Patents by Inventor Robert C. Miller

Robert C. Miller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240188695
    Abstract: An adjustable grip system configured for attachment to a pole which is intended for recreational or ambulatory use. The adjustable grip system provides adjustability of a grip in relation to longitudinal axis wherein the grip is adjustable in up to 3-degrees of freedom in relation to the pole portion and affixable in place once adjusted to the desired configuration.
    Type: Application
    Filed: February 22, 2024
    Publication date: June 13, 2024
    Inventors: Stephen C. HOODECHECK, Scott NOBLE, Robert M. MILLER
  • Publication number: 20240165429
    Abstract: Various embodiments are directed to a method of driving an end effector coupled to an ultrasonic drive system of a surgical instrument. The method comprises generating at least one electrical signal. The at least one electrical signal is monitored against a first set of logic conditions. A first response is triggered when the first set of logic conditions is met. A parameter is determined from the at least one electrical signal.
    Type: Application
    Filed: December 6, 2023
    Publication date: May 23, 2024
    Inventors: Jeffrey D. Messerly, Eitan T. Wiener, Brian T. Noyes, Jeffrey L. Aldridge, James R. Giordano, Robert J. Beetel, III, Daniel J. Abbott, Foster B. Stulen, Matthew C. Miller, Aaron C. Voegele, Jeffrey P. Wiley, Nathan J. Price, Daniel W. Price, Robert L. Koch, JR.
  • Publication number: 20240148429
    Abstract: A method for determining motional branch current in an ultrasonic transducer of an ultrasonic surgical device over multiple frequencies of a transducer drive signal. The method may comprise, at each of a plurality of frequencies of the transducer drive signal, oversampling a current and voltage of the transducer drive signal, receiving, by a processor, the current and voltage samples, and determining, by the processor, the motional branch current based on the current and voltage samples, a static capacitance of the ultrasonic transducer and the frequency of the transducer drive signal.
    Type: Application
    Filed: November 29, 2023
    Publication date: May 9, 2024
    Inventors: Eitan T. Wiener, Jeffrey L. Aldridge, Brian T. Noyes, Jeffrey D. Messerly, James R. Giordano, Robert J. Beetel, III, Nathan J. Price, Matthew C. Miller, Jeffrey P. Wiley, Daniel W. Price, Robert L. Koch, JR., Joseph A. Brotz, John E. Hein
  • Patent number: 11957526
    Abstract: Methods, systems, and products monitor a person's regimen for medicinal and dietary restrictions. When the person's regimen requires a liquid medication or supplement, an oral instrument is commanded to dispense a dosage of fluid. The oral instrument stores a reservoir of the fluid. If the oral instrument is a spoon, for example, the spoon may automatically dispense cough syrup or other medicine. A toothbrush, likewise, may automatically dispense mouthwash. A sensor may confirm presence of the oral instrument in the person's mouth, thus ensuring the dosage of fluid is ingested.
    Type: Grant
    Filed: November 19, 2020
    Date of Patent: April 16, 2024
    Assignee: AT&T Intellectual Property I, L.P.
    Inventors: Kevin A. Li, Troy C. Meuninck, Robert Raymond Miller, II, James H. Pratt, Horst J. Schroeter, Behzad Shahraray
  • Patent number: 9462705
    Abstract: A USB memory assembly, and methods of forming same, are disclosed. The USB memory assembly includes a USB memory device within a carrier. The carrier may in turn be received within a connector shell and lid.
    Type: Grant
    Filed: October 10, 2012
    Date of Patent: October 4, 2016
    Assignee: SanDisk Technologies LLC
    Inventor: Robert C. Miller
  • Patent number: 9218953
    Abstract: A low profile USB flash memory device, and methods of forming same, are disclosed. The USB flash memory device includes an integrated circuit memory portion and a USB connector. The memory portion and the USB connector may be integrally formed on the same substrate. The USB flash memory device includes a substrate on which is mounted one or more flash memory die, a controller die, passive components and an LED for indicating when the memory is being accessed. In contrast to prior art USB memory devices which used TSOP packages mounted on a printed circuit board, the semiconductor die of the present invention are affixed to the substrate and wire bonded in a SIP configuration. Omitting the encapsulated TSOP packages allows a reduction in the overall thickness of the USB flash memory device.
