Patents by Inventor Robert C. Miller
Robert C. Miller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9462705Abstract: A USB memory assembly, and methods of forming same, are disclosed. The USB memory assembly includes a USB memory device within a carrier. The carrier may in turn be received within a connector shell and lid.Type: GrantFiled: October 10, 2012Date of Patent: October 4, 2016Assignee: SanDisk Technologies LLCInventor: Robert C. Miller
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Patent number: 9218953Abstract: A low profile USB flash memory device, and methods of forming same, are disclosed. The USB flash memory device includes an integrated circuit memory portion and a USB connector. The memory portion and the USB connector may be integrally formed on the same substrate. The USB flash memory device includes a substrate on which is mounted one or more flash memory die, a controller die, passive components and an LED for indicating when the memory is being accessed. In contrast to prior art USB memory devices which used TSOP packages mounted on a printed circuit board, the semiconductor die of the present invention are affixed to the substrate and wire bonded in a SIP configuration. Omitting the encapsulated TSOP packages allows a reduction in the overall thickness of the USB flash memory device.Type: GrantFiled: February 2, 2015Date of Patent: December 22, 2015Assignee: SanDisk Technologies Inc.Inventors: Suresh Upadhyayula, Robert C. Miller, Hem Takiar, Steven Sprouse, Ka Ian Yung
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Publication number: 20150155156Abstract: A low profile USB flash memory device, and methods of forming same, are disclosed. The USB flash memory device includes an integrated circuit memory portion and a USB connector. The memory portion and the USB connector may be integrally formed on the same substrate. The USB flash memory device includes a substrate on which is mounted one or more flash memory die, a controller die, passive components and an LED for indicating when the memory is being accessed. In contrast to prior art USB memory devices which used TSOP packages mounted on a printed circuit board, the semiconductor die of the present invention are affixed to the substrate and wire bonded in a SIP configuration. Omitting the encapsulated TSOP packages allows a reduction in the overall thickness of the USB flash memory device.Type: ApplicationFiled: February 2, 2015Publication date: June 4, 2015Applicant: SANDISK TECHNOLOGIES INC.Inventors: Suresh Upadhyayula, Robert C. Miller, Hem Takiar, Steven Sprouse, Ka Ian Yung
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Patent number: 8986050Abstract: In a particular embodiment, a connector includes a connector module and a set of conductive connectors coupled to the connector module. The set of conductive connectors is configured to electrically couple to a set of contacts of a memory module. The connector also includes a ground contact coupled to the connector module. The ground contact is configured to be coupled to a ground of the memory module and to a conductive shroud.Type: GrantFiled: March 15, 2013Date of Patent: March 24, 2015Assignee: Sandisk Technologies Inc.Inventors: Anthony King, Robert C. Miller, Suresh Upadhyayula
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Patent number: 8947883Abstract: A low profile USB flash memory device, and methods of forming same, are disclosed. The USB flash memory device includes an integrated circuit memory portion and a USB connector. The memory portion and the USB connector may be integrally formed on the same substrate. The USB flash memory device includes a substrate on which is mounted one or more flash memory die, a controller die, passive components and an LED for indicating when the memory is being accessed. In contrast to prior art USB memory devices which used TSOP packages mounted on a printed circuit board, the semiconductor die of the present invention are affixed to the substrate and wire bonded in a SIP configuration. Omitting the encapsulated TSOP packages allows a reduction in the overall thickness of the USB flash memory device.Type: GrantFiled: December 27, 2007Date of Patent: February 3, 2015Assignee: SanDisk Technologies Inc.Inventors: Suresh Upadhyayula, Robert C. Miller, Hem Takiar, Steven Sprouse, Ka Ian Yung
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Patent number: 8852999Abstract: A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.Type: GrantFiled: September 19, 2011Date of Patent: October 7, 2014Assignee: SanDisk Technologies Inc.Inventors: Hem Takiar, Robert C. Miller, Warren Middlekauff, Michael W. Patterson, Shrikar Bhagath
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Publication number: 20140273558Abstract: In a particular embodiment, a connector includes a connector module and a set of conductive connectors coupled to the connector module. The set of conductive connectors is configured to electrically couple to a set of contacts of a memory module. The connector also includes a ground contact coupled to the connector module. The ground contact is configured to be coupled to a ground of the memory module and to a conductive shroud.Type: ApplicationFiled: March 15, 2013Publication date: September 18, 2014Applicant: SANDISK TECHNOLOGIES INC.Inventors: ANTHONY KING, ROBERT C. MILLER, SURESH UPADHYAYULA
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Patent number: 8728864Abstract: A portable memory card formed from a multi-die assembly, and methods of fabricating same, are disclosed. One such multi-die assembly includes an LGA SiP semiconductor package and a leadframe-based SMT package both affixed to a PCB. The multi-die assembly thus formed may be encased within a standard lid to form a completed portable memory card, such as a standard SD™ card. Test pads on the LGA SiP package, used for testing operation of the package after it is fabricated, may also be used for physically and electrically coupling the LGA SiP package to the PCB.Type: GrantFiled: November 26, 2012Date of Patent: May 20, 2014Assignee: SanDisk Technologies Inc.Inventors: Ning Ye, Robert C. Miller, Cheemen Yu, Hem Takiar, Andre McKenzie
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Publication number: 20140098483Abstract: A USB memory assembly, and methods of forming same, are disclosed. The USB memory assembly includes a USB memory device within a carrier. The carrier may in turn be received within a connector shell and lid.Type: ApplicationFiled: October 10, 2012Publication date: April 10, 2014Applicant: SanDisk Technologies Inc.Inventor: Robert C. Miller
