Patents by Inventor Robert B. Kunesh

Robert B. Kunesh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High temperature co-fired ceramic and low temperature co-fired ceramic combination electronic package device and method
    Patent number: 6387507
    Abstract: A microelectronic multilayer ceramic package combines a high temperature cofired ceramic (HTCC) module or carrier with a low temperature cofired ceramic (LTCC) module or carrier using a bonding interface layer of electrically nonconductive epoxy having electrically conductive regions for providing electrical interconnection between carriers. The bonding layer also has regions of thermally conductive material for interfacing heat sources on one carrier with heat dissipators on another carrier. The bonding layer also has apertures which allow prominent structures extending from one carrier to pass though and into a corresponding cavity in another carrier.
    Type: Grant
    Filed: March 31, 2000
    Date of Patent: May 14, 2002
    Assignee: Polese Company, Inc.
    Inventors: Kenneth L. Jones, II, Robert B. Kunesh