Abstract: A multilayer switching assembly for switching high frequency signals has MEMS structures on a ceramic substrate having a top surface, a bottom surface and a plurality of insulating layers. The insulating layers are separated by a first conductor and a second conductor. The first conductor is connected to a ground potential. The second conductor is separated from the first conductor by one of the insulating layers. The second conductor presents a specific impedance (50 ohms) with respect to the first conductor to high frequency signals traveling on the second conductor.

Abstract: A micro electromechanical system (MEMS) transfer switch for simultaneously connecting two radio frequency (RF) input transmission lines among two RF output transmission lines. The MEMS transfer switch includes a plurality of series MEMS switching units operatively arranged with the input and output transmission lines to selectively connect a first input to a first output and a second input to a second output, or the second input to the first output and the first input to the second output.

Abstract: A multi-channel microwave switched filter bank, wherein the input circuitry and output circuitry are mounted on opposite sides of the filter bank, providing a compact structure with excellent isolation. The filter bank includes a set of microwave band pass filter circuits. A housing structure provides an outer conductive peripheral frame structure. A rack structure disposed within the housing structure has a plurality of elongated slots for mounting therein corresponding ones of the plurality of filter circuits. A top dielectric substrate board is mounted adjacent a first side of the rack structure and has a first set of openings formed therein for providing access to a first set of input/output (I/O) ports of the plurality of filter circuits. A bottom dielectric substrate board is mounted adjacent a second side of the rack structure opposite the first side and has a second set of openings formed therein for providing access to a second set of input/output (I/O) ports of the plurality of filter circuits.

Abstract: A compact thick film substrate for filtering, shielding, and routing multiple lines of dc and control signals between isolated ports of a microwave integrated circuit. The substrate circuit includes a dielectric substrate having upper and lower substrate surfaces and first and second side surfaces. A first ground plane layer is formed on the upper substrate surface.

Abstract: In accordance with the present invention, a network management program (80) is provided that manages the communication of data packets between an intranetwork (44) and an internetwork (40). An operator of a computer connected to the intranetwork (44) inputs vital information regarding users of computers connected to the intranetwork (44), mapping information regarding computers connected to the intranetwork (44), and policies to be applied against those users and computers, using a graphical user interface (GUI 70). The GUI (70) communicates the vital user information, mapping information and policies to a database (72) which stores and organizes the vital user information, mapping information and policies. A filter executive (76) optimizes the policies stored in the database (72) into a set of rules for each user and passes the rules to a filter engine (78).

Abstract: Apparatus and processes for desoldering and soldering an insulator-encapsulated contact using a focused heat source and thermal choke in the form of a soldering iron tip and a contact moat. The desoldering and removal process includes the following steps. Securing the housing to minimize movement thereof. Heating a soldering iron to approximately 825.degree. C. Tinning the tip of the soldering iron with solder and flux. Engaging the contact from the rear using an extraction tool. Disposing flux on the solder joint. Contacting the soldering iron with the contact. Disposing the soldering iron in the moat while outward pressure is exerted with an extraction tool. After a predetermined delay, using the extraction tool to vacuum out the contact, while simultaneously removing the soldering iron and pushing out the contact, whereafter the contact is desoldered and seated in the extraction tool. Removing the contact from the extraction tool and removing the tool from the housing.