Abstract: A sensor that is responsive to at least two distinct spectral bands, e.g., infrared radiation and ultraviolet or infrared and visible light makes use of the junction of a diode-based bolometer as a photocell in addition to its temperature dependence for detecting infrared radiation. More specifically the diode bolometer is arranged to work in the conventional manner, in that an electrical characteristic of the diode, e.g., the temperature dependence of its current-voltage (I-V) curve, is used as the basis for measuring temperature, and hence, infrared radiation. Additionally, the same diode may be operated as a photocell to detect radiation that is capable of interacting with the electrons in the junction of the diode. This may be achieved by detecting a change in the operating point of the diode based given its present biasing in response to noninfrared radiation incident upon the diode.

Abstract: A packaged MEMS device containing the micro mirrors has mounted on it at least two distinct integrated circuit chips, at least one of which contains the low-voltage digital-to-analog converters and at least one of which contains the high-voltage amplifiers. The integrated circuit chips may be mounted directly to the MEMS package, or they may be indirectly mounted thereto, e.g., by being directly mounted to a multi-chip module which is in turn mounted on the package. Thus, the MEMS package is employed in a dual role, 1) that of package for the MEMS device and 2) the role of a backplane in that it contains mounting places and the wires interconnecting the MEMS device and chips or modules containing the low-voltage digital-to-analog converters and the high-voltage amplifiers.