Patents by Inventor Robert B. Vopat
Robert B. Vopat has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240064888Abstract: An apparatus may include a resonator chamber, arranged in a vacuum enclosure; an RF electrode assembly, arranged within the vacuum enclosure; and a resonator coil, disposed within the resonator chamber, the resonator coil having a high voltage end, directly connected to at least one RF electrode of the RF electrode assembly.Type: ApplicationFiled: November 4, 2022Publication date: February 22, 2024Applicant: Applied Materials, Inc.Inventors: Robert B. Vopat, Charles T. Carlson
-
Patent number: 11895766Abstract: Embodiments herein are directed to a linear accelerator assembly for an ion implanter. In some embodiments, a LINAC may include a coil resonator and a plurality of drift tubes coupled to the coil resonator by a set of flexible leads.Type: GrantFiled: October 15, 2021Date of Patent: February 6, 2024Assignee: Applied Materials, Inc.Inventors: David T. Blahnik, Charles T. Carlson, Robert B. Vopat, Frank Sinclair, Paul J. Murphy, Krag R. Senior
-
Patent number: 11710617Abstract: Embodiments herein are directed to a resonator for an ion implanter. In some embodiments, a resonator may include a housing, and a first coil and a second coil partially disposed within the housing. Each of the first and second coils may include a first end including an opening for receiving an ion beam, and a central section extending helically about a central axis, wherein the central axis is parallel to a beamline of the ion beam, and wherein an inner side of the central section has a flattened surface.Type: GrantFiled: July 16, 2021Date of Patent: July 25, 2023Assignee: APPLIED Materials, Inc.Inventors: Costel Biloiu, Michael Honan, Robert B. Vopat, David Blahnik, Charles T. Carlson, Frank Sinclair, Paul Murphy
-
Publication number: 20230120769Abstract: Embodiments herein are directed to a linear accelerator assembly for an ion implanter. In some embodiments, a LINAC may include a coil resonator and a plurality of drift tubes coupled to the coil resonator by a set of flexible leads.Type: ApplicationFiled: October 15, 2021Publication date: April 20, 2023Applicant: Applied Materials, Inc.Inventors: David T. Blahnik, Charles T. Carlson, Robert B. Vopat, Frank Sinclair, Paul J. Murphy, Krag R. Senior
-
Publication number: 20230119010Abstract: Embodiments herein are directed to a linear accelerator assembly for an ion implanter, wherein the linear accelerator includes a jacketed resonator coil. In some embodiments, a linear accelerator assembly may include a first fluid conduit and a coil resonator coupled to the first fluid conduit, wherein the coil resonator is operable to receive a first fluid via the first fluid conduit, wherein the coil resonator comprises a first coil conduit adjacent a second coil conduit, and wherein a first fluid channel defined by the first coil conduit is operable to receive the first fluid.Type: ApplicationFiled: October 20, 2021Publication date: April 20, 2023Applicant: Applied Materials, Inc.Inventors: Robert B. Vopat, Charles T. Carlson
-
Publication number: 20210343500Abstract: Embodiments herein are directed to a resonator for an ion implanter. In some embodiments, a resonator may include a housing, and a first coil and a second coil partially disposed within the housing. Each of the first and second coils may include a first end including an opening for receiving an ion beam, and a central section extending helically about a central axis, wherein the central axis is parallel to a beamline of the ion beam, and wherein an inner side of the central section has a flattened surface.Type: ApplicationFiled: July 16, 2021Publication date: November 4, 2021Applicant: APPLIED Materials, Inc.Inventors: Costel Biloiu, Michael Honan, Robert B. Vopat, David Blahnik, Charles T. Carlson, Frank Sinclair, Paul Murphy
-
Patent number: 11094504Abstract: Embodiments herein are directed to a resonator for an ion implanter. In some embodiments, a resonator may include a housing, and a first coil and a second coil partially disposed within the housing. Each of the first and second coils may include a first end including an opening for receiving an ion beam, and a central section extending helically about a central axis, wherein the central axis is parallel to a beamline of the ion beam, and wherein an inner side of the central section has a flattened surface.Type: GrantFiled: January 6, 2020Date of Patent: August 17, 2021Assignee: APPLIED Materials, Inc.Inventors: Costel Biloiu, Michael Honan, Robert B Vopat, David Blahnik, Charles T. Carlson, Frank Sinclair, Paul Murphy
