Patents by Inventor Robert C. Dry

Robert C. Dry has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods of forming integrated circuit devices using cutting tools to expose metallization pads through a cap structure and related cutting devices
    Patent number: 11348798
    Abstract: A method of fabricating a semiconductor device can include providing an integrated circuit electrically coupled to a metallization pad on a semiconductor wafer, the integrated circuit and the metallization pad covered by a cap structure. A channel can be cut in a portion of the cap structure that covers the metallization pad using a cutting tool having a tip surface and a beveled side surface to expose an upper surface of the metallization pad in the channel extending in a first direction and a conductive material can be deposited in the channel to ohmically contact the upper surface of the metallization pad in the channel.
    Type: Grant
    Filed: February 7, 2020
    Date of Patent: May 31, 2022
    Assignee: Akoustis, Inc.
    Inventors: Robert C. Dry, Brook Hosse
  • METHODS OF FORMING INTEGRATED CIRCUIT DEVICES USING CUTTING TOOLS TO EXPOSE METALIZATION PADS THROUGH A CAP STRUCTURE AND RELATED CUTTING DEVICES
    Publication number: 20210249272
    Abstract: A method of fabricating a semiconductor device can include providing an integrated circuit electrically coupled to a metallization pad on a semiconductor wafer, the integrated circuit and the metallization pad covered by a cap structure. A channel can be cut in a portion of the cap structure that covers the metallization pad using a cutting tool having a tip surface and a beveled side surface to expose an upper surface of the metallization pad in the channel extending in a first direction and a conductive material can be deposited in the channel to ohmically contact the upper surface of the metallization pad in the channel.
    Type: Application
    Filed: February 7, 2020
    Publication date: August 12, 2021
    Inventors: Robert C. Dry, Brook Hosse