    Type: Grant
    Filed: February 2, 2015
    Date of Patent: December 22, 2015
    Assignee: SanDisk Technologies Inc.
    Inventors: Suresh Upadhyayula, Robert C. Miller, Hem Takiar, Steven Sprouse, Ka Ian Yung
  • Publication number: 20150155156
    Abstract: A low profile USB flash memory device, and methods of forming same, are disclosed. The USB flash memory device includes an integrated circuit memory portion and a USB connector. The memory portion and the USB connector may be integrally formed on the same substrate. The USB flash memory device includes a substrate on which is mounted one or more flash memory die, a controller die, passive components and an LED for indicating when the memory is being accessed. In contrast to prior art USB memory devices which used TSOP packages mounted on a printed circuit board, the semiconductor die of the present invention are affixed to the substrate and wire bonded in a SIP configuration. Omitting the encapsulated TSOP packages allows a reduction in the overall thickness of the USB flash memory device.
    Type: Application
    Filed: February 2, 2015
    Publication date: June 4, 2015
    Applicant: SANDISK TECHNOLOGIES INC.
    Inventors: Suresh Upadhyayula, Robert C. Miller, Hem Takiar, Steven Sprouse, Ka Ian Yung
  • Patent number: 8986050
    Abstract: In a particular embodiment, a connector includes a connector module and a set of conductive connectors coupled to the connector module. The set of conductive connectors is configured to electrically couple to a set of contacts of a memory module. The connector also includes a ground contact coupled to the connector module. The ground contact is configured to be coupled to a ground of the memory module and to a conductive shroud.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: March 24, 2015
    Assignee: Sandisk Technologies Inc.
    Inventors: Anthony King, Robert C. Miller, Suresh Upadhyayula
  • Patent number: 8947883
    Abstract: A low profile USB flash memory device, and methods of forming same, are disclosed. The USB flash memory device includes an integrated circuit memory portion and a USB connector. The memory portion and the USB connector may be integrally formed on the same substrate. The USB flash memory device includes a substrate on which is mounted one or more flash memory die, a controller die, passive components and an LED for indicating when the memory is being accessed. In contrast to prior art USB memory devices which used TSOP packages mounted on a printed circuit board, the semiconductor die of the present invention are affixed to the substrate and wire bonded in a SIP configuration. Omitting the encapsulated TSOP packages allows a reduction in the overall thickness of the USB flash memory device.
    Type: Grant
    Filed: December 27, 2007
    Date of Patent: February 3, 2015
    Assignee: SanDisk Technologies Inc.
    Inventors: Suresh Upadhyayula, Robert C. Miller, Hem Takiar, Steven Sprouse, Ka Ian Yung
  • Patent number: 8852999
    Abstract: A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.
    Type: Grant
    Filed: September 19, 2011
    Date of Patent: October 7, 2014
    Assignee: SanDisk Technologies Inc.
    Inventors: Hem Takiar, Robert C. Miller, Warren Middlekauff, Michael W. Patterson, Shrikar Bhagath
  • Publication number: 20140273558
    Abstract: In a particular embodiment, a connector includes a connector module and a set of conductive connectors coupled to the connector module. The set of conductive connectors is configured to electrically couple to a set of contacts of a memory module. The connector also includes a ground contact coupled to the connector module. The ground contact is configured to be coupled to a ground of the memory module and to a conductive shroud.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicant: SANDISK TECHNOLOGIES INC.
    Inventors: ANTHONY KING, ROBERT C. MILLER, SURESH UPADHYAYULA
  • Patent number: 8728864
    Abstract: A portable memory card formed from a multi-die assembly, and methods of fabricating same, are disclosed. One such multi-die assembly includes an LGA SiP semiconductor package and a leadframe-based SMT package both affixed to a PCB. The multi-die assembly thus formed may be encased within a standard lid to form a completed portable memory card, such as a standard SD™ card. Test pads on the LGA SiP package, used for testing operation of the package after it is fabricated, may also be used for physically and electrically coupling the LGA SiP package to the PCB.
