Patents by Inventor Robert Brent Vopat
Robert Brent Vopat has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230420275Abstract: Apparatus and methods to process one or more wafers are described. The apparatus comprises a chamber defining an upper interior region and a lower interior region. A heater assembly is on the bottom of the chamber body in the lower interior region and defines a process region. A wafer cassette assembly is inside the heater assembly and a motor is configured to move the wafer cassette assembly from the lower process region inside the heater assembly to the upper interior region.Type: ApplicationFiled: September 8, 2023Publication date: December 28, 2023Applicant: Applied Materials, Inc.Inventors: Michael Honan, David Blahnik, Robert Brent Vopat, Jeffrey Blahnik, Charles Carlson
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Patent number: 11791176Abstract: Apparatus and methods to process one or more wafers are described. The apparatus comprises a chamber defining an upper interior region and a lower interior region. A heater assembly is on the bottom of the chamber body in the lower interior region and defines a process region. A wafer cassette assembly is inside the heater assembly and a motor is configured to move the wafer cassette assembly from the lower process region inside the heater assembly to the upper interior region.Type: GrantFiled: October 28, 2019Date of Patent: October 17, 2023Assignee: Applied Materials, Inc.Inventors: Michael Honan, David Blahnik, Robert Brent Vopat, Jeffrey Blahnik, Charles Carlson
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Patent number: 11315806Abstract: Wafer cassettes and methods of use that provide heating a cooling to a plurality of wafers to decrease time between wafer switching in a processing chamber. Wafers are supported on a wafer lift which can move all wafers together or on independent lift pins which can move individual wafers for heating and cooling.Type: GrantFiled: May 1, 2019Date of Patent: April 26, 2022Assignee: Applied Materials, Inc.Inventors: Jason M. Schaller, Robert Brent Vopat, Paul E. Pergande, Benjamin B. Riordon, David Blahnik, William T. Weaver
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Patent number: 11264258Abstract: Buffer chamber including robots, a carousel and at least one heating module for use with a batch processing chamber are described. Robot configurations for rapid and repeatable movement of wafers into and out of the buffer chamber and cluster tools incorporating the buffer chambers and robots are described.Type: GrantFiled: May 19, 2020Date of Patent: March 1, 2022Assignee: Applied Materials, Inc.Inventors: William T. Weaver, Jason M. Schaller, Robert Brent Vopat, David Blahnik, Benjamin B. Riordon, Paul E. Pergande
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Patent number: 10854491Abstract: A method and apparatus for of improving processing results in a processing chamber by orienting a substrate support relative to a surface within the processing chamber. The method comprising orienting a supporting surface of a substrate support in a first orientation relative to an output surface of a showerhead, where the first orientation of the supporting surface relative to the output surface is not coplanar, and depositing a first layer of material on a substrate disposed on the supporting surface that is oriented in the first orientation.Type: GrantFiled: March 18, 2019Date of Patent: December 1, 2020Assignee: Applied Materials, Inc.Inventors: Jason M. Schaller, Michael Rohrer, Tuan Anh Nguyen, William Tyler Weaver, Gregory John Freeman, Robert Brent Vopat
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Patent number: 10854483Abstract: Apparatuses for annealing semiconductor substrates, such as a batch processing chamber, are provided herein. The batch processing chamber includes a chamber body enclosing an internal volume, a cassette moveably disposed within the internal volume and a plug coupled to a bottom wall of the cassette. The chamber body has a hole through a bottom wall of the chamber body and is interfaced with one or more heaters operable to maintain the chamber body at a temperature of greater than 290° C. The cassette is configured to be raised to load a plurality of substrates thereon and lowered to seal the internal volume. The plug is configured to move up and down within the internal volume. The plug includes a downward-facing seal configured to engage with a top surface of the bottom wall of the chamber body and close the hole through the bottom wall of the chamber body.Type: GrantFiled: October 11, 2018Date of Patent: December 1, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Jason M. Schaller, Robert Brent Vopat, Charles T. Carlson, Jeffrey Charles Blahnik, Timothy J. Franklin, David Blahnik, Aaron Webb
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Publication number: 20200375027Abstract: A system for heating substrates comprising LEDs arranged in a plurality of concentric circles is disclosed. The system comprises an array of light emitting diodes (LEDs) disposed in a two-dimensional grid, where there are a set of rows, and each row comprises a plurality of LEDs configured in parallel. This configuration is fault tolerant, allowing one or more LEDs to be inoperable, without affecting any of the other LEDs. Further, the LEDs are arranged in concentric circles, allowing uniform heating of the substrate. Additionally, in certain embodiments, the LEDs and signal traces are arranged so that a single layer circuit board may be used. A method of creating this array of LEDs is also disclosed.Type: ApplicationFiled: May 21, 2019Publication date: November 26, 2020Inventors: Jason M. Schaller, Robert Brent Vopat, Paul E. Pergande
