Patents by Inventor Robert C. LINKE

Robert C. LINKE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR MANUFACTURING SUSCEPTOR POCKET EDGE FOR PROCESS IMPROVEMENT
    Publication number: 20240141492
    Abstract: Susceptor assemblies having a susceptor base with a plurality of pockets formed in a surface thereof are described. Each of the pockets has a pocket edge angle in the range of 30 to 75° and a pocket edge radius in the range of 0.40±0.05 mm to 1.20 mm±0.05 mm. The pockets have a raised central region and an outer region that is deeper than the raised central region, relative to the surface of the surface of the susceptor base.
    Type: Application
    Filed: March 23, 2023
    Publication date: May 2, 2024
    Applicant: Applied Materials, Inc.
    Inventors: Prasanth Narayanan, Vijayabhaskara Venkatagiriyappa, Keiichi Tanaka, Ning Li, Robert B. Moore, Robert C. Linke, Mandyam Sriram, Mario D. Silvetti, Michael Racine, Tae Kwang Lee
  • Semiconductor reflow processing for high aspect ratio fill
    Patent number: 9245798
    Abstract: A method for at least partially filling a feature on a workpiece includes obtaining a workpiece including a feature having a high aspect ratio in the range of about 10 to about 80, depositing a first conformal conductive layer in the feature, and thermally treating the workpiece to reflow the first conformal conductive layer in the feature.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: January 26, 2016
    Assignee: APPLIED Matrials, Inc.
    Inventors: Ismail T. Emesh, Robert C. Linke
  • SEMICONDUCTOR REFLOW PROCESSING FOR HIGH ASPECT RATIO FILL
    Publication number: 20130320505
    Abstract: A method for at least partially filling a feature on a workpiece includes obtaining a workpiece including a feature having a high aspect ratio in the range of about 10 to about 80, depositing a first conformal conductive layer in the feature, and thermally treating the workpiece to reflow the first conformal conductive layer in the feature.
    Type: Application
    Filed: March 13, 2013
    Publication date: December 5, 2013
    Applicant: APPLIED Materials, Inc.
    Inventors: Ismail T. Emesh, Robert C. Linke
  • APPARATUS AND METHOD FOR SOLAR CELL MODULE EDGE COOLING DURING LAMINATION
    Publication number: 20120168135
    Abstract: Embodiments of the present invention provide a lamination module and procedure for cooling the edges of a partially formed thin film solar module to substantially the same temperature as the central region of the module just prior to compressing and bonding the layers of the heated module. The lamination module may include a cooling module having a plurality of nozzles configured to apply a curtain of cooling fluid to leading and trailing edges of the partially formed solar module after heating the module and just prior to compressing the module. The nozzles may further be configured to apply a curtain of cooling fluid to side edges of the partially formed solar cell module as it passes through the cooling module. As a result, the chance of bubble formation within the bonding material in the edge regions of the completed solar cell module is significantly lowered with respect to conventional lamination processes.
    Type: Application
    Filed: December 15, 2011
    Publication date: July 5, 2012
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Robert C. LINKE, Martin S. WOHLERT, Adam BRAND, Ofer AMIR