Abstract: The present invention relates to shaker doors with solid cores and methods for making the same. The shaker doors contain different core materials at the recessed panel than the raise peripheral region to provide dimensional stability and reduced distortion when the doors are exposed to high humidity. The devices and methods also provide for easy assembly of solid core shaker doors, including fire rated doors.

Abstract: A hybrid Vapor Compression (VC) and Thermoelectric (TE) heat transport system is provided that maintains a set point temperature range of a chamber and includes a VC system and a TE system. The VC system includes a compressor, a condenser-evaporator connected to the compressor, a first valve connecting the compressor to an evaporator-condenser, and a second valve connecting the evaporator-condenser to a thermal expansion valve. The TE system includes TE modules, a first heat exchanger thermally connected with a first side of the TE modules which connects the first valve and the second valve, and a second heat exchanger thermally connected with a second side of the TE modules which connects the first valve and the second valve. In this way, the VC system and the TE system can be operated individually, in series, or in parallel to increase the efficiency of the hybrid VC and TE heat transport system.

Abstract: The present disclosure relates to systems, devices, and methods that augment a thermosiphon system with a thermally conductive matrix material to increase the surface area to volume ratio for heat conduction at a predetermined region(s) of the thermosiphon system while minimizing capillary forces that are isolated to those region(s). The thermosiphon system has tubing including a condenser region, an evaporator region, and an adiabatic region (e.g., a region between the condenser and evaporator regions). The tubing can contain a heat transport medium and can provide passive two-phase transport of the heat transport medium between the condenser and evaporator regions according to thermosiphon principles. The system also includes a thermally conductive matrix material contained in the condenser region and/or the evaporator region but not in the adiabatic region, such that the thermally conductive matrix material increases a surface area for heat transfer in the condenser region and/or the evaporator region.

Abstract: Embodiments of a hybrid fan and active heat pumping system are disclosed. In some embodiments, the hybrid fan and active heat pumping system comprises a fan assembly and an active heat pumping system comprises a heat pump. The active heat pumping system is integrated with the fan assembly and is operable to actively cool or heat air as the air passes through the fan assembly. In some embodiments, the heat pump comprised in the active heat pumping system is a solid-state heat pump, a vapor compression heat pump, or a Stirling Cycle heat pump.

Abstract: A hybrid Vapor Compression (VC) and Thermoelectric (TE) heat transport system is provided that maintains a set point temperature range of a chamber and includes a VC system and a TE system. The VC system includes a compressor, a condenser-evaporator connected to the compressor, a first valve connecting the compressor to an evaporator-condenser, and a second valve connecting the evaporator-condenser to a thermal expansion valve. The TE system includes TE modules, a first heat exchanger thermally connected with a first side of the TE modules which connects the first valve and the second valve, and a second heat exchanger thermally connected with a second side of the TE modules which connects the first valve and the second valve. In this way, the VC system and the TE system can be operated individually, in series, or in parallel to increase the efficiency of the hybrid VC and TE heat transport system.

Abstract: Embodiments of a hybrid fan and active heat pumping system are disclosed. In some embodiments, the hybrid fan and active heat pumping system comprises a fan assembly and an active heat pumping system comprises a heat pump. The active heat pumping system is integrated with the fan assembly and is operable to actively cool or heat air as the air passes through the fan assembly. In some embodiments, the heat pump comprised in the active heat pumping system is a solid-state heat pump, a vapor compression heat pump, or a Stirling Cycle heat pump.

Abstract: Embodiments described herein relate to a thermoelectric cooling system comprising a sealed condensing and evaporating system for the purpose of accepting heat into a heat pumping system. In some embodiments, the sealed condensing and evaporating system includes a heat sink and one or more thermosiphons. Each thermosiphon includes a first portion integrated with the heat sink and a second portion configured to thermally couple to a cold side heat exchange element of a heat exchanger.

Abstract: Embodiments of a hybrid fan and active heat pumping system are disclosed. In some embodiments, the hybrid fan and active heat pumping system comprises a fan assembly and an active heat pumping system comprises a heat pump. The active heat pumping system is integrated with the fan assembly and is operable to actively cool or heat air as the air passes through the fan assembly. In some embodiments, the heat pump comprised in the active heat pumping system is a solid-state heat pump, a vapor compression heat pump, or a Stirling Cycle heat pump.

Abstract: The present disclosure relates to systems, devices, and methods that augment a thermosiphon system with a thermally conductive matrix material to increase the surface area to volume ratio for heat conduction at a predetermined region(s) of the thermosiphon system while minimizing capillary forces that are isolated to those region(s). The thermosiphon system has tubing including a condenser region, an evaporator region, and an adiabatic region (e.g., a region between the condenser and evaporator regions). The tubing can contain a heat transport medium and can provide passive two-phase transport of the heat transport medium between the condenser and evaporator regions according to thermosiphon principles. The system also includes a thermally conductive matrix material contained in the condenser region and/or the evaporator region but not in the adiabatic region, such that the thermally conductive matrix material increases a surface area for heat transfer in the condenser region and/or the evaporator region.

Abstract: A refrigeration system includes a first circuit configured to circulate a first refrigerant. The first circuit includes an evaporator. The refrigeration system also includes a second circuit configured to circulate a second refrigerant. The second circuit includes a receiver associated with the evaporator such that the second refrigerant within the receiver is in a heat exchange relationship with the first refrigerant within the evaporator.

Abstract: Electronic circuitry provides protection for refrigeration machines by continuously monitoring supply voltage conditions and various other conditions. Information regarding abnormalities detected in the refrigeration machines or supply voltage is stored in a memory. The stored information may then be downloaded from the memory by a service technician. The electronic circuitry is universal and can therefore be used with various refrigeration machines. Further, the efficiency of a low temperature storage cabinet is enhanced by cycling the evaporator motor in comparison to a compressor percentage run time. Other factors are also considered in the running of the reach-in cabinet evaporator fan.

Abstract: A low-permeability barrier for waste disposal sites such as landfills and waste lagoons, and a method for constructing the same, includes a waste material. The waste material is stabilized to decrease the permeability characteristics of the waste material and may be further processed to improve the structural characteristics of the waste material and to prevent leaching of any leachable components. A method is provided for applying the waste material to the waste disposal site as a liner, interim cover, and/or final cover.