Abstract: Various technologies described herein pertain to a sensor for an autonomous vehicle that includes one or more heat dissipation features. A sensor includes a top cover and a bottom cover, where the top cover and the bottom cover form at least a portion of a casing of the sensor. The sensor includes a coldplate, a first printed circuit board, and a second printed circuit board. A top side of the first printed circuit board is coupled to the top cover and a bottom side of the first printed circuit board is coupled to a top side of the coldplate. A top side of the second printed circuit board is coupled to a bottom side of the coldplate and a bottom side of the second printed circuit board is coupled to the bottom cover. Various features described herein enhance heat transfer from components on the first and second printed circuit boards.

Abstract: An example automated driving system computer can include a board, one or more processors coupled to the board, a first layer of a first thermal interface material applied on the one or more processors, a heat spreader having a first side and a second side, the first side in contact with the first layer of the first thermal interface material, a second layer of a second thermal interface material applied on the second side of the heat spreader, and a cold plate in contact with the second layer of the second thermal interface material.

Abstract: An example sensor bracket assembly can include one or more cold plates forming a core bracket structure, wherein the core bracket structure and the one or more cold plates provide structural support for the sensor bracket assembly; a housing enclosing the core bracket structure; one or more sensor mounts for mounting one or more sensors on the sensor bracket assembly; and one or more attachment portions for attaching the sensor bracket assembly to a body of a vehicle.

Abstract: The subject disclosure relates to a water-tight sealed stud assembly for high current applications. The water-tight sealed stud assembly can include a stud, a sealing ring, a sleeve, and a body. The stud may have a stud base and a thickened portion having an annular groove. The sealing ring may be disposed in the annular groove. The sleeve may be disposed circumferentially around the stud and made of a conductive material. The body may be disposed circumferentially around the sleeve and made of a non-conductive material. Systems and methods are also provided.

Abstract: Various technologies described herein pertain to a sensor for an autonomous vehicle that includes one or more heat dissipation features. A sensor includes a top cover and a bottom cover, where the top cover and the bottom cover form at least a portion of a casing of the sensor. The sensor includes a coldplate, a first printed circuit board, and a second printed circuit board. A top side of the first printed circuit board is coupled to the top cover and a bottom side of the first printed circuit board is coupled to a top side of the coldplate. A top side of the second printed circuit board is coupled to a bottom side of the coldplate and a bottom side of the second printed circuit board is coupled to the bottom cover. Various features described herein enhance heat transfer from components on the first and second printed circuit boards.

Abstract: An example sensor bracket assembly can include one or more cold plates forming a core bracket structure, wherein the core bracket structure and the one or more cold plates provide structural support for the sensor bracket assembly; a housing enclosing the core bracket structure; one or more sensor mounts for mounting one or more sensors on the sensor bracket assembly; and one or more attachment portions for attaching the sensor bracket assembly to a body of a vehicle.

Abstract: Two-phase cooling systems for autonomous driving super computers (ADSC) are described herein. In some examples, a two-phase cooling system can include a flow channel configured to circulate a flow; an evaporative heat exchanger comprising an inlet for receiving fluid from the flow channel and an outlet for releasing vapor generated from the fluid, the evaporative heat exchanger being configured to collect heat from components of the ADSC and transfer the heat away via the vapor released from the first outlet; a condensing heat exchanger configured to condense the vapor and remove latent heat associated with the vapor, the condensing heat exchanger comprising an inlet to the flow channel for receiving the vapor and an outlet to the flow channel for discharging fluid generated by condensing the vapor; and a pump configured to receive the fluid from the condensing heat exchanger and circulate the fluid to the evaporative heat exchanger.

Abstract: The subject disclosure relates to a water-tight sealed stud assembly for high current applications. The water-tight sealed stud assembly can include a stud, a sealing ring, a sleeve, and a body. The stud may have a stud base and a thickened portion having an annular groove. The sealing ring may be disposed in the annular groove. The sleeve may be disposed circumferentially around the stud and made of a conductive material. The body may be disposed circumferentially around the sleeve and made of a non-conductive material. Systems and methods are also provided.

Abstract: An example automated driving system computer can include a board, one or more processors coupled to the board, a first layer of a first thermal interface material applied on the one or more processors, a heat spreader having a first side and a second side, the first side in contact with the first layer of the first thermal interface material, a second layer of a second thermal interface material applied on the second side of the heat spreader, and a cold plate in contact with the second layer of the second thermal interface material.

Abstract: Two-phase cooling systems for autonomous driving super computers (ADSC) are described herein. In some examples, a two-phase cooling system can include a flow channel configured to circulate a flow; an evaporative heat exchanger comprising an inlet for receiving fluid from the flow channel and an outlet for releasing vapor generated from the fluid, the evaporative heat exchanger being configured to collect heat from components of the ADSC and transfer the heat away via the vapor released from the first outlet; a condensing heat exchanger configured to condense the vapor and remove latent heat associated with the vapor, the condensing heat exchanger comprising an inlet to the flow channel for receiving the vapor and an outlet to the flow channel for discharging fluid generated by condensing the vapor; and a pump configured to receive the fluid from the condensing heat exchanger and circulate the fluid to the evaporative heat exchanger.