Abstract: An improved method of manufacturing an electrical probe test head is provided for testing electrical circuits, such as, e.g., IC-chips and circuit boards. The test head can be employed in circuit testers, such as, e.g., circuit board testers and probe cards, to provide an electrical connection between the terminals of the circuit to be tested and external test circuitry. The method of manufacturing the test head includes selecting an electrical circuit having terminals arranged in a terminal pattern. Vertical probe pitch series sets are provided, each of which includes a plurality of electrically conductive rigid pins, which is made of a suitable material, such as, e.g., tungsten. Each of the rigid pins has a pin shaft and a pin contact tip. The pin contact tips are configured in a pin pattern corresponding to the terminal pattern, i.e., the pattern in which the terminals of the circuit to be tested are arranged.