Abstract: Poly-o-hydroxyamides include binaphthyl substituents as repeating units. The poly-o-hydroxyamides can be cyclized to give the polybenzoxazole by heating. Pore formation occurs, so that a dielectric having a very low dielectric constant k of less than 2.5 is obtained.

Abstract: Poly-o-hydroxyamides include binaphthyl substituents as repeating units. The poly-o-hydroxyamides can be cyclized to give the polybenzoxazole by heating. Pore formation occurs, so that a dielectric having a very low dielectric constant k of less than 2.5 is obtained.

Abstract: The invention relates to novel organosilicon compounds comprising ammonium groups, said compounds being soluble in isopropanol or diethylene glycol monobutyl ether, and containing: a) at least one structural unit of general formula (I) wherein R2 represents a bivalent organic radical containing a hydroxyl group which is conditioned by a ring opening of an epoxy group; R3 represents a hydrogen atom or a monovalent hydrocarbon radical comprising 1 to 60 carbon atoms per radical, and can be split or substituted by at least one separate heteroatom chosen from the group consisting of nitrogen, oxygen, sulphur or halogen atoms; R4 represents a bivalent hydrocarbon radical comprising 1 to 10 carbon atoms per radical; n represents 0 or a whole number from 1 to 10; m represents a whole number from 1 to the total number of nitrogen atoms in (I); x represents 0 or 1; and X− represents an anion, b) at least one siloxane unit of general formula (II), and c) at least two siloxane units of general formula (III) wherei

Abstract: The invention relates to novel organosilicon compounds comprising ammonium groups, said compounds being soluble in isopropanol or diethylene glycol monobutyl ether, and containing: a) at least one structural unit of general formula (I) wherein R2 represents a bivalent organic radical containing a hydroxyl group which is conditioned by a ring opening of an epoxy group; R3 represents a hydrogen atom or a monovalent hydrocarbon radical comprising 1 to 60 carbon atoms per radical, and can be split or substituted by at least one separate heteroatom chosen from the group consisting of nitrogen, oxygen, sulphur or halogen atoms; R4 represents a bivalent hydrocarbon radical comprising 1 to 10 carbon atoms per radical; n represents 0 or a whole number from 1 to 10; m represents a whole number from 1 to the total number of nitrogen atoms in (I); x represents 0 or 1; and X-represents an anion, b) at least one siloxane unit of general formula (II), and c) at least two siloxane units of general formula (III) wherein R, R1

Abstract: Poly-o-hydroxyamides include binaphthyl substituents as repeating units. The poly-o-hydroxyamides can be cyclized to give the polybenzoxazole by heating. Pore formation occurs, so that a dielectric having a very low dielectric constant k of less than 2.5 is obtained.

Abstract: The invention relates to new, cross-linkable compounds containing (A1) linear organopolysiloxanes with aliphatically unsaturated hydrocarbon radicals, said organopolysiloxanes being of general formula (I) R1aR3-aSiO(R2SiO)c[R2Si—Y—SiR2O(R2SiO)c]dSiR3-bR1b, wherein R can be the same or different, and represents a monovalent, optionally halogenated hydrocarbon radical which is free of terminal aliphatic carbon—carbon multiple bonds, R1 represents a monovalent aliphatically unsaturated hydrocarbon radical, Y represents a bivalent organic radical which is free of terminal aliphatic carbon—carbon multiple bonds, a is 0 or 1, b is 0 or 1, and the sum of a+b per molecule is 1 or 2, c is a whole number to the value of 1 to 1000, d is 0 or a whole number to the value of 1 to 10, and optionally, (A2) MQ silicone resins which are soluble in (A1), on the condition that if MQ silicone resins (A2) are not used, the sum of a+b in the formula (I) is 1.3 to 1.

Abstract: The invention relates to novel polymeric organosilicon compounds comprising hydrocarbon radicals with at least one aliphatic carbon-carbon double bond in a terminal position. To produce these compounds, (A) compounds containing at least one aliphatic carbon-carbon double bond per molecule, in a terminal position, are reacted with (B) oligomeric or polymeric organosilicon compounds containing units of the general formula R1R2SiO1/2 and units of the general formula HRSiO and/or HSiO3/2 and possibly units of the general formula R2SiO, where R is a monovalent, possibly substituted, hydrocarbon radical with between 1 and 18 carbon atoms per radical, which is free of aliphatic carbon-carbon double bonds, and R1 is a monovalent hydrocarbon radical with between 1 and 18 carbon atoms per radical which has at least one aliphatic carbon-carbon double bond in a terminal position, subject to the condition that the sum of the units HRSiO and R1R2SiO1/2 on average is greater than 2.

Abstract: The present invention provides crosslinkable compositions comprising(A) an organosilicon compound having radicals containing aliphatic carbon-carbon multiple bonds,(B) an organosilicon compound having Si-bonded hydrogen atoms,(C) a catalyst which promotes the addition of Si-bonded hydrogen onto aliphatic multiple bond, and optionally(D) an agent which retards the addition of Si-bonded hydrogen onto aliphatic multiple bond at room temperatureand to the use of the crosslinkable compositions for producing coatings which repel tacky substances.The present invention also relates to organosilicon compounds having Si-bonded hydrogen atoms, and to a process for their preparation.