    Type: Grant
    Filed: November 26, 2012
    Date of Patent: May 20, 2014
    Assignee: SanDisk Technologies Inc.
    Inventors: Ning Ye, Robert C. Miller, Cheemen Yu, Hem Takiar, Andre McKenzie
  • Publication number: 20140098483
    Abstract: A USB memory assembly, and methods of forming same, are disclosed. The USB memory assembly includes a USB memory device within a carrier. The carrier may in turn be received within a connector shell and lid.
    Type: Application
    Filed: October 10, 2012
    Publication date: April 10, 2014
    Applicant: SanDisk Technologies Inc.
    Inventor: Robert C. Miller
  • Patent number: 8637978
    Abstract: A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.
    Type: Grant
    Filed: September 19, 2011
    Date of Patent: January 28, 2014
    Assignee: SanDisk Technologies Inc.
    Inventors: Hem Takiar, Robert C. Miller, Warren Middlekauff, Michael W. Patterson, Shrikar Bhagath
  • Patent number: 8525511
    Abstract: A system monitors alternating current and includes a magneto-optical current transducer (MOCT) adapted to modulate an optical signal corresponding to magnitude of the alternating current. Beam splitters are in communication with the MOCT which are in turn connected to respective channels. Each channel includes an LED that is powered by a constant current source.
    Type: Grant
    Filed: December 11, 2007
    Date of Patent: September 3, 2013
    Assignee: ABB Technology AG
    Inventors: Robert M. Synder, Lenny Roland, Robert C. Miller, Anton Poeltl, Michael Mendik
  • Patent number: 8318535
    Abstract: A portable memory card formed from a multi-die assembly, and methods of fabricating same, are disclosed. One such multi-die assembly includes an LGA SiP semiconductor package and a leadframe-based SMT package both affixed to a PCB. The multi-die assembly thus formed may be encased within a standard lid to form a completed portable memory card, such as a standard SD™ card. Test pads on the LGA SiP package, used for testing operation of the package after it is fabricated, may also be used for physically and electrically coupling the LGA SiP package to the PCB.
    Type: Grant
    Filed: June 28, 2007
    Date of Patent: November 27, 2012
    Assignee: SanDisk Technologies Inc.
    Inventors: Ning Ye, Robert C. Miller, Cheemen Yu, Hem Takiar, Andre McKenzie
  • Patent number: 8167659
    Abstract: A memory card connector, within a slot of a host device, for receiving a first memory card having a first row of contact fingers and a second row of contact fingers and a second memory card having only a single row of contact fingers. The memory card connector includes a first row of contact pins, a second row of contact pins and a protrusion. The first row of contact pins are configured to mate with the first row of contact fingers of the first memory card. The second row of contact pins are configured to mate with the second row of contact fingers of the first memory card. The protrusion is received within a contact finger in the second row of contact fingers of the first memory card to allow full insertion of the first memory card into the connector, and abuts against a distal end of one of the contact fingers of the second memory card to prevent full insertion of the second memory card into the connector.
    Type: Grant
    Filed: January 3, 2011
    Date of Patent: May 1, 2012
    Assignee: SanDisk Technologies Inc.
    Inventor: Robert C. Miller
  • Publication number: 20120007226
    Abstract: A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.
    Type: Application
    Filed: September 19, 2011
    Publication date: January 12, 2012
    Inventors: Hem Takiar, Robert C. Miller, Warren Middlekauff, Michael W. Patterson, Shrikar Bhagath
  • Publication number: 20120009732
    Abstract: A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.
    Type: Application
    Filed: September 19, 2011
    Publication date: January 12, 2012
    Inventors: Hem Takiar, Robert C. Miller, Warren Middlekauff, Michael W. Patterson, Shrikar Bhagath
  • Patent number: D936508
    Type: Grant
    Filed: February 7, 2021
    Date of Patent: November 23, 2021
    Inventor: Robert C. Miller