Abstract: Low cost test for Integrated Circuits or electrical modules using a reconfigurable logic device is described. In one embodiment, the invention includes configuring a reconfigurable logic device to comply with input standards of a device under test, applying test signals to the device under test, detecting output results of the device under test, and analyzing the detected output results.

Abstract: Method and apparatus for in-circuit socket testing that includes a module, a printed circuit board, and a test fixture. The module contains two or more switching devices. The module is electrically attachable to a socket. The printed circuit board contains a footprint for insertion of all pins of the socket. The test fixture is electrically connected to all pins of the socket through the printed circuit board. The test fixture supplies power and ground to power pins and ground pins of the socket. Open connections to pins of the socket are detected by monitoring the pins after connecting a signal pin to a ground pin through one switching devices or connecting the signal pin to a power pin through a second switching device.

Abstract: Method and apparatus for in-circuit socket testing that includes a module, a printed circuit board, and a test fixture. The module contains two or more switching devices. The module is electrically attachable to a socket. The printed circuit board contains a footprint for insertion of all pins of the socket. The test fixture is electrically connected to all pins of the socket through the printed circuit board. The test fixture supplies power and ground to power pins and ground pins of the socket. Open connections to pins of the socket are detected by monitoring the pins after connecting a signal pin to a ground pin through one switching devices or connecting the signal pin to a power pin through a second switching device.