Abstract: A method for the testing of optoelectronic chips which are arranged on a wafer and have electrical interfaces in the form of contact pads and optical interfaces which are arranged to be fixed relative thereto in the form of optical deflection elements, e.g., grating couplers, with a specific coupling angle. The wafer is adjusted in three adjustment steps with one of the chips relative to a contacting module such that the electrical interfaces of the chip and contacting module contact one another, and the optical interfaces of the chip and contacting module occupy a maximum position of the optical coupling.

Abstract: A contacting module and a method for assembling a contacting module with an optical module, containing an optical block made of glass, and with an electronics module, the optical block being connected via an adhesive connection to the electronics module or the optical module having a mounting plate, which is mounted on the electronics module so as to be repeatedly releasable therefrom and is connected to the optical block via an adhesive connection. The adhesive connection is produced via at least three cylinder pins, which each have a first end face bearing against the optical block by an adhesive and are glued in through-bores in the carrier plate or the mounting plate.

Abstract: A contacting module and to a method for assembling a contacting module. The contacting module includes: an optical module which contains an optical block made of glass, which optical block has an arrangement of optical interfaces (Sopt) in an optical interface plane (Eopt); and an electronic module, which has an arrangement of electrical interfaces (Sele) in an electrical interface plane (Eele). The optical module and the electronic module are arranged relative to each other such that the arrangement of optical interfaces (Sopt) and the arrangement of electrical interfaces (Sele) have a defined alignment position relative to each other. The optical module contains a mounting plate which is connected to the electronic module by means of a repeatedly releasable, reproducible connection.

Abstract: A method for the testing of optoelectronic chips which are arranged on a wafer and have electrical interfaces in the form of contact pads and optical interfaces which are arranged to be fixed relative thereto in the form of optical deflection elements, e.g., grating couplers, with a specific coupling angle. The wafer is adjusted in three adjustment steps with one of the chips relative to a contacting module such that the electrical interfaces of the chip and contacting module contact one another, and the optical interfaces of the chip and contacting module occupy a maximum position of the optical coupling.

Abstract: The invention relates to a contacting module (1) by means of which the individual electrical and optical inputs and outputs (AoC) of optoelectronic chips (2) are connected to the device-specific electrical and optical inputs and outputs of a test apparatus. It is characterized by a comparatively high adjustment insensitivity of the optical contacts between the chips (2) and the contacting module (1), which is achieved, for example, by technical measures which result in the optical inputs (EoK) of the chip (2) or on the contacting module (1) being irradiated in every possible adjustment position by the optical signal (So) to be coupled in.

Abstract: The invention relates to a contacting module (1) by means of which the individual electrical and optical inputs and outputs (AoC) of optoelectronic chips (2) are connected to the device-specific electrical and optical inputs and outputs of a test apparatus. It is characterized by a comparatively high adjustment insensitivity of the optical contacts between the chips (2) and the contacting module (1), which is achieved, for example, by technical measures which result in the optical inputs (EoK) of the chip (2) or on the contacting module (1) being irradiated in every possible adjustment position by the optical signal (So) to be coupled in.

Abstract: A device separates a fluid mass flow in a nuclear plant. The device contains a primary end piece for conducting the fluid mass flow and a plurality of secondary end pieces for conducting a plurality of separate partial flows of the fluid mass flow. A number of separating elements is provided in the area within the primary end piece, and each of the partial areas defined by the separating element or the separating elements opens in a secondary end piece clearly assigned to the partial area.