Abstract: The present invention relates to methods and compounds for regulating or enhancing erthropoiesis and iron metabolism, and for treating or preventing iron deficiency and anemia of chronic disease.

Abstract: The present invention relates to methods and compounds for regulating or enhancing erthropoiesis and iron metabolism, and for treating or preventing iron deficiency and anemia of chronic disease.

Abstract: The present invention relates to methods and compounds for regulating or enhancing erthropoiesis and iron metabolism, and for treating or preventing iron deficiency and anemia of chronic disease.

Abstract: A system for automatic spreading resistance profiling of wafer specimens. The system comprises a positioning stage for positioning the specimens for contact by probe tips and alternately a probe conditioning fixture or a sample calibration fixture. The system further comprises a programmed computer for controlling the positioning stage to effect automatic specimen profiling, probe tip conditioning, and calibration.

Abstract: An apparatus for the measurement of electrical properties of a semiconductor wafer is disclosed. A top contact mercury probe for contacting the upper surface of a wafer body is provided. The mercury probe is held by a kinematically stable probe arm which provides for very controlled movement of the mercury probe. A semiconductor wafer body horizontal and rotational movement system is provided for moving the wafer body to provide mapping capability. A top side return contact for doing measurements on wafer bodies with insulating substrates is disclosed. The top side return contact is also provided with a self-levelling and raising function, which ensures the bottom surface of the contact member to intimately contact the upper surface of the wafer body when desired, and also to raise the contact member off the wafer body when the bottom contact underneath the wafer is utilized.

Abstract: Apparatus for abrading workpieces, particularly semiconductor wafers, characterized in that the workpiece is disposed on an abrading material in a lapping and polishing tray carried on a generally horizontal support plate. The plate is caused to oscillate or eccentrically rotate by a single, centrally located eccentric arm, the plate being restrained against rotary movement about the eccentric arm by resilient means which extend between stationary pins arranged around the support plate and points on the support plate intermediate the pins.