Abstract: A hot melt sealant/adhesive composition is provided which comprises the following components—Component A. a siloxane polymer composition comprising a) An organopolysiloxane which may comprise not less than two groups selected from i) silicon bonded alkenyl groups or ii) silicon-bonded hydroxyl groups and/or silicon bonded hydrolysable groups b) one or more fillers; and a cure system comprising c) a suitable catalyst and where required d) a suitable cross-linker adapted to react with component (a), catalysed with component (c); and either or both of components B. and C. wherein: —B. is one or more hot melt resins; and C. is one or more waxes having a melt temperature of between 40 and 200° C.; and/or an organic resin having a viscosity average molecular weight of from 200 to 6000 and a softening point of from 0° C. and 150° C.; wherein the total amount of components B and/or C in the composition is from 2 to 60% by weight of the whole composition.

Abstract: A hot melt sealant/adhesive composition is provided which comprises the following components—Component A. a siloxane polymer composition comprising a) An organopolysiloxane which may comprise not less than two groups selected from i) silicon bonded alkenyl groups or ii) silicon-bonded hydroxyl groups and/or silicon bonded hydrolysable groups b) one or more fillers; and a cure system comprising c) a suitable catalyst and where required d) a suitable cross-linker adapted to react with component (a), catalysed with component (c); and either or both of components B. and C. wherein:—B. is one or more hot melt resins; and C. is one or more waxes having a melt temperature of between 40 and 200° C.; and/or an organic resin having a viscosity average molecular weight of from 200 to 6000 and a softening point of from O° C. and 15O° C.; wherein the total amount of components B and/or C in the composition is from 2 to 60% by weight of the whole composition.