Abstract: Methods, apparatuses and systems of manufacturing an optical fiber are disclosed herein. The methods may include heating an optical preform in a draw furnace, drawing an optical fiber from the optical preform, cooling the optical fiber with a slow cooling device, and annealing the optical fiber by passing the optical fiber through an RF plasma heating apparatus.

Abstract: A system, having: an RF power source; an RF matching network electrically coupled to the RF power source; an impedance matching circuit electrically coupled to the RF matching network, wherein the impedance matching circuit has a first adjustable capacitor connected in series with the RF matching network and a second adjustable capacitor connected in parallel with the first capacitor; and an inductive process load electrically coupled to the impedance matching circuit.

Abstract: An atmospheric pressure linear RF plasma source having an enclosure enclosing a chamber in the form of an extended slot having a width W, a length L, and a thickness T, with W?20T, the enclosure having a top opening for receiving a flow of a working gas in the direction of the length L and a bottom opening for delivering a flow of plasma, with the bottom opening being open to atmospheric pressure. Then walls of the enclosure comprise a dielectric material. Two mutually opposing pancake coils are positioned on opposite sides of the enclosure and are capable of being driven by an RF power source in an opposing phase relationship. Alternatively, an elongated solenoid coil may surround the enclosure.

Abstract: A compost leachate distribution device includes a composting chamber for receiving material to be composted and a leachate collection chamber for collecting, via a leachate fluid path, leachate generated during composting in the composting chamber. The device has a leachate mixing arrangement a first inlet for receiving a flow of water, a mixing chamber to which the first inlet leads for mixing water with leachate to form a water/leachate mix and an outlet leading from the mixing chamber to the exterior for exit of the water/leachate mix, wherein the leachate mixing arrangement has dosing means for controlling a rate of flow of leachate from the leachate collection chamber into the mixing chamber.

Abstract: A system, having: an RF power source; an RF matching network electrically coupled to the RF power source; an impedance matching circuit electrically coupled to the RF matching network, wherein the impedance matching circuit has a first adjustable capacitor connected in series with the RF matching network and a second adjustable capacitor connected in parallel with the first capacitor; and an inductive process load electrically coupled to the impedance matching circuit.

Abstract: Methods, apparatuses and systems of manufacturing an optical fiber are disclosed herein. The methods may include heating an optical preform in a draw furnace, drawing an optical fiber from the optical preform, cooling the optical fiber with a slow cooling device, and annealing the optical fiber by passing the optical fiber through an RF plasma heating apparatus.

Abstract: An irrigation connector for tapping into a water supply hose includes a retaining portion for holding a supply hose in a hose receiving region of the retaining portion and a hollow needle mounted for movement relative to the retaining portion. The needle can move between a retracted position and an extended position in which the needle extends into the hose receiving region for penetrating a supply hose held in the retaining portion to create a fluid communication path between an interior of the needle and an interior of a supply hose held in the retaining portion. The connector includes a needle drive arrangement for driving the needle towards the extended position.

Abstract: An atmospheric pressure linear RF plasma source having an enclosure enclosing a chamber in the form of an extended slot having a width W, a length L, and a thickness T, with W?20T, the enclosure having a top opening for receiving a flow of a working gas in the direction of the length L and a bottom opening for delivering a flow of plasma, with the bottom opening being open to atmospheric pressure. Then walls of the enclosure comprise a dielectric material. Two mutually opposing pancake coils are positioned on opposite sides of the enclosure and are capable of being driven by an RF power source in an opposing phase relationship. Alternatively, an elongated solenoid coil may surround the enclosure.

Abstract: A hose end adaptor for holding an inner component to be nested within an outer tube of a hose includes a first support portion for receiving the outer tube and a second support portion on which a component to be nested within the outer tube is mountable.

Abstract: An electrostatic chucking apparatus includes a movable member arranged for movement relative to an axial axis, at least one electrostatic chuck coupled to the movable member, and a stationary member. At least one moving insulated electrode is coupled to the movable member, and at least one stationary insulated electrode is coupled to the stationary member in an axial position corresponding to the at least one moving insulated electrode. A slip ring contact couples electrical energy from the at least one stationary insulated electrode to the at least one moving insulated electrode.

Abstract: A chucking apparatus and methods for coating a glass substrate using a vacuum deposition process are disclosed. In one or more embodiments, the chucking apparatus includes an ESC (ESC), a carrier disposed on the ESC, wherein the carrier comprises a first surface adjacent to the ESC and an opposing second surface for forming a Van der Waals bond with a third surface of a glass substrate, without application of a mechanical force on a fourth surface of the glass substrate opposing the third surface. In one or more embodiments, the method includes disposing a carrier and a glass substrate on an ESC, such that the carrier is between the glass substrate and the ESC to form a chucking assembly, forming a Van der Waals bond between the carrier and the glass substrate, and vacuum depositing a coating on the glass substrate.

