Patents by Inventor Robert C. Hoeckele

Robert C. Hoeckele has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230120355
    Abstract: A connector assembly or wiring unit that includes one or more wiring cables, each cable unit including one or more wires surrounded by a cable shield, a connector backshell, and a ferrule disposed such that the one or more wires are arranged on an outer surface of the ferrule. In one embodiment, the connector assembly or wiring unit also includes a conductive shield sock electrically coupled to the connector backshell. The shield sock surrounds the ferrule and is in electrical contact with the cable shield of each of the one or more wiring cables.
    Type: Application
    Filed: October 20, 2021
    Publication date: April 20, 2023
    Inventors: Robert C. Hoeckele, Jitendra J. Solanki, David J. Manna
  • Patent number: 8638535
    Abstract: A system comprises a package with top and bottom surfaces, a plurality of high-power transient voltage suppressors arranged within the package, and a robust lead frame. Each of the transient voltage suppressors has first and second major surfaces substantially perpendicular to the top and bottom surfaces of the package. The lead frame comprises leads connected to the major surfaces of the transient voltage suppressors. Each of the leads has a thickness greater than about 0.015 inches (or 0.381 mm) in a mounting portion, in order to dissipate heat from the transient voltage suppressors and to resist vibration-induced stress on the package.
    Type: Grant
    Filed: January 10, 2011
    Date of Patent: January 28, 2014
    Assignee: Hamilton Sundstrand Corporation
    Inventors: Kevin P. Roy, Richard A. Poisson, Jay W. Kokas, Edward John Marotta, Robert C. Hoeckele, Luke T. Orsini, Marc S. McCloud, Matthew S. Fitzpatrick
  • Publication number: 20120176716
    Abstract: A system comprises a package with top and bottom surfaces, a plurality of high-power transient voltage suppressors arranged within the package, and a robust lead frame. Each of the transient voltage suppressors has first and second major surfaces substantially perpendicular to the top and bottom surfaces of the package. The lead frame comprises leads connected to the major surfaces of the transient voltage suppressors. Each of the leads has a thickness greater than about 0.015 inches (or 0.381 mm) in a mounting portion, in order to dissipate heat from the transient voltage suppressors and to resist vibration-induced stress on the package.
    Type: Application
    Filed: January 10, 2011
    Publication date: July 12, 2012
    Applicant: HAMILTON SUNDSTRAND CORPORATION
    Inventors: Kevin P. Roy, Richard A. Poisson, Jay W. Kokas, Edward John Marotta, Robert C. Hoeckele, Luke T. Orsini, Marc S. McCloud, Matthew S. Fitzpatrick