Patents by Inventor Robert Carl Burket
Robert Carl Burket has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20190119150Abstract: A method for processing a transparent workpiece includes forming a closed contour line having a plurality of defects in the transparent workpiece such that the closed contour line defines a closed contour. Forming the closed contour line includes directing a pulsed laser beam through an aspheric optical element and into the transparent workpiece such that a portion of the pulsed laser beam directed into the transparent workpiece generates an induced absorption within the transparent workpiece, the induced absorption producing a defect within the transparent workpiece, and translating the transparent workpiece and the pulsed laser beam relative to each other along the closed contour line. The method further includes etching the transparent workpiece with a chemical etching solution at an etching rate of about 2.Type: ApplicationFiled: October 17, 2018Publication date: April 25, 2019Inventors: Robert Carl Burket, Daniel Wayne Levesque, JR., Sasha Marjanovic, Garrett Andrew Piech, Heather Nicole Vanselous, Kristopher Allen Wieland
-
Patent number: 9802855Abstract: A method of fabricating a high-density array of holes in glass is provided, comprising providing a glass piece having a front surface, then irradiating the front surface of the glass piece with a UV laser beam focused to a focal point within +/?100 ?m of the front surface of the glass piece most desirably within +/?50 ?m of the front surface. The lens focusing the laser has a numerical aperture desirably in the range of from 0.1 to 0.4, more desirably in the range of from 0.1 to 0.15 for glass thickness between 0.3 mm and 0.63 mm, even more desirably in the range of from 0.12 to 0.13, so as to produce open holes extending into the glass piece 100 from the front surface 102 of the glass piece, the holes having an diameter the in range of from 5 to 15 ?m, and an aspect ratio of at least 20:1. For thinner glass, in the range of from 0.1-0.3 mm, the numerical aperture is desirably from 0.25 to 0.4, more desirably from 0.25 to 0.Type: GrantFiled: December 17, 2015Date of Patent: October 31, 2017Assignee: CORNING INCORPORATEDInventors: Heather Debra Boek, Robert Carl Burket, Daniel Ralph Harvey, Alexander Mikhailovich Streltsov
-
Patent number: 9745220Abstract: A method etching a glass material comprises providing an etchant comprising 10-30% HF, 5-15% HNO3,and at least 10% H3PO4 by volume constituted such that the ratio HF:HNO3 by volume is in the range of 1.7:1 to 2.3:1, providing a glass material to be etched, and contacting the glass material with the etchant. The etchant desirably has no other acid components. The method may be performed with the etchant temperature within the range of 20-30° C. The glass material may be an aluminosilicate glass. Ultrasound energy may be applied to the etchant, to the glass material, or both.Type: GrantFiled: June 20, 2014Date of Patent: August 29, 2017Assignee: Corning IncorporatedInventors: Robert Carl Burket, Benedict Yorke Johnson, Samuel Odei Owusu, Tammy Lynn Petriwsky
-
Patent number: 9656909Abstract: Methods for forming vias in glass substrates by laser drilling and acid etching are disclosed. In one embodiment, a method forming a via in a glass substrate includes laser drilling the via through at least a portion of a thickness of the glass substrate from an incident surface of the glass substrate. The method further includes etching the glass substrate for an etching duration to increase a diameter of an incident opening of the via and applying ultrasonic energy to the glass substrate during at least a portion of the etching duration. The applied ultrasonic energy has a frequency between 40 kHz and 192 kHz.Type: GrantFiled: December 17, 2015Date of Patent: May 23, 2017Assignee: CORNING INCORPORATEDInventors: Robert Carl Burket, Uta-Barbara Goers, Samuel Odei Owusu, Tammy Lynn Petriwsky
-
Publication number: 20160145149Abstract: A method etching a glass material comprises providing an etchant comprising 10-30% HF, 5-15% HNO3, and at least 10% H3PO4 by volume constituted such that the ratio HF:HNO3 by volume is in the range of 1.7:1 to 2.3:1, providing a glass material to be etched, and contacting the glass material with the etchant. The etchant desirably has no other acid components. The method may be performed with the etchant temperature within the range of 20-30° C. The glass material may be an aluminosilicate glass. Ultrasound energy may be applied to the etchant, to the glass material, or both.Type: ApplicationFiled: June 20, 2014Publication date: May 26, 2016Inventors: Robert Carl Burket, Benedict Yorke Johnson, Samuel Odei Owusu, Tammy Lynn Petriwsky
