Abstract: A method of laser micro-machining, by means of a laser, a work piece (31) of the type described comprising the steps of: locating the workpiece on a carrier forming a part of a transport system whereby the carrier can be displaced along a path (P) parallel to an X-axis of the workpiece, a Y-axis lying transverse the path, and a Z-axis lying transverse the path; focusing an image generated by means of an output beam from the laser at a working datum position (A) defined relative to the path which path is established by means of the transport system to traverse the first datum position; a plane defined by the X- and Y-Axis lying substantially perpendicular to the output beam; and displacing the workpiece along the path by way of the transport system so as to enable the work-piece to be subject to micro-machining by way of the laser characterized by the steps of: maintaining distance between the datum position and a current first surface position of the work-piece in the vicinity of the datum position; and varyi

Abstract: A method for accurately laser scribing lines on a panel utilising a laser beam scanner unit (13) including an optical system and a scanner lens. The unit (13) moves a laser beam (12) in a first direction (X), to scribe sections of lines (15) on the panel (11) that are a fraction of the total line length required and then moving the unit (13) continuously with respect to the panel (11) in a second direction (Y), perpendicular to the first direction (X), to form a band (16) of scribe lines. The scanner unit (13) is positioned so that the starting position of scribe lines in each band next to be processed overlap exactly the finishing position ends of scribe lines in the last band that has been processed so that all scribe lines interconnect. The method repeats the using and moving steps to form a plurality of parallel bands of scribe lines which cover the area of the panel.

Abstract: Laser scribing can be performed on a workpiece such as a substrate with layers formed thereon for use in a solar cell without need to move the workpiece during the scribing process. A series of lasers can be used to concurrently remove material from multiple positions on the workpiece. These laser outputs are directed to the workpiece using an optical system partially attached to a gantry. The gantry can be moved longitudinally and the portion of the optical system attached to the gantry can be moved laterally so that the combined outputs of all lasers can be directed to substantially any position on the workpiece without moving the workpiece.

Abstract: A method for accurately laser scribing lines on a panel utilising a laser beam scanner unit (13) including an optical system and a scanner lens. The unit (13) moves a laser beam (12) in a first direction (X), to scribe sections of lines (15) on the panel (11) that are a fraction of the total line length required and then moving the unit (13) continuously with respect to the panel (11) in a second direction (Y), perpendicular to the first direction (X), to form a band (16) of scribe lines. The scanner unit (13) is positioned so that the starting position of scribe lines in each band next to be processed overlap exactly the finishing position ends of scribe lines in the last band that has been processed so that all scribe lines interconnect. The method repeats the using and moving steps to form a plurality of parallel bands of scribe lines which cover the area of the panel.

Abstract: A method of laser micro-machining, by means of a laser, a work piece (31) of the type described comprising the steps of: locating the workpiece on a carrier forming a part of a transport system whereby the carrier can be displaced along a path (P) parallel to an X-axis of the workpiece, a Y-axis lying transverse the path, and a Z-axis lying transverse the path; focusing an image generated by means of an output beam from the laser at a working datum position (A) defined relative to the path which path is established by means of the transport system to traverse the first datum position; a plane defined by the X- and Y-Axis lying substantially perpendicular to the output beam; and displacing the workpiece along the path by way of the transport system so as to enable the work-piece to be subject to micro-machining by way of the laser characterized by the steps of: maintaining distance between the datum position and a current first surface position of the work-piece in the vicinity of the datum position; and varyi

Abstract: A method of laser micro-machining a work piece, with a laser, including the steps of: locating the workpiece on a carrier forming a part of a transport system, the carrier can be displaced along a path parallel to an X-axis of the workpiece, a Y-axis lying transverse the path, and a Z-axis lying transverse the path; focusing an image generated by an output beam from the laser at a working datum position defined relative to the path which path is established by the transport system to traverse the first datum position; a plane defined by the X- and Y-axis lying substantially perpendicular to the output beam; and displacing the workpiece along the path by way of the transport system so as to enable the work-piece to be subject to micro-machining by way of the laser.

Abstract: A method of laser micro-machining a work piece, with a laser, including the steps of: locating the workpiece on a carrier forming a part of a transport system, the carrier can be displaced along a path parallel to an X-axis of the workpiece, a Y-axis lying transverse the path, and a Z-axis lying transverse the path; focusing an image generated by an output beam from the laser at a working datum position defined relative to the path which path is established by the transport system to traverse the first datum position; a plane defined by the X- and Y-axis lying substantially perpendicular to the output beam; and displacing the workpiece along the path by way of the transport system so as to enable the work-piece to be subject to micro-machining by way of the laser.