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Patent number: 8637978Abstract: A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.Type: GrantFiled: September 19, 2011Date of Patent: January 28, 2014Assignee: SanDisk Technologies Inc.Inventors: Hem Takiar, Robert C. Miller, Warren Middlekauff, Michael W. Patterson, Shrikar Bhagath
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Patent number: 8525511Abstract: A system monitors alternating current and includes a magneto-optical current transducer (MOCT) adapted to modulate an optical signal corresponding to magnitude of the alternating current. Beam splitters are in communication with the MOCT which are in turn connected to respective channels. Each channel includes an LED that is powered by a constant current source.Type: GrantFiled: December 11, 2007Date of Patent: September 3, 2013Assignee: ABB Technology AGInventors: Robert M. Synder, Lenny Roland, Robert C. Miller, Anton Poeltl, Michael Mendik
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Patent number: 8318535Abstract: A portable memory card formed from a multi-die assembly, and methods of fabricating same, are disclosed. One such multi-die assembly includes an LGA SiP semiconductor package and a leadframe-based SMT package both affixed to a PCB. The multi-die assembly thus formed may be encased within a standard lid to form a completed portable memory card, such as a standard SD™ card. Test pads on the LGA SiP package, used for testing operation of the package after it is fabricated, may also be used for physically and electrically coupling the LGA SiP package to the PCB.Type: GrantFiled: June 28, 2007Date of Patent: November 27, 2012Assignee: SanDisk Technologies Inc.Inventors: Ning Ye, Robert C. Miller, Cheemen Yu, Hem Takiar, Andre McKenzie
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Patent number: 8167659Abstract: A memory card connector, within a slot of a host device, for receiving a first memory card having a first row of contact fingers and a second row of contact fingers and a second memory card having only a single row of contact fingers. The memory card connector includes a first row of contact pins, a second row of contact pins and a protrusion. The first row of contact pins are configured to mate with the first row of contact fingers of the first memory card. The second row of contact pins are configured to mate with the second row of contact fingers of the first memory card. The protrusion is received within a contact finger in the second row of contact fingers of the first memory card to allow full insertion of the first memory card into the connector, and abuts against a distal end of one of the contact fingers of the second memory card to prevent full insertion of the second memory card into the connector.Type: GrantFiled: January 3, 2011Date of Patent: May 1, 2012Assignee: SanDisk Technologies Inc.Inventor: Robert C. Miller
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Publication number: 20120007226Abstract: A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.Type: ApplicationFiled: September 19, 2011Publication date: January 12, 2012Inventors: Hem Takiar, Robert C. Miller, Warren Middlekauff, Michael W. Patterson, Shrikar Bhagath
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Publication number: 20120009732Abstract: A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.Type: ApplicationFiled: September 19, 2011Publication date: January 12, 2012Inventors: Hem Takiar, Robert C. Miller, Warren Middlekauff, Michael W. Patterson, Shrikar Bhagath
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Patent number: 8022519Abstract: A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.Type: GrantFiled: May 19, 2005Date of Patent: September 20, 2011Assignee: SanDisk Technologies Inc.Inventors: Hem Takiar, Robert C. Miller, Warren Middlekauff, Michael W. Patterson, Shrikar Bhagath
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Patent number: 8000502Abstract: A portable memory storage device is disclosed where access to information on the device is granted only upon proper biometric authentication of a user. The device includes a controller, a non-volatile memory which may be a flash memory, and a biometric scanner system for controlling access to the information within the non-volatile memory. Each of the controller, non-volatile memory and biometric scanner system may be mounted in a base of the portable device, with the biometric system having an exposed surface on a top portion of the base for accepting biometric data such as a fingerprint. A cover is provided which includes a USB connector capable of mating within a USB port of the host device to establish communications between the portable and host devices. The cover also covers the exposed portion of the biometric scanner to protect the sensor when the portable memory storage device is not in use.Type: GrantFiled: March 9, 2005Date of Patent: August 16, 2011Assignee: SanDisk Technologies Inc.Inventors: Sanjay Dave, Kevin M. Conley, Michael Morganstern, Wesley G. Brewer, Robert C. Miller, Yishai Kagan, Jean-Christophe Klein, Jeff Salazar, Daniel Kennedy, Robert Howard, Matt Peterson, Joel Jacobs
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Publication number: 20110097938Abstract: A memory card connector, within a slot of a host device, for receiving a first memory card having a first row of contact fingers and a second row of contact fingers and a second memory card having only a single row of contact fingers. The memory card connector includes a first row of contact pins, a second row of contact pins and a protrusion. The first row of contact pins are configured to mate with the first row of contact fingers of the first memory card. The second row of contact pins are configured to mate with the second row of contact fingers of the first memory card. The protrusion is received within a contact finger in the second row of contact fingers of the first memory card to allow full insertion of the first memory card into the connector, and abuts against a distal end of one of the contact fingers of the second memory card to prevent full insertion of the second memory card into the connector.Type: ApplicationFiled: January 3, 2011Publication date: April 28, 2011Inventor: Robert C. Miller
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Patent number: D638431Type: GrantFiled: April 7, 2010Date of Patent: May 24, 2011Assignee: SanDisk CorporationInventors: Itzhak Pomerantz, Robert C. Miller
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Patent number: D936508Type: GrantFiled: February 7, 2021Date of Patent: November 23, 2021Inventor: Robert C. Miller