Patents by Inventor Robert B. Currie

Robert B. Currie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Incorporation of boron complex into resin
    Patent number: 11618838
    Abstract: Complexes, compositions, articles of manufacture, and method for making the same are provided herein. In one embodiment, a borate-polyol complex may be prepared by reacting a boron-containing compound and a polyol to form a reaction mixture and then neutralizing the reaction mixture to form a neutralized borate-polyol complex. The neutralized borate-polyol complex may then be used in combination with polymeric resins to form adhesive products, among other material products, which products can be in manufacturing articles.
    Type: Grant
    Filed: April 13, 2017
    Date of Patent: April 4, 2023
    Assignee: HEXION INC.
    Inventors: Jaworski C. Capricho, Karen Theresa Love, Alex Bruce, Gary Byrom, Robert B. Currie
  • INCORPORATION OF BORON COMPLEX INTO RESIN
    Publication number: 20170298260
    Abstract: Complexes, compositions, articles of manufacture, and method for making the same are provided herein. In one embodiment, a borate-polyol complex may be prepared by reacting a boron-containing compound and a polyol to form a reaction mixture and then neutralizing the reaction mixture to form a neutralized borate-polyol complex. The neutralized borate-polyol complex may then be used in combination with polymeric resins to form adhesive products, among other material products, which products can be in manufacturing articles.
    Type: Application
    Filed: April 13, 2017
    Publication date: October 19, 2017
    Inventors: Jaworski C. CAPRICHO, Karen Theresa LOVE, Alex BRUCE, Gary BYROM, Robert B. CURRIE
  • Conditioning process for electroless plating of polyetherimides
    Patent number: 5441770
    Abstract: A process for promoting the adhesion of metal to thermoplastic substrates such as polyetherimides. The improvement comprises conditioning the substrate by treating with an inorganic hydroxide solution prior to subsequent steps of etching and deposition of a metal coating. Use of the conditioner promotes increased adhesion between the substrate and the metal without loss of flexural strength of the substrate throughout subsequent processing steps.
    Type: Grant
    Filed: August 14, 1991
    Date of Patent: August 15, 1995
    Assignee: Shipley Company Inc.
    Inventors: James E. Rychwalski, Paul J. Ciccolo, Robert B. Currie, Philip D. Knudsen