Abstract: The present invention features methods and apparatuses for sealing tiled, flat-panel displays (FPDs). Tile edges corresponding with the display's perimeter edges are designed with a wide seal. Interior edges, however, have narrow seals in order to maintain the desired, constant, pixel pitch across tile boundaries. In some cases, this invention applies specifically to arrays of tiles 2×2 or less, and, in other cases, to N×M arrays, where N and M are any integer numbers. The tiles are enclosed with top and bottom glass plates, which are sealed with an adhesive bond to the tiles on the outside perimeter of the tiled display. Vertical seams (where tiles meet at the perimeter of the FPD) are sealed with a small amount of polymer. The seal may be constructed between a cover plate and a back plate, sandwiching the tiles. The AMLCD edges may be coated with either a non-permeable material or a polymer having an extremely low permeability (for example, Parylene™).

Abstract: The present invention features methods and apparatuses for sealing tiled, flat-panel displays (FPDs). Tile edges corresponding with the display's perimeter edges are designed with a wide seal. Interior edges, however, have narrow seals in order to maintain the desired, constant, pixel pitch across tile boundaries. In some cases, this invention applies specifically to arrays of tiles 2×2 or less, and, in other cases, to N×M arrays, where N and M are any integer numbers. The tiles are enclosed with top and bottom glass plates, which are sealed with an adhesive bond to the tiles on the outside perimeter of the tiled display. Vertical seams (where tiles meet at the perimeter of the FPD) are sealed with a small amount of polymer. The seal may be constructed between a cover plate and a back plate, sandwiching the tiles. The AMLCD edges may be coated with either a non-permeable material or a polymer having an extremely low permeability (for example, Parylene™).

Abstract: The present invention features an apparatus and method for collimating light for use with a tiled, flat-panel display having a seamless appearance (i.e., having visually imperceptible seams). A novel, multi-cell, collimation lattice is placed behind the bottom mask of the tiled, flat-panel display assembly, but in front of an illumination source. The lattice is formed from a thin, non-reflective material, so that the acceptable light passing through the lattice is not "blocked", but the unwanted (off-axis) light impinges upon the lattice cell walls and is absorbed.

Abstract: The present invention features methods for assembling arrays of AMLCD tiles into tiled, flat-panel displays having visually imperceptible seams between the tiles. Flowable, polymeric adhesive layers are used between a back substrate, various optical components such as masks and polarizers, the tiles, and a front cover plate. Several unique techniques for establishing and maintaining tile-to-tile registration during assembly of the tiled, flat-panel display are presented.

Abstract: The present invention features methods for assembling arrays of AMLCD tiles into tiled, flat-panel displays having visually imperceptible seams between the tiles. Flowable, polymeric adhesive layers are used between a back substrate, various optical components such as masks and polarizers, the tiles, and a front cover plate. Several unique techniques for establishing and maintaining tile-to-tile registration during assembly of the tiled, flat-panel display are presented.

Abstract: The present invention features methods and apparatuses for sealing tiled, flat-panel displays (FPDs). Tile edges corresponding with the display's perimeter edges are designed with a wide seal. Interior edges, however, have narrow seals in order to maintain the desired, constant, pixel pitch across tile boundaries. In some cases, this invention applies specifically to arrays of tiles 2.times.2 or less, and, in other cases, to N.times.M arrays, where N and M are any integer numbers. The tiles are enclosed with top and bottom glass plates, which are sealed with an adhesive bond to the tiles on the outside perimeter of the tiled display. Vertical seams (where tiles meet at the perimeter of the FPD) are sealed with a small amount of polymer. The seal may be constructed between a cover plate and a back plate, sandwiching the tiles. The AMLCD edges may be coated with either a non-permeable material or a polymer having an extremely low permeability (for example, Parylene.TM.).

