Abstract: Suspending a microelectromechanical system (MEMS) pressure sensing element inside a cavity using spring-like corrugations or serpentine crenellations, reduces thermally-mismatched mechanical stress on the sensing element. Overlaying the spring-like structures and the sensing element with a gel further reduces thermally-mismatched stress and vibrational dynamic stress.

Abstract: Electrical and mechanical noise in a microelectromechanical system (MEMS) pressure sensor are reduced by the symmetrical distribution of bond pads, conductive vias and interconnects and by the elimination of bond wires used in the prior art to connect a MEMS pressure sensing element to an application specific integrated circuit (ASIC). The bond wires are eliminated by using conductive vias to connect an ASIC to a MEMS pressure sensing element. Extraneous electrical noise is suppressed by conductive rings that surround output signal bond pads and a conductive loop that surrounds the conductive rings and bond pads. The conductive rings and loop are connected to a fixed voltage or ground potential.

Abstract: In a microelectromechanical system (MEMS) pressure sensor, thin and fragile bond wires that are used in the prior art to connect a MEMS pressure sensing element to an application specific integrated circuit (ASIC) for the input and output signals between these two chips are replaced by stacking the ASIC on the MEMS pressure sensing element and connecting each other using conductive vias formed in the ASIC. Gel used to protect the bond wires, ASIC and MEMS pressure sensing element can be eliminated if bond wires are no longer used. Stacking the ASIC on the MEMS pressure sensing element and connecting them using conductive vias enables a reduction in the size and cost of a housing in which the devices are placed and protected.

Abstract: Suspending a microelectromechanical system (MEMS) pressure sensing element inside a cavity using spring-like corrugations or serpentine crenellations, reduces thermally-mismatched mechanical stress on the sensing element. Overlaying the spring-like structures and the sensing element with a gel further reduces thermally-mismatched stress and vibrational dynamic stress.

Abstract: In a microelectromechanical system (MEMS) pressure sensor, thin and fragile bond wires that are used in the prior art to connect a MEMS pressure sensing element to an application specific integrated circuit (ASIC) for the input and output signals between these two chips are replaced by stacking the ASIC on the MEMS pressure sensing element and connecting each other using conductive vias formed in the ASIC. Gel used to protect the bond wires, ASIC and MEMS pressure sensing element can be eliminated if bond wires are no longer used. Stacking the ASIC on the MEMS pressure sensing element and connecting them using conductive vias enables a reduction in the size and cost of a housing in which the devices are placed and protected.

Abstract: Electrical and mechanical noise in a microelectromechanical system (MEMS) pressure sensor are reduced by the symmetrical distribution of bond pads, conductive vias and interconnects and by the elimination of bond wires used in the prior art to connect a MEMS pressure sensing element to an application specific integrated circuit (ASIC). The bond wires are eliminated by using conductive vias to connect an ASIC to a MEMS pressure sensing element. Extraneous electrical noise is suppressed by conductive rings that surround output signal bond pads and a conductive loop that surrounds the conductive rings and bond pads. The conductive rings and loop are connected to a fixed voltage or ground potential.

Abstract: A jointless pressure sensor port which includes a body portion, a flange portion integrally formed with the body portion, and a cylindrical portion integrally formed with and extending away from the flange portion. The port also includes an aperture having a first area, where the aperture is formed as part of the cylindrical portion. A channel is located along an axis and has at least one channel region. The channel at least partially extends through the cylindrical portion, the flange portion, and the body portion. A diaphragm includes a second area which is larger than the first area, the diaphragm also has a top surface and a bottom surface. A pressure sensor is disposed on the top surface, and the diaphragm is substantially perpendicular to the axis of the channel. The body portion, flange portion, and cylindrical portion form a jointless and seamless pressure sensor part.

Abstract: A pressure sensor includes a metal port member having a first closed end and a second opposing opened end. A metal shell surrounds a portion of the periphery of the port. A first weld connection joins the port to the shell. A metal base has upper and lower surfaces and a second weld connection joins the shell to the lower surface of the base. Sensing structure is associated with the closed end of the port member. The sensing structure is constructed and arranged to sense pressure changes at the closed end of the port member. A connector housing covers the sensing structure.

Abstract: A jointless pressure sensor port which includes a body portion, a flange portion integrally formed with the body portion, and a cylindrical portion integrally formed with and extending away from the flange portion. The port also includes an aperture having a first area, where the aperture is formed as part of the cylindrical portion. A channel is located along an axis and has at least one channel region. The channel at least partially extends through the cylindrical portion, the flange portion, and the body portion. A diaphragm includes a second area which is larger than the first area, the diaphragm also has a top surface and a bottom surface. A pressure sensor is disposed on the top surface, and the diaphragm is substantially perpendicular to the axis of the channel. The body portion, flange portion, and cylindrical portion form a jointless and seamless pressure sensor part.

Abstract: A high pressure sensor mounting configuration (100) includes a cylindrical pressure sensor cavity (105), an internally threaded collet (170), and a housing (160). The cylindrical pressure sensor cavity includes a convex conical open end and a first bearing surface (115). The internally threaded collet includes a second bearing surface (175) that bears on the first bearing surface when the internally threaded collet is threaded onto a pressure port (140), causing the convex conical open end (110) to bear on a concave conical mating surface of the pressure port. The housing captures the collet on the pressure sensor cavity.

Abstract: An electrical device (10) includes a package body (12) having a device mounting region (14) and an electrical connection region (16). A cavity (18) resides in the package body (12) intermediate to the device mounting region (14) and to the electrical connection region (16). A leadframe (20) is positioned within the package body (12) and includes a plurality of individual leads (34) traversing the cavity (18). An electronic component (24) is electrically attached to the individual leads (34) within the cavity (18). In addition to accommodating the attachment of the electronic component (24), the cavity (18) is configured to permit access to the individual leads (34) by a bonding tool (40).