-
Publication number: 20210210307Abstract: Embodiments herein are directed to a resonator for an ion implanter. In some embodiments, a resonator may include a housing, and a first coil and a second coil partially disposed within the housing. Each of the first and second coils may include a first end including an opening for receiving an ion beam, and a central section extending helically about a central axis, wherein the central axis is parallel to a beamline of the ion beam, and wherein an inner side of the central section has a flattened surface.Type: ApplicationFiled: January 6, 2020Publication date: July 8, 2021Applicant: APPLIED Materials, Inc.Inventors: Costel Biloiu, Michael Honan, Robert B. Vopat, David Blahnik, Charles T. Carlson, Frank Sinclair, Paul Murphy
-
Publication number: 20200386392Abstract: A heat exchange arrangement for a light emitting diode (LED) lamp module includes a base portion and a printed circuit board (PCB) portion. The base portion has first and second surfaces, the first surface comprising a plurality of channels. The PCB portion has first and second surfaces, the first surface configured to receive a plurality of LEDs thereon. The second surface of the PCB portion is coupled to the first surface of the base portion. The first surface of the base portion includes a plurality of open channels disposed therein, and the second surface of the PCB portion encloses said plurality of channels when the PCB portion is coupled to the base portion. The plurality of channels form cooling channels forming watertight passages for coolant fluid to flow through.Type: ApplicationFiled: June 10, 2019Publication date: December 10, 2020Applicant: APPLIED Materials, Inc.Inventors: Robert B. Vopat, Jason M. Schaller, Mitchell DiSanto
-
Patent number: 10586720Abstract: Various embodiments of wafer processing systems including batch load lock apparatus with temperature control capability are disclosed. The batch load lock apparatus includes a load lock body including first and second load lock openings, a lift assembly within the load lock body, the lift assembly including multiple wafer stations, each of the multiple wafer stations adapted to provide access to wafers through the first and second load lock openings, wherein the batch load lock apparatus includes temperature control capability (e.g., heating or cooling). Batch load lock apparatus is capable of transferring batches of wafers into and out of various processing chambers. Methods of operating the batch load lock apparatus are also provided, as are numerous other aspects.Type: GrantFiled: March 5, 2019Date of Patent: March 10, 2020Assignee: APPLIED MATERIALS, INC.Inventors: William T. Weaver, Joseph Yudovsky, Jason M. Schaller, Jeffrey C. Blahnik, Robert B. Vopat, Malcolm N. Daniel, Jr., Robert Mitchell
-
Publication number: 20190375105Abstract: Electronic device processing systems may include a mainframe housing having a transfer chamber, a first carousel assembly, a second carousel assembly, a first load lock, a second load lock, and a robot adapted to operate in the transfer chamber to exchange substrates between the first and second carousels and the first and second load locks. The robot may include first and second end effectors operable to extend and/or retract simultaneously or sequentially along substantially co-parallel lines of action. Methods and multi-axis robots for transporting substrates are described, as are numerous other aspects.Type: ApplicationFiled: August 21, 2019Publication date: December 12, 2019Inventors: William T. Weaver, Malcolm N. Daniel, JR., Robert B. Vopat, Jason M. Schaller, Jacob Newman, Dinesh Kanawade, Andrew J. Constant, Stephen C. Hickerson, Jeffrey C. Hudgens, Marvin L. Freeman
-