Abstract: An electrical connector for providing electrical connection to a substrate having contact elements thereon (e.g., a printed circuit board) wherein torsional contacts are utilized. The contacts, actuated by a vertically moving, slidable member (e.g., a cam plate) and horizontally moving actuator (e.g., a linear cam), resume a normal, twisted configuration to effect such connection with the respective contact elements. Each contact, preferably metallic (e.g., beryllium copper), includes a curvilinear edge segment while each contact element (e.g., plated copper wire) in turn includes a curvilinear contacting surface, these two members thus providing a single point form of contact while assuring effective wiping motion to remove undesirable contaminants, debris, etc. which may be located thereon. Relatively high contact forces (e.g., 200,000 PSI) are possible using the invention.

Abstract: A zero insertion force connector system with a top entry for improved interconnection with a component card and a component card positioner for providing an interconnectable structure that is useable with adjacent apparatus. The zero insertion force connector system includes a housing with a card guide channel having a top entry and a sliding cam system for interlocking the component card positioner and the component card in an improved manner. The component card positioner includes a card positioning structure with a tab cover structure and a card guide channel positioner for interaction with the sliding cam system of the zero insertion force connector system to properly interconnect the component card. The component card includes card contact tabs protected by a tab cover structure in the component card positioner and related to connector contacts positioned in the housing of the connector.

Abstract: An integrated circuit module to printed circuit board interconnection system wherein the board has circuit pads to which spring contacts have one of their ends soldered to the pads. The module has circuit pads on one surface thereof and a pivotal connection is provided for loading the module onto the circuit board whereby the opposite ends of the spring contacts engage the circuit pads on the module with a wiping action and are retained in engagement therewith.

Abstract: A zero insertion force connector and printed circuit card retention and polarization arrangement wherein the card has circuit tabs along one edge and the connector has spring contacts which engage the tabs with a wiping action when they are closed. A pin is provided at one end of the connector and a pin slot at the opposite end. A pin slot is provided at one end of the card and a pin at the opposite end, the pin and pin slot in the connector and pin slot and pin in the card being arranged to respectively come into engagement when the card is inserted into the connector to prevent movement of the card when the connector spring contacts are closed.

Abstract: A pluggable module actuation and retention device comprising a spring housing fastened to a printed circuit board and having openings which contain a matrix of contact springs extending from said board. A bail retaining latch is fastened to the spring housing and an actuator bail is pivotally mounted on the spring housing and has an opening which overlies the openings in the spring housing. A module to be actuated and retained has a matrix of pins corresponding to the matrix of contact springs and is provided with actuator tabs. Actuator tab mating means are provided on the spring housing for engaging the module actuator tabs when a module is inserted through the opening in the actuator bail to align the matrix of pins with the matrix of contact springs. Camming means on the actuator bail are effective when the bail is pivoted in one direction to engage the actuator tabs and slide the module to move the matrix of pins on the module into engagement with the matrix of contact springs.

Abstract: An improved arrangement for cooling a module packaged semiconductor integrated circuit chip having heat generating microcircuits thereon is disclosed. Enhanced cooling over prior art techniques is achieved by utilizing an interfacial layer of liquid metal alloy coated metallic dendrites, which layer is sandwiched between two facing surfaces of the chip and a heat sink. Appropriate biasing means are also provided to urge the dendritic projections into piercing engagement with the liquid metal alloy layer, the biasing means being thermally coupled between the heat sink and the module container to thereby aid in forming unitary heat transfer path from the chip to the module container. The biasing means are adapted to provide sufficient force to cause the dendritic projections to engage and retain the liquid metal alloy layer and to non-destructively force the layer to fill all available space between the chip and the heat sink.

Abstract: Plural first and second mating members are simultaneously interconnected in mutually exclusive pairs by apparatus which includes a cam mechanism that in addition self-relieves any undesirable stresses when present in the apparatus as a result of interconnecting the plural mating members. In the preferred embodiment, the mating members are male electrical connector pins and co-acting female bifurcated spring type connectors.