Abstract: A carrier apparatus including a base including a plurality of peripheral portions, each peripheral portion including an inner surface facing an inner direction, at least one peripheral portion selectively moveable between an extended position and a retracted position, and an elastic member to bias the at least one peripheral portion into the retracted position such that the inner surfaces of the peripheral portions of the plurality of peripheral portions cooperate to circumscribe a retaining area. The carrier apparatus may include an article disposed in the retaining area. A fixture including a cavity for receiving the carrier apparatus may be provided. Methods of using, processing, and assembling the carrier apparatus may also be provided.

Abstract: According to some embodiments method for making an optical fiber preform comprises the steps of: (i) placing a plurality of rods with an outer surface having a coefficient of friction 0.02?COF?0.3 into an inner cavity of an apparatus; (ii) placing particulate glass material in the inner cavity between the rods and an inner wall of the mold cavity; and (iii) applying pressure against the particulate glass material to press the particulate glass material against the plurality of rods.

Abstract: A method of preparing a glass, glass-ceramic or ceramic substrate for coating that includes: treating a primary surface of a carrier to form a carrier bonding surface, the carrier having a thickness of at least 2 mm; disposing a carrier surface modification layer on the carrier bonding surface; bonding the carrier to at least one substrate having a substrate bonding surface and a thickness from about 0.1 mm to about 3.5 mm, the bonding conducted by temporarily joining the carrier at the carrier surface modification layer to the substrate at the substrate bonding surface. Further, the treating and disposing steps are conducted such that an adhesion energy between the carrier surface modification layer and the substrate bonding surface is from 50 to 1000 mJ/m2 after the bonding step.

Abstract: A carrier apparatus including a base including an outer peripheral surface and an inner support surface, a frame to connect to the outer peripheral surface of the base, and a circumferential flange including an outer circumferential portion and an inner circumferential portion. The outer circumferential portion to be clamped between the frame and the outer peripheral surface of the base, and the inner circumferential portion to extend inward from the frame. The inner circumferential portion including an opening to be spaced a distance from the inner support surface of the base. The carrier apparatus may include an article including a first major surface, a second major surface, a thickness between the first major surface and the second major surface, and an edge extending across the thickness between the first major surface and the second major surface. Methods of processing and assembling the carrier apparatus may also be provided.

Abstract: An irrigation system ground spike for securing at least one component of an irrigation system includes a spike portion for penetrating soil to hold the ground spike in position and at least two holding portions. Each holding portion holds a respective component of an irrigation system wherein a first of the two holding portions differs from a second of the two portions so facilitating use of the spike for selectively securing respective different components. In particular one of the holding portions is arranged for holding tube or hose of a first diameter and another of the holding portions is arranged for holding tube or hose of a second diameter.

Abstract: An electrostatic chuck apparatus for chucking glass includes a substantially rigid chassis with a plurality of apertures extending from one side of the chassis to another side of the chassis. A plurality of electrostatic chuck pins extend through the openings and are resiliently mounted to the chassis such that the extent to which the electrostatic chuck pins extend through the chassis is individually variable. With this construction, the electrostatic chuck pins maintaining contact with the surface of the glass despite the presence of some variation in the localized surface flatness of the glass.

Abstract: A chucking apparatus and methods for coating a glass substrate using a vacuum deposition process are disclosed. In one or more embodiments, the chucking apparatus includes an ESC (ESC), a carrier disposed on the ESC, wherein the carrier comprises a first surface adjacent to the ESC and an opposing second surface for forming a Van der Waals bond with a third surface of a glass substrate, without application of a mechanical force on a fourth surface of the glass substrate opposing the third surface. In one or more embodiments, the method includes disposing a carrier and a glass substrate on an ESC, such that the carrier is between the glass substrate and the ESC to form a chucking assembly, forming a Van der Waals bond between the carrier and the glass substrate, and vacuum depositing a coating on the glass substrate.

Abstract: A chucking apparatus and method for vacuum processing mobile device cover substrates in a vacuum chamber in which the chucking apparatus is configured for temporarily securing the cover substrate within the vacuum chamber, and includes a carrier substrate with a CTE within 20% of CTE of the cover substrate to prevent the carrier substrate and the cover substrate from becoming detached from one another due to differing rates of thermal expansion during processing in the vacuum chamber. The carrier substrate has a surface contact area in contact with the cover substrate selected to provide for continuous bonding during the processing in the vacuum chamber and to provide for de-bonding after the process in the vacuum chamber is complete. Further, the carrier substrate is prepared for use with a cleaning process that facilitates Van der Waals bonding between the carrier substrate and the cover substrate.

Abstract: A electrostatic chucking apparatus and method for coating mobile device 2D or 3D cover glass in a vacuum coating chamber having a rotating drum and which is driven in rotation. The apparatus includes a carrier including a liquid-cooled cold plate which is removably mountable to the rotating drum. In the case of 3D cover glass, the carrier includes a portion with a 3D profile to match a 3D profile of the 3D cover glass. The carrier further includes an electrostatic chuck (ESC) adapted to secure the cover glass in place against the carrier in the face of centrifugal forces caused by rotation of the rotating drum, with the ESC developing a sufficient clamping force for reliably securing the cover glass in place.