Abstract: In one embodiment, an interposer may include a top surface, a bottom surface, a ground plane disposed between the top surface and bottom surface, an array of top contacts on the top surface, a corresponding array of bottom contacts on the bottom surface, a plurality of through connections between corresponding top and bottom contacts, and a plurality of ground conductors interspersed with the plurality of through connections. The array of top contacts may be configured to interface with a first component above the interposer. The array of bottom contacts may be configured to interface with a second component beneath the interposer. The ground conductors may extend orthogonally through, and be electrically connected to, the ground plane.

Abstract: An interposer comprising an array of top contacts on the top surface configured to interface with an integrated circuit package, a corresponding array of bottom contacts on the bottom surface configured to interface with a component beneath the interposer, through connections between corresponding top and bottom contacts and a plurality of signal probe points on the edge surface. The interposer may include an electrical pathway connecting a first through connection to a first signal probe point. The electrical pathway may contact the first through connection at a first intersection. A resistor may be disposed along the electrical pathway, between the first intersection and the first signal probe point. The electrical pathway from the first intersection to the resistor may be an unconditioned signal pathway. The electrical pathway from the resistor to the first signal contact may be a conditioned signal pathway. The unconditioned signal pathway may have a length of not greater than 0.20 inch.

Abstract: An interposer comprising an array of top contacts on the top surface configured to interface with an integrated circuit package, a corresponding array of bottom contacts on the bottom surface configured to interface with a component beneath the interposer, through connections between corresponding top and bottom contacts and a plurality of signal probe points on the edge surface. The interposer may include an electrical pathway connecting a first through connection to a first signal probe point. The electrical pathway may contact the first through connection at a first intersection. A resistor may be disposed along the electrical pathway, between the first intersection and the first signal probe point. The electrical pathway from the first intersection to the resistor may be an unconditioned signal pathway. The electrical pathway from the resistor to the first signal contact may be a conditioned signal pathway. The unconditioned signal pathway may have a length of not greater than 0.20 inch.

Abstract: An interposer is shown with contact points on a lateral edge. When assembled between a board under test and an integrated circuit, traces of the interposer carry signals between the board under test and the integrated circuit and also between signal lines of the integrated circuit and the lateral edge contact points. The signals can then be accessed by test equipment at the lateral edge contact points. The interposer may include additional components connected to the traces.

Abstract: A test assembly that may provide access to signals of a circuit that includes an integrated circuit. The test assembly may include structural members that limit movement of components relative to each other.

Abstract: A component interposer provides access to signals communicated between an integrated circuit and control circuit board. The component interposer may include a signal circuit board and a socket. The board may include one or more electrical contacts that may be used to sample a signal. The socket may include first and second portions. The first portion may include a surface that contacts with the control circuit board. The first portion may have a first width and first length. The second portion may have a surface that contacts the signal board. The second portion may have a second width and second length. The first length may be smaller than the second length, the first width may be smaller than the second width, or both. The socket may include an overhang that defines a space or void. The socket may include one or more pins for aligning the signal board and the socket. The component interposer may include one or more fasteners.

Abstract: A test assembly that may provide access to signals of a circuit that includes an integrated circuit. The test assembly may include structural members that limit movement of components relative to each other.