Patents by Inventor Robert Borwick

Robert Borwick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070231911
    Abstract: A method for diagnosing a fluid includes sensing a property of the fluid and the temperature of the fluid at the time the property is sensed, then determining the status of the fluid from the sensing. The sample volume may be small in comparison to the total fluid volume.
    Type: Application
    Filed: March 31, 2006
    Publication date: October 4, 2007
    Inventors: Jeffrey DeNatale, Robert Borwick, Philip Stupar, Martin Kendig
  • Publication number: 20070195439
    Abstract: A micromirror apparatus includes a device layer having a recess, a multilayer thin-film dielectric reflector coupled to and structurally supported by the device layer on the opposite side of the device layer from said recess, and a stress compensator seated in the recess, with the stress compensator operable to resist device layer bending moments resulting from intrinsic and thermal mismatch stresses between the multilayer thin-film dielectric reflector and the device layer.
    Type: Application
    Filed: February 22, 2006
    Publication date: August 23, 2007
    Inventors: Jeffrey DeNatale, Philip Stupar, Chialun Tsai, Robert Borwick
  • Publication number: 20070062261
    Abstract: A microelectromechanical (MEM) fluid health sensing device comprises a viscosity sensor which provides an output that varies with the viscosity of a fluid in which it is immersed, and at least one other sensor which provides an output that varies with another predetermined parameter of the fluid. The viscosity sensor is preferably a MEM device fabricated by means of a “deep etch” process. The sensors are preferably integrated together on a common substrate, though they might also be fabricated separately and packaged together to form a hybrid device. A data processing means may be included which receives the sensor outputs and provides one or more outputs indicative of the health of the fluid. Sensor types which may be part of the present device include, for example, a temperature sensor, a MEM electrochemical sensor, a MEM accelerometer, a MEM contact switch lubricity sensor, and/or an inductive metallic wear sensor.
    Type: Application
    Filed: September 22, 2005
    Publication date: March 22, 2007
    Inventors: Jeffrey DeNatale, Robert Borwick, Philip Stupar, Martin Kendig
  • Publication number: 20070057336
    Abstract: A MEM viscosity sensor comprises a substrate, with first and second support structures affixed to the substrate and spaced-apart. A compliant member is affixed to the support structures such that it is suspended above and can flex vertically with respect to the substrate. The member has a high density of perforations, through which a fluid whose viscosity is to be sensed can flow. The sensor includes a drive means to apply a force to the member, and a sensing means to sense the vertical motion of the member in response to the applied force. The member's perforations ensure that its resistance to motion will be shear in nature, and minimizes sensitivity to particulates. The substrate is also preferably perforated to further reduce non-shear forces and facilitate fluid exchange.
    Type: Application
    Filed: September 12, 2005
    Publication date: March 15, 2007
    Inventors: Jeffrey DeNatale, Robert Borwick, Philip Stupar
  • Publication number: 20070054433
    Abstract: A microelectromechanical (MEM) device per the present invention comprises a semiconductor wafer—typically an SOI wafer, a substrate, and a high temperature bond which bonds the wafer to the substrate to form a composite structure. Portions of the composite structure are patterned and etched to define stationary and movable MEM elements, with the movable elements being mechanically coupled to the stationary elements. The high temperature bond is preferably a mechanical bond, with the wafer and substrate having respective bonding pads which are aligned and mechanically connected to form a thermocompression bond to effect the bonding. A metallization layer is typically deposited on the composite structure and patterned to provide electrical interconnections for the device. The metallization layer preferably comprises a conductive refractory material such as platinum to withstand high temperature environments.
    Type: Application
    Filed: September 8, 2005
    Publication date: March 8, 2007
    Inventors: Jeffrey DeNatale, Robert Borwick, Philip Stupar
  • Publication number: 20060292866
    Abstract: Embodiments of the present invention are directed to a process for forming small diameter vias at low temperatures. In preferred embodiments, through-substrate vias are fabricated by forming a through-substrate via; and depositing conductive material into the via by means of a flowing solution plating technique, wherein the conductive material releases a gas that pushes the conductive material through the via to facilitate plating the via with the conductive material. In preferred embodiments, the fabrication of the substrate is conducted at low temperatures.
    Type: Application
    Filed: June 23, 2005
    Publication date: December 28, 2006
    Inventors: Robert Borwick, Philip Stupar, Jeffrey DeNatale, Chailun Tsai, Zhimin Yao, Kathleen Garrett, John White, Les Warren, Morgan Tench
  • Publication number: 20060065045
    Abstract: Embodiments of the present invention are directed to a MEM viscosity sensor that is configured to be operated submerged in a liquid. The MEMS viscosity sensor comprises a MEMS variable capacitor comprising a plurality of capacitor plates capable of being submerged in a liquid. An actuator places a driving force on the variable capacitor which causes relative movement between the plates, where the movement creates a shear force between each moving plate and the liquid, which damps the movement of the plate and increases the capacitor's response time to the applied force in accordance with the liquid's viscosity. To determine the actual viscosity of the liquid, a sensor is coupled to the variable capacitor for sensing the response time of the plates as an indicator of the liquid's viscosity.
    Type: Application
    Filed: September 30, 2004
    Publication date: March 30, 2006
    Inventors: Robert Borwick, Philip Stupar, Jeffrey DeNatale