Patents by Inventor Robert Andrew Ramsbottom

Robert Andrew Ramsbottom has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11943869
    Abstract: An improved circuit board core material, and method of making the circuit board core material, is provided wherein the circuit board core material is particularly suitable for use in a circuit board. The circuit board core material comprises a laminate. The laminate comprises a prepreg layer with a first clad layer on the prepreg layer wherein the prepreg layer comprises a pocket. An electronic component is in the pocket wherein the electronic component comprises a first external termination and a second external termination. The first external termination is laminated to, and in electrical contact with, the first clad layer and said second external termination is in electrical contact with a conductor.
    Type: Grant
    Filed: February 1, 2021
    Date of Patent: March 26, 2024
    Assignee: KEMET Electronics Corporation
    Inventors: Brandon Summey, Peter A. Blais, Robert Andrew Ramsbottom, Jeffrey Poltorak, Courtney Elliott
  • Publication number: 20240096562
    Abstract: Provided herein is an improved capacitor. The capacitor comprises a capacitor body comprising an anode, a dielectric on the anode and a cathode on the dielectric. At least two anode wires are in electrical contact with the anode and extending from the capacitor body. At least one anode node, or an anode node remnant, wherein each anode wire of the anode wires is in electrical contact with at least one anode node or anode remnant. An encapsulant encases the capacitor body. At least a portion of the anode node, or anode node remnant, is in electrical connection with an external termination. A cathode external termination is in electrical contact with the cathode.
    Type: Application
    Filed: September 12, 2023
    Publication date: March 21, 2024
    Inventors: Brandon K. Summey, Jeffrey Poltorak, Robert Andrew Ramsbottom, Kevin A. Agosto
  • Patent number: 11869727
    Abstract: An improved capacitor, and method of making the capacitor, is described. The capacitor comprises an upper reinforced encapsulant layer and a lower reinforced encapsulant layer with a capacitive element between the upper reinforced encapsulant layer and lower reinforced encapsulant layer. The capacitive element comprises an anode, a dielectric on the anode and a cathode on the dielectric. An internal reinforced encapsulant layer is between the upper reinforced encapsulant layer and lower reinforced encapsulant layer.
    Type: Grant
    Filed: August 31, 2021
    Date of Patent: January 9, 2024
    Assignee: KEMET Electronics Corporation
    Inventors: Brandon Summey, Jeffrey Poltorak, Robert Andrew Ramsbottom, Kevin A. Agosto
  • Publication number: 20230276574
    Abstract: An improved circuit board core material, and method of making the circuit board core material, is provided wherein the circuit board core material is particularly suitable for use in a circuit board. The circuit board core material comprises a laminate. The laminate comprises a prepreg layer with a first clad layer on the prepreg layer wherein the prepreg layer comprises a pocket. An electronic component is in the pocket wherein the electronic component comprises a first external termination and a second external termination. The first external termination is laminated to, and in electrical contact with, the first clad layer and said second external termination is in electrical contact with a conductor.
    Type: Application
    Filed: April 17, 2023
    Publication date: August 31, 2023
    Inventors: Brandon Summey, Peter A. Blais, Robert Andrew Ramsbottom, Jeffrey Poltorak, Courtney Elliott
  • Publication number: 20230065146
    Abstract: An improved capacitor, and method of making the capacitor, is described. The capacitor comprises an upper reinforced encapsulant layer and a lower reinforced encapsulant layer with a capacitive element between the upper reinforced encapsulant layer and lower reinforced encapsulant layer. The capacitive element comprises an anode, a dielectric on the anode and a cathode on the dielectric. An internal reinforced encapsulant layer is between the upper reinforced encapsulant layer and lower reinforced encapsulant layer.
    Type: Application
    Filed: August 31, 2021
    Publication date: March 2, 2023
    Inventors: Brandon Summey, Jeffrey Poltorak, Robert Andrew Ramsbottom, Kevin A. Agosto
  • Publication number: 20210243897
    Abstract: An improved circuit board core material, and method of making the circuit board core material, is provided wherein the circuit board core material is particularly suitable for use in a circuit board. The circuit board core material comprises a laminate. The laminate comprises a prepreg layer with a first clad layer on the prepreg layer wherein the prepreg layer comprises a pocket. An electronic component is in the pocket wherein the electronic component comprises a first external termination and a second external termination. The first external termination is laminated to, and in electrical contact with, the first clad layer and said second external termination is in electrical contact with a conductor.
    Type: Application
    Filed: February 1, 2021
    Publication date: August 5, 2021
    Inventors: Brandon Summey, Peter A. Blais, Robert Andrew Ramsbottom, Jeffrey Poltorak, Courtney Elliott
  • Patent number: 10079113
    Abstract: An improved capacitor is provided wherein the capacitor has improved volumetric efficiency. The capacitor comprises a capacitive element comprising an anode, a dielectric on the anode and a cathode on the dielectric. An encapsulant at least partially encases the capacitive element wherein the encapsulant comprises at least one membrane between the capacitive element and an external surface of the encapsulant.
    Type: Grant
    Filed: December 16, 2016
    Date of Patent: September 18, 2018
    Assignee: KEMET Electronics Corporation
    Inventors: Brandon Summey, Jeffrey Poltorak, Robert Andrew Ramsbottom
  • Publication number: 20170178821
    Abstract: An improved capacitor is provided wherein the capacitor has improved volumetric efficiency. The capacitor comprises a capacitive element comprising an anode, a dielectric on the anode and a cathode on the dielectric. An encapsulant at least partially encases the capacitive element wherein the encapsulant comprises at least one membrane between the capacitive element and an external surface of the encapsulant.
    Type: Application
    Filed: December 16, 2016
    Publication date: June 22, 2017
    Inventors: Brandon Summey, Jeffrey Poltorak, Robert Andrew Ramsbottom