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Patent number: 10831112Abstract: Provided herein are approaches for processing reticle blanks. In one approach, a reticle processing system includes a support assembly having a plate coupled to a frame, and a carrier assembly coupled to the support assembly. In one approach, the carrier assembly includes a carrier base coupled to the plate, a reticle disposed over the carrier base, and a carrier shield disposed over the reticle, wherein the carrier shield may include a central opening formed therein, allowing for placement and extraction of the reticle. In one approach, when the carrier assembly is placed atop the support assembly, a plurality of pins extend from the plate through corresponding openings in the carrier base, the plurality of pins supporting the carrier assembly so the carrier base, the reticle, and the carrier shield are each independently supported and vertically separated from one another.Type: GrantFiled: February 21, 2019Date of Patent: November 10, 2020Assignee: Applied Materials, Inc.Inventors: James Strassner, Charles Carlson, Robert Brent Vopat, Jeffrey Blahnik
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Publication number: 20200279763Abstract: Buffer chamber including robots, a carousel and at least one heating module for use with a batch processing chamber are described. Robot configurations for rapid and repeatable movement of wafers into and out of the buffer chamber and cluster tools incorporating the buffer chambers and robots are described.Type: ApplicationFiled: May 19, 2020Publication date: September 3, 2020Applicant: Applied Materials, Inc.Inventors: William T. Weaver, Jason M. Schaller, Robert Brent Vopat, David Blahnik, Benjamin B. Riordon, Paul E. Pergande
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Patent number: 10699930Abstract: Buffer chamber including robots, a carousel and at least one heating module for use with a batch processing chamber are described. Robot configurations for rapid and repeatable movement of wafers into and out of the buffer chamber and cluster tools incorporating the buffer chambers and robots are described.Type: GrantFiled: September 11, 2018Date of Patent: June 30, 2020Assignee: Applied Materials, Inc.Inventors: William T. Weaver, Jason M. Schaller, Robert Brent Vopat, David Blahnik, Benjamin B. Riordon, Paul E. Pergande
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Patent number: 10643867Abstract: A system for annealing substrates is provided. The system includes a first boiler having an input coupled to a water source; a second boiler having an input connected to an output of the first boiler; and a batch processing chamber coupled to the output of the second boiler, wherein the batch processing chamber is configured to anneal a plurality of substrates using steam from the second boiler.Type: GrantFiled: October 25, 2018Date of Patent: May 5, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Jean Delmas, Charles T. Carlson, Robert Brent Vopat
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Publication number: 20200135508Abstract: Apparatus and methods to process one or more wafers are described. The apparatus comprises a chamber defining an upper interior region and a lower interior region. A heater assembly is on the bottom of the chamber body in the lower interior region and defines a process region. A wafer cassette assembly is inside the heater assembly and a motor is configured to move the wafer cassette assembly from the lower process region inside the heater assembly to the upper interior region.Type: ApplicationFiled: October 28, 2019Publication date: April 30, 2020Inventors: Michael Honan, David Blahnik, Robert Brent Vopat, Jeffrey Blahnik, Charles Carlson
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Patent number: 10597779Abstract: Apparatus and methods for aligning large susceptors in batch processing chambers are described. Apparatus and methods for controlling the parallelism of a susceptor relative to a gas distribution assembly are also described.Type: GrantFiled: May 25, 2016Date of Patent: March 24, 2020Assignee: Applied Materials, Inc.Inventors: William T. Weaver, Robert Brent Vopat, Joseph Yudovsky, Jason M. Schaller
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Patent number: 10443934Abstract: A system for heating substrates while being transported between the load lock and the platen is disclosed. The system comprises an array of light emitting diodes (LEDs) disposed above the alignment station. The LEDs may be GaN or GaP LEDs, which emit light at a wavelength which is readily absorbed by silicon, thus efficiently and quickly heating the substrate. The LEDs may be arranged so that the rotation of the substrate during alignment results in a uniform temperature profile of the substrate. Further, heating during alignment may also increase throughput and eliminate preheating stations that are currently associated with the processing chamber.Type: GrantFiled: May 8, 2015Date of Patent: October 15, 2019Assignee: Varian Semiconductor Equipment Associates, Inc.Inventors: Morgan D. Evans, Jason M. Schaller, D. Jeffrey Lischer, Ala Moradian, William T. Weaver, Robert Brent Vopat
