Patents by Inventor Robert Broesler

Robert Broesler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9876135
    Abstract: Methods for fabricating busbar and finger metallization over TCO are disclosed. Rather than using expensive and relatively resistive silver paste, a high conductivity and relatively low cost copper is used. Methods for enabling the use of copper as busbar and fingers over a TCO are disclosed, providing good adhesion while preventing migration of the copper into the TCO. Also, provisions are made for easy soldering contacts to the copper busbars.
    Type: Grant
    Filed: February 11, 2017
    Date of Patent: January 23, 2018
    Assignee: SUNPREME
    Inventors: Ashok Sinha K., Roman Milter, Robert Broesler
  • Publication number: 20170162744
    Abstract: Methods for fabricating busbar and finger metallization over TCO are disclosed. Rather than using expensive and relatively resistive silver paste, a high conductivity and relatively low cost copper is used. Methods for enabling the use of copper as busbar and fingers over a TCO are disclosed, providing good adhesion while preventing migration of the copper into the TCO. Also, provisions are made for easy soldering contacts to the copper busbars.
    Type: Application
    Filed: February 11, 2017
    Publication date: June 8, 2017
    Applicant: SUNPREME, LTD.
    Inventors: Ashok Sinha K., Roman Milter, Robert Broesler
  • Patent number: 9577140
    Abstract: Methods for fabricating busbar and finger metallization over TCO are disclosed. Rather than using expensive and relatively resistive silver paste, a high conductivity and relatively low cost copper is used. Methods for enabling the use of copper as busbar and fingers over a TCO are disclosed, providing good adhesion while preventing migration of the copper into the TCO. Also, provisions are made for easy soldering contacts to the copper busbars.
    Type: Grant
    Filed: May 12, 2015
    Date of Patent: February 21, 2017
    Inventors: Ashok Sinha, Roman Milter, Robert Broesler
  • Publication number: 20160111589
    Abstract: Methods for fabricating busbar and finger metallization over TCO are disclosed. Rather than using expensive and relatively resistive silver paste, a high conductivity and relatively low cost copper is used. Methods for enabling the use of copper as busbar and fingers over a TCO are disclosed, providing good adhesion while preventing migration of the copper into the TCO. Also, provisions are made for easy soldering contacts to the copper busbars.
    Type: Application
    Filed: May 12, 2015
    Publication date: April 21, 2016
    Applicant: SUNPREME, LTD.
    Inventors: Ashok Sinha, Roman Milter, Robert Broesler
  • Publication number: 20130125968
    Abstract: Methods for fabricating busbar and finger metallization over TCO are disclosed. Rather than using expensive and relatively resistive silver paste, a high conductivity and relatively low cost copper is used. Methods for enabling the use of copper as busbar and fingers over a TCO are disclosed, providing good adhesion while preventing migration of the copper into the TCO. Also, provisions are made for easy soldering contacts to the copper busbars.
    Type: Application
    Filed: November 18, 2011
    Publication date: May 23, 2013
    Applicant: SUNPREME, LTD.
    Inventors: Ashok Kumar Sinha, Roman Milter, Robert Broesler