Patent number: 10427303Abstract: Electronic device processing systems may include a mainframe housing having a transfer chamber, a first carousel assembly, a second carousel assembly, a first load lock, a second load lock, and a robot adapted to operate in the transfer chamber to exchange substrates between the first and second carousels and the first and second load locks. The robot may include first and second end effectors operable to extend and/or retract simultaneously or sequentially along substantially co-parallel lines of action. Methods and multi-axis robots for transporting substrates are described, as are numerous other aspects.Type: GrantFiled: March 14, 2014Date of Patent: October 1, 2019Assignee: Applied Materials, Inc.Inventors: William T. Weaver, Malcolm N. Daniel, Jr., Robert B. Vopat, Jason M. Schaller, Jacob Newman, Dinesh Kanawade, Andrew J. Constant, Stephen C. Hickerson, Jeffrey C. Hudgens, Marvin L. Freeman
-
Publication number: 20190198368Abstract: Various embodiments of wafer processing systems including batch load lock apparatus with temperature control capability are disclosed. The batch load lock apparatus includes a load lock body including first and second load lock openings, a lift assembly within the load lock body, the lift assembly including multiple wafer stations, each of the multiple wafer stations adapted to provide access to wafers through the first and second load lock openings, wherein the batch load lock apparatus includes temperature control capability (e.g., heating or cooling). Batch load lock apparatus is capable of transferring batches of wafers into and out of various processing chambers. Methods of operating the batch load lock apparatus are also provided, as are numerous other aspects.Type: ApplicationFiled: March 5, 2019Publication date: June 27, 2019Inventors: William T. Weaver, Joseph Yudovsky, Jason M. Schaller, Jeffrey C. Blahnik, Robert B. Vopat, Malcolm N. Daniel, JR., Robert Mitchell
-
Patent number: 10256125Abstract: Various embodiments of wafer processing systems including batch load lock apparatus with temperature control capability are disclosed. The batch load lock apparatus includes a load lock body including first and second load lock openings, a lift assembly within the load lock body, the lift assembly including multiple wafer stations, each of the multiple wafer stations adapted to provide access to wafers through the first and second load lock openings, wherein the batch load lock apparatus includes temperature control capability (e.g., heating or cooling). Batch load lock apparatus is capable of transferring batches of wafers into and out of various processing chambers. Methods of operating the batch load lock apparatus are also provided, as are numerous other aspects.Type: GrantFiled: June 3, 2016Date of Patent: April 9, 2019Assignee: Applied Materials, Inc.Inventors: William T. Weaver, Joseph Yudovsky, Jason M. Schaller, Jeffrey C. Blahnik, Robert B. Vopat, Malcolm N. Daniel, Jr., Robert Mitchell
-
Patent number: 9496117Abstract: An adjustable mass-resolving slit assembly includes an aperture portion and an actuation portion. The aperture portion includes first and second shield members that define an aperture therebetween for receiving an ion beam during semiconductor processing operations. The actuation portion is coupled to the aperture portion and selectively and independently adjusts the position of the first and second shield members along first and second non-parallel axes. Adjusting the position of the first and second shield members along the first axis adjusts a width of the aperture. Adjusting the position of the first and second shield members along the second axis adjusts a region of the first and second shield members impinged by the ion beam. Methods for using the adjustable mass-resolving slit assembly are also disclosed.Type: GrantFiled: January 20, 2014Date of Patent: November 15, 2016Assignee: Varian Semiconductor Equipment Associates, Inc.Inventors: Jason M. Schaller, Robert B. Vopat
-
Publication number: 20160284578Abstract: Various embodiments of wafer processing systems including batch load lock apparatus with temperature control capability are disclosed. The batch load lock apparatus includes a load lock body including first and second load lock openings, a lift assembly within the load lock body, the lift assembly including multiple wafer stations, each of the multiple wafer stations adapted to provide access to wafers through the first and second load lock openings, wherein the batch load lock apparatus includes temperature control capability (e.g., heating or cooling). Batch load lock apparatus is capable of transferring batches of wafers into and out of various processing chambers. Methods of operating the batch load lock apparatus are also provided, as are numerous other aspects.Type: ApplicationFiled: June 3, 2016Publication date: September 29, 2016Inventors: William T. Weaver, Joseph Yudovsky, Jason M. Schaller, Jeffrey C. Blahnik, Robert B. Vopat, Malcolm N. Daniel, JR., Robert Mitchell
