Patents by Inventor Robert B. Crispell

Robert B. Crispell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Plastic overmolded packages with mechancially decoupled lid attach attachment
    Patent number: 7632717
    Abstract: The specification describes a lidded MCM IC plastic overmolded package with a chimney-type heat sink. The lid is mechanically decoupled from the chimneys by a compliant conductive polymer plug.
    Type: Grant
    Filed: August 15, 2008
    Date of Patent: December 15, 2009
    Assignee: Agere Systems Inc.
    Inventors: Robert B. Crispell, Robert Scott Kistler, John W. Osenbach
  • Plastic overmolded packages with mechancially decoupled lid attach attachment
    Publication number: 20080311700
    Abstract: The specification describes a lidded MCM IC plastic overmolded package with a chimney-type heat sink. The lid is mechanically decoupled from the chimneys by a compliant conductive polymer plug.
    Type: Application
    Filed: August 15, 2008
    Publication date: December 18, 2008
    Inventors: Robert B. Crispell, Robert Scott Kistler, John W. Osenbach
  • Plastic overmolded packages with mechanically decoupled lid attach attachment
    Patent number: 7423341
    Abstract: The specification describes a lidded MCM IC plastic overmolded package with chimney-type heat sink. The lid is mechanically decoupled from the chimneys by a compliant conductive polymer plug.
    Type: Grant
    Filed: August 16, 2006
    Date of Patent: September 9, 2008
    Assignee: Agere Systems Inc.
    Inventors: Robert B. Crispell, Robert Scott Kistler, John W. Osenbach
  • Plastic overmolded packages with molded lid attachments
    Publication number: 20080042302
    Abstract: The specification describes lidded IC plastic overmolded packages with chimney-type heat sinks. The packages have mechanical hold-down structures in the package lids that, when overmold is applied, form complementary hold-down structures in the overmold.
    Type: Application
    Filed: August 16, 2006
    Publication date: February 21, 2008
    Inventors: Robert B. Crispell, Robert Scott Kistler, John W. Osenbach
  • Plastic overmolded packages with mechanically decoupled lid attach attachment
    Publication number: 20080042262
    Abstract: The specification describes a lidded MCM IC plastic overmolded package with chimney-type heat sink. The lid is mechanically decoupled from the chimneys by a compliant conductive polymer plug.
    Type: Application
    Filed: August 16, 2006
    Publication date: February 21, 2008
    Inventors: Robert B. Crispell, Robert Scott Kistler, John W. Osenbach
  • Lead structure for sealing package
    Patent number: 6559535
    Abstract: A sealing package for an integrated circuit chip including a lead structure with first lead members and second lead members. The first lead members are located proximate the corners of the sealing package and have two lead portions external to the sealing package and one lead portion internal to the sealing package. The second lead members are fanned out along the sides of the sealing package and have one lead portion internal to the sealing package and one lead portion external to the sealing package. Each first lead member adapted to provide a connection to ground for at least two sides of the sealing package. Each second lead member adapted to provide a connection between an integrated circuit chip internal to the sealing package and external circuitry.
    Type: Grant
    Filed: February 13, 2001
    Date of Patent: May 6, 2003
    Assignee: Agere Systems Inc.
    Inventors: Robert B. Crispell, Mark J. Nelson
  • Lead structure for sealing package
    Publication number: 20020109210
    Abstract: A sealing package for an integrated circuit chip including a lead structure with first lead members and second lead members. The first lead members are located proximate the corners of the sealing package and have two lead portions external to the sealing package and one lead portion internal to the sealing package. The second lead members are fanned out along the sides of the sealing package and have one lead portion internal to the sealing package and one lead portion external to the sealing package. Each first lead member adapted to provide a connection to ground for at least two sides of the sealing package. Each second lead member adapted to provide a connection between an integrated circuit chip internal to the sealing package and external circuitry.
    Type: Application
    Filed: February 13, 2001
    Publication date: August 15, 2002
    Inventors: Robert B. Crispell, Mark J. Nelson