Patents by Inventor Robert C. Schaffer

Robert C. Schaffer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Selective shield/material flow mechanism
    Patent number: 7425256
    Abstract: An apparatus and method for plating a workpiece. The apparatus comprises, generally, an anode, a cathode, and a selective anode shield/material flow assembly. In use, both the anode and the cathode are immersed in a solution, and the cathode is used to support the workpiece. During an electroplating process, the anode and the cathode generate an electric field emanating from the anode towards the cathode, to generate a corresponding current to deposit an electroplating material on the workpiece. The selective shield/material flow assembly is located between the anode and the cathode, and forms a multitude of adjustable openings. These opening have sizes that are adjustable during the electroplating process for selectively and controllably adjusting the amount of electric flux passing through the selective shield/material flow assembly and the distribution of the electroplating material on the workpiece. The selective shield/material flow assembly can also be used with an electroless plating system.
    Type: Grant
    Filed: September 14, 2007
    Date of Patent: September 16, 2008
    Assignee: International Business Machines Corporation
    Inventors: Ralph A. Barrese, Gary Gajdorus, Allen H. Hopkins, John J. Konrad, Robert C. Schaffer, Timothy L. Wells
  • Selective shield/material flow mechanism
    Patent number: 7288177
    Abstract: An apparatus and method for plating a workpiece. The apparatus comprises, generally, an anode, a cathode, and a selective anode shield/material flow assembly. In use, both the anode and the cathode are immersed in a solution, and the cathode is used to support the workpiece. During an electroplating process, the anode and the cathode generate an electric field emanating from the anode towards the cathode, to generate a corresponding current to deposit an electroplating material on the workpiece. The selective shield/material flow assembly is located between the anode and the cathode, and forms a multitude of adjustable openings. These opening have sizes that are adjustable during the electroplating process for selectively and controllably adjusting the amount of electric flux passing through the selective shield/material flow assembly and the distribution of the electroplating material on the workpiece. The selective shield/material flow assembly can also be used with an electroless plating system.
    Type: Grant
    Filed: March 30, 2004
    Date of Patent: October 30, 2007
    Assignee: International Business Machines Corporation
    Inventors: Ralph A. Barrese, Gary Gajdorus, Allen H. Hopkins, John J. Konrad, Robert C. Schaffer, Timothy L. Wells
  • Selective shield/material flow mechanism
    Patent number: 6746578
    Abstract: An apparatus and method for plating a workpiece. The apparatus comprises, generally, an anode, a cathode, and a selective anode shield/material flow assembly. In use, both the anode and the cathode are immersed in a solution, and the cathode is used to support the workpiece. During an electroplating process, the anode and the cathode generate an electric field emanating from the anode towards the cathode, to generate a corresponding current to deposit an electroplating material on the workpiece. The selective shield/material flow assembly is located between the anode and the cathode, and forms a multitude of adjustable openings. These opening have sizes that are adjustable during the electroplating process for selectively and controllably adjusting the amount of electric flux passing through the selective shield/material flow assembly and the distribution of the electroplating material on the workpiece. The selective shield/material flow assembly can also be used with an electroless plating system.
    Type: Grant
    Filed: May 31, 2001
    Date of Patent: June 8, 2004
    Assignee: International Business Machines Corporation
    Inventors: Ralph A. Barrese, Gary Gajdorus, Allen H. Hopkins, John J. Konrad, Robert C. Schaffer, Timothy L. Wells
  • Selective shield/material flow mechanism
    Publication number: 20020179450
    Abstract: An apparatus and method for plating a workpiece. The apparatus comprises, generally, an anode, a cathode, and a selective anode shield/material flow assembly. In use, both the anode and the cathode are immersed in a solution, and the cathode is used to support the workpiece. During an electroplating process, the anode and the cathode generate an electric field emanating from the anode towards the cathode, to generate a corresponding current to deposit an electroplating material on the workpiece. The selective shield/material flow assembly is located between the anode and the cathode, and forms a multitude of adjustable openings. These opening have sizes that are adjustable during the electroplating process for selectively and controllably adjusting the amount of electric flux passing through the selective shield/material flow assembly and the distribution of the electroplating material on the workpiece. The selective shield/material flow assembly can also be used with an electroless plating system.
    Type: Application
    Filed: May 31, 2001
    Publication date: December 5, 2002
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Ralph A. Barrese, Gary Gajdorus, Allen H. Hopkins, John J. Konrad, Robert C. Schaffer, Timothy L. Wells