Patents by Inventor Robert Allen Hill

Robert Allen Hill has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component termination and assembly by means of transient liquid phase sintering and polymer solder pastes
    Patent number: 8902565
    Abstract: A capacitor has first planer internal electrodes in electrical contact with a first external termination. Second planer internal electrodes are interleaved with the first planer internal electrodes wherein the second planer internal electrodes are in electrical contact with a second external termination. A dielectric is between the first planer internal electrodes and the second planer internal electrodes and at least one of the external terminations comprises a material selected from a polymer solder and a transient liquid phase sintering adhesive.
    Type: Grant
    Filed: May 24, 2011
    Date of Patent: December 2, 2014
    Assignee: Kemet Electronics Corporation
    Inventors: John E. McConnell, John Bultitude, Reggie Phillips, Robert Allen Hill, Garry L. Renner, Philip M. Lessner, Antony P. Chacko, Jeffrey Bell, Keith Brown
  • ELECTRONIC COMPONENT TERMINATION AND ASSEMBLY BY MEANS OF TRANSIENT LIQUID PHASE SINTERING AND POLYMER SOLDER PASTES
    Publication number: 20110292567
    Abstract: A capacitor has first planer internal electrodes in electrical contact with a first external termination. Second planer internal electrodes are interleaved with the first planer internal electrodes wherein the second planer internal electrodes are in electrical contact with a second external termination. A dielectric is between the first planer internal electrodes and the second planer internal electrodes and at least one of the external terminations comprises a material selected from a polymer solder and a transient liquid phase sintering adhesive.
    Type: Application
    Filed: May 24, 2011
    Publication date: December 1, 2011
    Applicant: Kemet Electronics Corporation
    Inventors: John E. McConnell, John Bultitude, Reggie Phillips, Robert Allen Hill, Garry L. Renner, Philip M. Lessner, Antony P. Chacko, Jeffrey Bell, Keith Brown