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Patent number: 10446710Abstract: An ion implanter and method for facilitating expeditious performance of maintenance on a component of the ion implanter in a manner that reduces downtime while increasing throughput of the ion implanter. The ion implanter includes a process chamber, a transfer chamber connected to the process chamber, a first isolation gate configured to controllably seal the transfer chamber from the process chamber, and a second isolation gate configured to controllably seal the transfer chamber from an atmospheric environment, wherein a component of the ion implanter can be transferred between the process chamber and the transfer chamber for performing maintenance on the component outside of the process chamber. Performing maintenance on a component of the ion implanter includes the steps of transferring the component from the process chamber to the transfer chamber, sealing the transfer chamber, venting the transfer chamber to atmospheric pressure, an opening the transfer chamber to an atmospheric environment.Type: GrantFiled: December 10, 2013Date of Patent: October 15, 2019Assignee: Varian Semiconductor Equipment Associates, Inc.Inventors: Aaron P. Webb, Charles T. Carlson, Paul Forderhase, William T. Weaver, Robert Brent Vopat
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Publication number: 20190259638Abstract: Wafer cassettes and methods of use that provide heating a cooling to a plurality of wafers to decrease time between wafer switching in a processing chamber. Wafers are supported on a wafer lift which can move all wafers together or on independent lift pins which can move individual wafers for heating and cooling.Type: ApplicationFiled: May 1, 2019Publication date: August 22, 2019Inventors: Jason M. Schaller, Robert Brent Vopat, Paul E. Pergande, Benjamin B. Riordon, David Blahnik, William T. Weaver
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Publication number: 20190229004Abstract: A method and apparatus for of improving processing results in a processing chamber by orienting a substrate support relative to a surface within the processing chamber.Type: ApplicationFiled: March 18, 2019Publication date: July 25, 2019Inventors: Jason M. SCHALLER, Michael ROHRER, Tuan Anh NGUYEN, William Tyler WEAVER, Gregory John FREEMAN, Robert Brent VOPAT
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Publication number: 20190189499Abstract: Provided herein are approaches for processing reticle blanks. In one approach, a reticle processing system includes a support assembly having a plate coupled to a frame, and a carrier assembly coupled to the support assembly. In one approach, the carrier assembly includes a carrier base coupled to the plate, a reticle disposed over the carrier base, and a carrier shield disposed over the reticle, wherein the carrier shield may include a central opening formed therein, allowing for placement and extraction of the reticle. In one approach, when the carrier assembly is placed atop the support assembly, a plurality of pins extend from the plate through corresponding openings in the carrier base, the plurality of pins supporting the carrier assembly so the carrier base, the reticle, and the carrier shield are each independently supported and vertically separated from one another.Type: ApplicationFiled: February 21, 2019Publication date: June 20, 2019Inventors: James Strassner, Charles Carlson, Robert Brent Vopat, Jeffrey Blahnik
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Publication number: 20190148186Abstract: Apparatuses for annealing semiconductor substrates, such as a batch processing chamber, are provided herein. The batch processing chamber includes a chamber body enclosing an internal volume, a cassette moveably disposed within the internal volume and a plug coupled to a bottom wall of the cassette. The chamber body has a hole through a bottom wall of the chamber body and is interfaced with one or more heaters operable to maintain the chamber body at a temperature of greater than 290° C. The cassette is configured to be raised to load a plurality of substrates thereon and lowered to seal the internal volume. The plug is configured to move up and down within the internal volume. The plug includes a downward-facing seal configured to engage with a top surface of the bottom wall of the chamber body and close the hole through the bottom wall of the chamber body.Type: ApplicationFiled: October 11, 2018Publication date: May 16, 2019Inventors: Jason M. SCHALLER, Robert Brent VOPAT, Charles T. CARLSON, Jeffrey Charles BLAHNIK, Timothy J. FRANKLIN, David BLAHNIK, Aaron WEBB
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Publication number: 20190139793Abstract: A system for annealing substrates is provided. The system includes a first boiler having an input coupled to a water source; a second boiler having an input connected to an output of the first boiler; and a batch processing chamber coupled to the output of the second boiler, wherein the batch processing chamber is configured to anneal a plurality of substrates using steam from the second boiler.Type: ApplicationFiled: October 25, 2018Publication date: May 9, 2019Inventors: Jean DELMAS, Charles T. CARLSON, Robert Brent VOPAT