Abstract: A rotor for an electric machine, in particular for a brushless DC motor, includes a hollow cylindrical main body that is rotationally fixed to a machine shaft. The main body includes a plurality of radial protrusions arranged over its casing surface in the circumferential direction and in the axial direction and offset relative to one another by a defined offset angle. Each radial protrusion is limited over an angular range, which is smaller than the offset angle. The hollow cylindrical main body is permanently connected, in particular adhered, to a hollow cylindrical body surrounding same in the circumferential direction by way of a joining process. A method for producing a rotor for an electric machine is also disclosed.

Abstract: An axial flux machine, in particular a single-sided axial flux motor, for an electrical machining device, has a machine shaft, in particular a motor shaft, a disc-shaped stator, a disc-shaped rotor which is arranged adjacent to the stator in the axial direction of the machine shaft. The stator is formed as a winding carrier for at least one stator winding and the rotor, which is connected to the machine shaft in a rotationally fixed manner, can be set in a rotational movement relative to the stator, and with a housing for receiving the stator and the rotor. A first bearing, in particular a fixed bearing, is integrated directly into the winding support and/or into a first stator yoke for mounting the machine shaft. An electrical processing device with an axial flux machine is also disclosed.

Abstract: At least one semiconductor component is packaged by covering at least one partial surface of the at least one semiconductor component with at least one chemically or physically dissoluble sacrificial material; surrounding the at least one semiconductor component at least partially with a photoablatable packaging material; exposing the sacrificial material on the at least one partial surface of the at least one semiconductor component at least partially by forming at least one trench through at least the packaging material using a light beam; and exposing the at least one partial surface of the at least one semiconductor component at least partially by at least partially removing the previously exposed sacrificial material using a chemical or physical removal method to which the packaging material has a higher resistance than the sacrificial material.

Abstract: At least one semiconductor component is packaged by covering at least one partial surface of the at least one semiconductor component with at least one chemically or physically dissoluble sacrificial material; surrounding the at least one semiconductor component at least partially with a photoablatable packaging material; exposing the sacrificial material on the at least one partial surface of the at least one semiconductor component at least partially by forming at least one trench through at least the packaging material using a light beam; and exposing the at least one partial surface of the at least one semiconductor component at least partially by at least partially removing the previously exposed sacrificial material using a chemical or physical removal method to which the packaging material has a higher resistance than the sacrificial material.