Abstract: A multi-use intermodal container for transporting cargo comprises compartments, each having both a hopper for discharging particulate material from the bottom of the compartments and a floor above the hopper for supporting standard freight thereon. The floor is arranged to allow passage of particulate material therethrough so that the compartments can be used either for bulk material transport or standard cargo/freight. A door in the side wall provides access to store cargo on the floor of the compartment and a roof hatch provides access to store bulk materials in the compartment for subsequent removal through the hopper.

Abstract: A multi-use intermodal container for transporting cargo comprises compartments, each having both a hopper for discharging particulate material from the bottom of the compartments and a floor above the hopper for supporting standard freight thereon. The floor is arranged to allow passage of particulate material therethrough so that the compartments can be used either for bulk material transport or standard cargo/freight. A door in the side wall provides access to store cargo on the floor of the compartment and a roof hatch provides access to store bulk materials in the compartment for subsequent removal through the hopper.

Abstract: A remotely controlled apparatus for positioning and stabbing pipe within a drilling rig derrick is provided. A support base assembly is mounted to a structural member of a drilling rig derrick. A jointed articulating boom having a boom base member and a boom arm member is attached to the support base assembly and can be pivoted about vertical and horizontal axes. The jointed articulating boom extends and retracts by cooperative motion between the boom base member and the boom arm member. A pipe gripper assembly having opposing arcuate jaws is mounted at the outer extent of the jointed articulating boom and can be pivoted about a horizontal axis. A remote control panel subassembly is used to control the movement of jointed articulating boom and pipe gripper assembly.

Abstract: An apparatus for installing pipe such as large diameter casing in a wellbore. Sensors are positioned at a predetermined location at or near the upper surface of elevators suspended from a rig traveling block. As elevators are lowered over a section of pipe, such sensors provide a signal indicating that the elevators are positioned a desired distance below the top of the pipe. The signal alerts an operator that elevators are positioned properly relative to a pipe body so that slips within the elevators will be properly engaged against the outer surface of the pipe and not a connection upset or large diameter external coupling.

Abstract: An apparatus for installing pipe such as large diameter casing in a wellbore. Sensors are positioned at a predetermined location at or near the upper surface of elevators suspended from a rig traveling block. As elevators are lowered over a section of pipe, such sensors provide a signal indicating that the elevators are positioned a desired distance below the top of the pipe. The signal alerts an operator that elevators are positioned properly relative to a pipe body so that slips within the elevators will be properly engaged against the outer surface of the pipe and not a connection upset or large diameter external coupling.

Abstract: A non-toxic shotgun pellet having ballistic characteristics similar to those of lead shot is made up of particles of a first alloy, containing primarily ferrotungsten, suspended in a matrix of a second alloy, containing primarily lead. The relative amounts of lead and ferrotungsten are selected to minimize cost while keeping the overall lead content to forty percent or less, by weight, to avoid toxicity. The first alloy is formed by diluting the ferrotungsten with iron or steel and carbon at temperatures on the order of 1800.degree. C. in an inert gas environment. The alloy is quenched and then crushed into particles over which is poured the second alloy comprising lead, tin and antimony in order to suspend the first alloy particles in the second alloy mixture.

Abstract: Metal contacts and interconnections for integrated circuits utilize copper as the primary conductor, with the copper being totally encased in refractory metal layers on both top and bottom surfaces and also sidewalls. The contact hole in silicon oxide may be filled with a plug of refractory metal before the copper is deposited, or the first refractory metal layer may be conformally deposited to coat the sidewalls of the hole.

Abstract: Metal contacts and interconnections for integrated circuits utilize copper as the primary conductor, with the copper being totally encased in refractory metal layers on both top and bottom surfaces and also sidewalls. The contact hole in silicon oxide may be filled with a plug of refractory metal before the copper is deposited, or the first refractory metal layer may be conformally deposited to coat the sidewalls of the hole.

Abstract: A method of plating an interconnect or contact metal of higher conductivity than aluminum onto a metal layer in VLSI devices includes depositing a coating of insulator over the metal layer, patterning and etching the insulator coating into a mask of the reverse image of a desired lead pattern and then depositing the interconnect metal onto the exposed metal layer. Following depositing the insulator mask and underlaying metal is selectively removed.

Abstract: Elevated metal contact bumps are provided on a microelectronic semiconductor circuit, with the use of aluminum-palladium metallization as a base for selective electroless plating. The aluminum and palladium are preferably deposited sequentially in a single operation, i.e., without exposing the aluminum surface to the atmosphere. The aluminum-palladium film is then patterned in a single step, using an etchant which attacks both metals at substantially the same rate. The metal pattern is then covered with an insulation layer wherein apertures are opened to expose palladium at selected sites for immersion in an electroless plating bath of ionic Cu or Ni for bump formation.