Abstract: Development electrode wires for use in a Scavengless or Hybrid Scavengless Development system are treated using Ion Implantation so as to minimize the creation of charge potential between the electrode wires and developer material during frictional contact therebetween. Treatment of the wires using Ion Implantation for minimizing the creation of a charge potential is effected without diminishing the hardness of the wire material. In fact, wire hardness and resistance to wire contamination are enhanced using Ion Implantation in fabricating the wires. A bare wire used for the electrode is first plated with a Gold/Platinum alloy. The ions become implanted in the substrate without altering the surface finish of the wire electrodes yet alter the tribo-charging properties or Electronegativity of the wire. The result of Ion Implantation is to tune or match the Electronegativity of the electrode wire with the Electronegativity of the toner material used in the development system.

Abstract: A cleaning apparatus having a spots cleaning blade to remove residual agglomerations of particles from the imaging surface. The spots cleaning blade is made from a material that has a low coefficient of friction, low resilience and higher hardness than a standard spots blade. These properties enable the spots cleaning blade to provide a continuous slidable contact with the imaging surface to remove residual particles therefrom. Additionally, an electrically conductive surface can be added to the front or back surface of the blade to cause toner particles to be repelled from and cloud near the blade where they can be removed by a vacuum device or the like. The conductive surface may be direct negative, direct positive or A-C potential to provide the necessary repelling force.