Abstract: An electronic package comprising an interfacial coating between a first inorganic barrier coating and a second inorganic barrier coating, wherein the interfacial coating comprises a cured product of a silicone resin; and methods of preparing the electronic package.

Abstract: An organic light-emitting diode comprising a first and second barrier coating, wherein the barrier coating is selected from (i) amorphous silicon carbide, (ii) an amorphous silicon carbide alloy comprising at least one element selected from F, N, B, and P, (iii) hydrogenated silicon oxycarbide, (iv) a coating prepared by (a) curing a hydrogen silsesquioxane resin with an electron beam or (b) reacting a hydrogen silsesquioxane resin using a chemical vapor deposition process; and (v) a mutilayer combination of at least two of (i), (ii), (iii), and (iv).