Patents by Inventor Robert C. Morelock

Robert C. Morelock has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronics assembly with improved heatsink configuration
    Patent number: 6657866
    Abstract: An electronic assembly 10 is provided, including a substrate 12 having a first a second side 16, and at least one opening 18, and a power device 20 mounted on side 14, positioned over said at least one opening 18, and in thermal communication with said at least one power device 20 through the at least one opening 18.
    Type: Grant
    Filed: March 15, 2002
    Date of Patent: December 2, 2003
    Inventor: Robert C. Morelock
  • ELECTRONICS ASSEMBLY WITH IMPROVED HEATSINK CONFIGURATION
    Publication number: 20030174469
    Abstract: An electronic assembly 10 is provided, including a substrate 12 having a first side 14, a second side 16, and at least one opening 18, and a power device 20 mounted on said first side 14, positioned over said at least one opening 18, and in thermal communication with said at least one power device 20 through the at least one opening 18.
    Type: Application
    Filed: March 15, 2002
    Publication date: September 18, 2003
    Inventor: Robert C. Morelock