Patents by Inventor Robert B. Erley

Robert B. Erley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6250619
    Abstract: A clamp for clamping extendible supports in flexible tooling system includes three overlapping tapered collets surrounding the extendible support, with a set of ball bearings positioned between each of the collets. The middle collet is tapered in a direction opposite to that of the inner and outer collets, so that when the middle collet is pressed by springs into a gap between the inner and outer collet, the inner collet is forced against the extendible support, thereby clamping it. The ball bearings and the three collet assembly prevent the clamp from binding with thermal expansion so that the clamp releases when the force pressing the middle collet into the space between the inner and outer collet is removed. The springs maintain a sustained clamping force so the clamp does not release upon thermal expansion of it components.
    Type: Grant
    Filed: February 2, 1999
    Date of Patent: June 26, 2001
    Assignee: CNA Manufacturing Systems, Inc.
    Inventors: Larry R. Cook, Robert A. Starr, Robert B. Erley, Jeffrey A. Sterk
  • Patent number: 5099090
    Abstract: An apparatus and method are disclosed for preparing electrically conductive traces on a circuit board using an additive technology. The traces are directly written in a serial process with each trace being able to be individually insulated. The apparatus includes an extrusion element for extruding a first material and a stage. The stage is for holding the extrusion element and the circuit board in relative proximity and for producing relative motion between the extrusion element and the circuit board in order to extrude the first material onto the surface of the circuit board along preselected paths to produce the electrically conductive traces. According to the method of invention, a first polymerizable material is extruded onto a circuit substrate support along preselected paths to form traces, and the first polymerizable material is polymerized, the first polymerizable material being conductive after polymerization.
    Type: Grant
    Filed: January 11, 1990
    Date of Patent: March 24, 1992
    Assignee: Ariel Electronics, Inc.
    Inventors: G. Graham Allan, Gary A. DeBardi, Amar N. Neogi, Kenneth N. Bates, Robert B. Erley, Thomas L. Jacobs, Ramzi F. Hamade, Stephen J. Horne, Manu C. Patel, John E. Rose, Mark S. Schlosser, David P. Warden