Patents by Inventor Robert Ballenger

Robert Ballenger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6774612
    Abstract: An apparatus and method for significantly reducing the initial set-point error and voltage margining accuracy of a DC/DC converter. The initial set-point error is reduced by utilizing the remote sense lines of a DC/DC converter to sense the voltage from the DC/DC converter that is actually applied to the load. A power supply controller having inputs coupled to the remote sense lines compares the sensed voltage to a precision voltage reference and provides an output voltage to the TRIM input of the DC/DC converter. The apparatus and method may be implemented in a voltage supply margining test set-up to test the functionality of an electronic device while the DC/DC converter supplies a voltage to the device that is at either the upper or lower margin of an acceptable supply voltage range of the device.
    Type: Grant
    Filed: October 18, 2002
    Date of Patent: August 10, 2004
    Assignee: Cisco Technology, Inc.
    Inventors: Robert Ballenger, Kan Chiu Seto
  • Patent number: 6646886
    Abstract: A multi-layer printed circuit board (PCB) has a plated through hole for receiving a pin of a component. The plated through hole passes through all layers of the PCB and includes a first conductive portion on a first surface of the PCB and a second conductive portion on a second surface of the PCB. At least one layer of the PCB includes a planar conductive material disposed over a planar insulating material. The conductive material surrounds the plated through hole and is separated therefrom by a gap.
    Type: Grant
    Filed: April 12, 2002
    Date of Patent: November 11, 2003
    Assignee: Cisco Technology, Inc.
    Inventors: David A. Popovich, Robert Ballenger
  • Patent number: 6621705
    Abstract: A printed circuit board (PCB) has at least a first surface. A patterned electrically and thermally conductive layer is disposed on the first surface. A surface mount device (SMD) is disposed on an area of the layer and is attached thereto with solder. Heatsink elements, each including at least one flat surface, are placed by a pick and place assembly robot and permanently attached to the area with solder.
    Type: Grant
    Filed: April 12, 2002
    Date of Patent: September 16, 2003
    Assignee: Cisco Technology, Inc.
    Inventors: Robert Ballenger, David A. Popovich, Yida Zou