Abstract: A test fixture that exhibits relatively low parasitic impedance and inductance characteristics (thereby allowing for high speed --several GHz testing) while capable of high volume testing. The fixture utilizes a high dielectric test substrate with gold test leads for best performance. A two-piece test fixture is aligned with and attached to the substrate, with a layer of vertically conductive material disposed between the substrate and the fixture. A first component of the two-piece test fixture include a central aperture for holding the test package in alignment with the leads formed on the test substrate. A second component of the two-piece test fixture covers the package and exerts a predetermined force on the package leads, thereby inducing conductivity through the vertically conductive material and forming a conduction path from the substrate to the package leads.