Patents by Inventor Robert Arthur Magee

Robert Arthur Magee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High I/O density MLC flat pack electronic component
    Patent number: 5790386
    Abstract: A flat pack electronic component having input/output pads thereon which are electronically connected to an outside device comprising a multilayer ceramic substrate having a plurality of individual electrical conductors in the substrate a chip secured to the substrate; and a plurality of input/output pads on at least one surface of the substrate at the periphery of said substrate with sites on the chip being electrically connected to the pads by one of the individual electrical conductors.
    Type: Grant
    Filed: April 4, 1996
    Date of Patent: August 4, 1998
    Assignee: International Business Machines Corporation
    Inventor: Robert Arthur Magee
  • Method of making high input/output density MLC flat pack
    Patent number: 5669136
    Abstract: A high density I/O flat pack electronic component is provided comprising a multilayer ceramic substrate having internal electrical conductors for electrically connecting I/O pads on the periphery of the component to a chip on the electronic component.
    Type: Grant
    Filed: October 10, 1995
    Date of Patent: September 23, 1997
    Assignee: International Business Machines Corporation
    Inventor: Robert Arthur Magee