-
Patent number: 9378994Abstract: Various embodiments of batch load lock apparatus are disclosed. The batch load lock apparatus includes a load lock body including first and second load lock openings, a lift assembly within the load lock body, the lift assembly including multiple wafer stations, each of the multiple wafer stations adapted to provide access to wafers through the first and second load lock openings, wherein the batch load lock apparatus includes temperature control capability (e.g., heating or cooling). Batch load lock apparatus is capable of transferring batches of wafers into and out of various processing chambers. Systems including the batch load lock apparatus and methods of operating the batch load lock apparatus are also provided, as are numerous other aspects.Type: GrantFiled: March 14, 2014Date of Patent: June 28, 2016Assignee: Applied Materials, Inc.Inventors: William T. Weaver, Joseph Yudovsky, Jason M. Schaller, Jeffrey C. Blahnik, Robert B. Vopat, Malcolm N. Daniel, Jr., Robert Mitchell
-
Patent number: 9281222Abstract: A wafer handling system may include upper and lower linked robot arms that may move a wafer along a nonlinear trajectory between chambers of a semiconductor processing system. These features may result in a smaller footprint in which the semiconductor processing system may operate, smaller transfer chambers, smaller openings in process chambers, and smaller slit valves, while maintaining high wafer throughput. In some embodiments, simultaneous fast wafer swaps between two separate chambers, such as load locks and ALD (atomic layer deposition) carousels, may be provided. Methods of wafer handling are also provided, as are other aspects.Type: GrantFiled: March 10, 2014Date of Patent: March 8, 2016Assignee: Applied Materials, Inc.Inventors: William Tyler Weaver, Malcolm N. Daniel, Jr., Robert B. Vopat, Jason M. Schaller, Jacob Newman, Dinesh Kanawade, Andrew J. Constant, Stephen C. Hickerson, Jeffrey C. Hudgens, Marvin L. Freeman
-
Patent number: 9214369Abstract: An apparatus for dynamically adjusting the pitch between substrates in a substrate stack comprises first and second lift portions. The first lift portion supports a first group of the plurality of substrates, and the second lift portion supports a second group of the plurality of substrates. The first and second lift portions are operable to move the first and second groups of substrates in a first direction independently from each other. This independent movement enables the pitch, or spacing, between adjacent substrates to be dynamically adjusted so that an end effector of a robot can be positioned between such adjacent substrates to pick one of the substrates without inadvertently engaging another substrate that is not being picked. Other embodiments are disclosed.Type: GrantFiled: November 1, 2013Date of Patent: December 15, 2015Assignee: Varian Semiconductor Equipment Associates, Inc.Inventors: Robert B. Vopat, Jason M. Schaller, Jeffrey Charles Blahnik, Malcolm N. Daniel, Jr.
-
Publication number: 20150206701Abstract: An adjustable mass-resolving slit assembly includes an aperture portion and an actuation portion. The aperture portion includes first and second shield members that define an aperture therebetween for receiving an ion beam during semiconductor processing operations. The actuation portion is coupled to the aperture portion and selectively and independently adjusts the position of the first and second shield members along first and second non-parallel axes. Adjusting the position of the first and second shield members along the first axis adjusts a width of the aperture. Adjusting the position of the first and second shield members along the second axis adjusts a region of the first and second shield members impinged by the ion beam. Methods for using the adjustable mass-resolving slit assembly are also disclosed.Type: ApplicationFiled: January 20, 2014Publication date: July 23, 2015Applicant: Varian Semiconductor Equipment Associates, Inc.Inventors: Jason M. Schaller, Robert B. Vopat