximate to the interior of the housing and the tapered portion is proximate to the exterior of the housing. The bore is configured to receive a feedthrough pin for coupling the connector element to an external component external to the enclosure structure. The enclosure structure also includes a feedthrough pin extending through the bore and a potting material disposed within the tapered portion surrounding the feedthrough pin.

Abstract: A method for surveying a body of water includes providing a plurality of vehicles to a body of water. Each the plurality of vehicles includes a vehicle body, an electric-propulsion motor system mounted on the vehicle body, a rechargeable battery, at least one sonar device attached to the vehicle body, and a first communication device. The method also includes submerging each of the plurality of vehicles in the body of water, surveying an area, using the at least one sonar device, to map the body of water and to determine a location of each of the plurality of vehicles, and determining, based on the surveying, that a target object is detected within the area. The method also includes resurfacing each of the plurality of vehicles and transferring data, using the first communication device, between at least two of the plurality of vehicles at the surface of the body of water.

Abstract: An enclosure structure suitable for high-pressure environments includes a feedthrough for coupling components housed within the enclosure structure to components external to the enclosure structure. The enclosure structure includes a housing comprising one or more cavities for receiving one or more electronic components within an interior of the housing and a bore through the housing. The one or more electronic components comprises a connector element and the bore comprises a non-tapered portion and a tapered portion. The non-tapered portion is proximate to the interior of the housing and the tapered portion is proximate to the exterior of the housing. The bore is configured to receive a feedthrough pin for coupling the connector element to an external component external to the enclosure structure. The enclosure structure also includes a feedthrough pin extending through the bore and a potting material disposed within the tapered portion surrounding the feedthrough pin.

Abstract: An enclosure structure suitable for high-pressure environments includes a feedthrough for coupling components housed within the enclosure structure to components external to the enclosure structure. The enclosure structure includes a housing comprising one or more cavities for receiving one or more electronic components within an interior of the housing and a bore through the housing. The one or more electronic components comprises a connector element and the bore comprises a non-tapered portion and a tapered portion. The non-tapered portion is proximate to the interior of the housing and the tapered portion is proximate to the exterior of the housing. The bore is configured to receive a feedthrough pin for coupling the connector element to an external component external to the enclosure structure. The enclosure structure also includes a feedthrough pin extending through the bore and a potting material disposed within the tapered portion surrounding the feedthrough pin.

Abstract: Embodiments include enclosures for protecting electronics such as circuit board and battery assemblies in high-pressure environments. Customized pressure distribution structures are positioned around the electronics. The pressure distribution structures include cavities that are sized to distribute pressure across the electronics in a predetermined manner based on known pressure tolerances of components or portions of the electronics. The pressure distribution structures may include various features such as vias for enhancing thermal conductivity. The enclosure may be sealed and surrounded by an envelope. Methods for manufacturing such enclosures are disclosed.

Abstract: Embodiments include enclosures for protecting electronics such as circuit board and battery assemblies in high-pressure environments. Customized pressure distribution structures are positioned around the electronics. The pressure distribution structures include cavities that are sized to distribute pressure across the electronics in a predetermined manner based on known pressure tolerances of components or portions of the electronics. The pressure distribution structures may include various features such as vias for enhancing thermal conductivity. The enclosure may be sealed and surrounded by an envelope. Methods for manufacturing such enclosures are disclosed.

Abstract: A system enabling safe manned and unmanned operations at extremely high altitudes (above 70,000 feet). The system utilizes a balloon launch system and parachute and/or parafoil recovery.

Abstract: A system enabling safe manned and unmanned operations at extremely high altitudes (above 70,000 feet). The system utilizes a balloon launch system and parachute and/or parafoil recovery.

Abstract: A method for surveying a body of water includes providing a plurality of vehicles to a body of water. Each the plurality of vehicles includes a vehicle body, an electric-propulsion motor system mounted on the vehicle body, a rechargeable battery, at least one sonar device attached to the vehicle body, and a first communication device. The method also includes submerging each of the plurality of vehicles in the body of water, surveying an area, using the at least one sonar device, to map the body of water and to determine a location of each of the plurality of vehicles, and determining, based on the surveying, that a target object is detected within the area. The method also includes resurfacing each of the plurality of vehicles and transferring data, using the first communication device, between at least two of the plurality of vehicles at the surface of the body of water.

Abstract: An enclosure structure suitable for high-pressure environments includes a feedthrough for coupling components housed within the enclosure structure to components external to the enclosure structure. The enclosure structure includes a housing comprising one or more cavities for receiving one or more electronic components within an interior of the housing and a bore through the housing. The one or more electronic components comprises a connector element and the bore comprises a non-tapered portion and a tapered portion. The non-tapered portion is proximate to the interior of the housing and the tapered portion is proximate to the exterior of the housing. The bore is configured to receive a feedthrough pin for coupling the connector element to an external component external to the enclosure structure. The enclosure structure also includes a feedthrough pin extending through the bore and a potting material disposed within the tapered portion surrounding the feedthrough pin.

Abstract: Embodiments include enclosures for protecting electronics such as circuit board and battery assemblies in high-pressure environments. Customized pressure distribution structures are positioned around the electronics. The pressure distribution structures include cavities that are sized to distribute pressure across the electronics in a predetermined manner based on known pressure tolerances of components or portions of the electronics. The pressure distribution structures may include various features such as vias for enhancing thermal conductivity. The enclosure may be sealed and surrounded by an envelope. Methods for manufacturing such enclosures are disclosed.

Abstract: A system enabling safe manned and unmanned operations at extremely high altitudes (above 70,000 feet). The system utilizes a balloon launch system and parachute and/or parafoil recovery.

Abstract: A system enabling safe manned and unmanned operations at extremely high altitudes (above 70,000 feet). The system utilizes a balloon launch system and parachute and/or parafoil recovery.

Abstract: A system enabling safe manned and unmanned operations at extremely high altitudes (above 70,000 feet). The system utilizes a balloon launch system and parachute and/or parafoil recovery.