Abstract: A method for mounting a film, used to fabricate a mask for use in screening an electronic device, to a common carrier frame. The common carrier frame has an outer edge along an outer periphery and an opening in a central portion of the frame. The method includes applying external pressure to the frame outer edge to compress the frame inward and reduce the opening, securing a film to the frame, the film covering the frame opening, and releasing the pressure on the frame to expand the opening and place the film in tension.

Abstract: A method for mounting a film, used to fabricate a mask for use in screening an electronic device, to a common carrier frame. The common carrier frame has an outer edge along an outer periphery and an opening in a central portion of the frame. The method includes applying external pressure to the frame outer edge to compress the frame inward and reduce the opening, securing a film to the frame, the film covering the frame opening, and releasing the pressure on the frame to expand the opening and place the film in tension.

Abstract: Disclosed are embodiments of a universal electroplating rack and method of using the rack. The universal electroplating rack comprises a main body adapted to accommodate and electrically connect to one or more customized inserts. Each customized insert is adapted to accommodate and electrically connect to a single workpiece. Additionally, both the main body and the customized insert(s) can comprise thief plates configured to improve plating uniformity across the plating surface area of the workpiece(s). Such a universal plating rack ensures a constant plating surface area regardless of workpiece size by varying the dimensions of the customized insert(s) so that universal processing parameters can be used for all workpieces. Consequently, for each new product developed, the universal electroplating racks of the invention will effectively reduce introduction costs, will avoid the need to qualify new electroplating process parameters (e.g., cycle time), and will effectively reduce lead time required.

Abstract: A method for the rapid removal of unwanted debris from a substrate such as an electronic component like unfired greensheets employs a high velocity straight through brush design. This brush employs a large chamber housing and vacuum slots, which create a high velocity vacuum draw for the rapid removal of unwanted ceramic materials. The brush is retained in a brush retainer that preferably utilizes dovetail slots to facilitate easy insertion and removal from the brush retainer.

Abstract: A method for mounting a film, used to fabricate a mask for use in screening an electronic device, to a common carrier frame. The common carrier frame has an outer edge along an outer periphery and an opening in a central portion of the frame. The method includes applying external pressure to the frame outer edge to compress the frame inward and reduce the opening, securing a film to the frame, the film covering the frame opening, and releasing the pressure on the frame to expand the opening and place the film in tension.