-
Publication number: 20160107925Abstract: Methods for forming vias in glass substrates by laser drilling and acid etching are disclosed. In one embodiment, a method forming a via in a glass substrate includes laser drilling the via through at least a portion of a thickness of the glass substrate from an incident surface of the glass substrate. The method further includes etching the glass substrate for an etching duration to increase a diameter of an incident opening of the via and applying ultrasonic energy to the glass substrate during at least a portion of the etching duration. The applied ultrasonic energy has a frequency between 40 kHz and 192 kHz.Type: ApplicationFiled: December 17, 2015Publication date: April 21, 2016Inventors: Robert Carl Burket, Uta-Barbara Goers, Samuel Odei Owusu, Tammy Lynn Petriwisky
-
Publication number: 20160102009Abstract: A method of fabricating a high-density array of holes in glass is provided, comprising providing a glass piece having a front surface, then irradiating the front surface of the glass piece with a UV laser beam focused to a focal point within +/?100 ?m of the front surface of the glass piece most desirably within +/?50 ?m of the front surface. The lens focusing the laser has a numerical aperture desirably in the range of from 0.1 to 0.4, more desirably in the range of from 0.1 to 0.15 for glass thickness between 0.3 mm and 0.63 mm, even more desirably in the range of from 0.12 to 0.13, so as to produce open holes extending into the glass piece 100 from the front surface 102 of the glass piece, the holes having an diameter the in range of from 5 to 15 ?m, and an aspect ratio of at least 20:1. For thinner glass, in the range of from 0.1-0.3 mm, the numerical aperture is desirably from 0.25 to 0.4, more desirably from 0.25 to 0.Type: ApplicationFiled: December 17, 2015Publication date: April 14, 2016Inventors: Heather Debra Boek, Robert Carl Burket, Daniel Ralph Harvey, Alexander Mikhailovich Streltsov
-
Patent number: 9296646Abstract: Methods for forming vias in glass substrates by laser drilling and acid etching are disclosed. In one embodiment, a method forming a via in a glass substrate includes laser drilling the via through at least a portion of a thickness of the glass substrate from an incident surface of the glass substrate. The method further includes etching the glass substrate for an etching duration to increase a diameter of an incident opening of the via and applying ultrasonic energy to the glass substrate during at least a portion of the etching duration. The applied ultrasonic energy has a frequency between 40 kHz and 192 kHz.Type: GrantFiled: August 21, 2014Date of Patent: March 29, 2016Assignee: Corning IncorporatedInventors: Robert Carl Burket, Uta-Barbara Goers, Samuel Odei Owusu, Tammy Lynn Petriwsky
-
Patent number: 9278886Abstract: A method of fabricating a high-density array of holes in glass is provided, comprising providing a glass piece having a front surface, then irradiating the front surface of the glass piece with a UV laser beam focused to a focal point within +/?100 ?m of the front surface of the glass piece most desirably within +/?50 ?m of the front surface. The lens focusing the laser has a numerical aperture desirably in the range of from 0.1 to 0.4, more desirably in the range of from 0.1 to 0.15 for glass thickness between 0.3 mm and 0.63 mm, even more desirably in the range of from 0.12 to 0.13, so as to produce open holes extending into the glass piece 100 from the front surface 102 of the glass piece, the holes having an diameter the in range of from 5 to 15 ?m, and an aspect ratio of at least 20:1. For thinner glass, in the range of from 0.1-0.3 mm, the numerical aperture is desirably from 0.25 to 0.4, more desirably from 0.25 to 0.Type: GrantFiled: November 30, 2011Date of Patent: March 8, 2016Assignee: Corning IncorporatedInventors: Heather Debra Boek, Robert Carl Burket, Daniel Ralph Harvey, Alexander Mikhailovich Streltsov
-
Publication number: 20130247615Abstract: A method of fabricating a high-density array of holes in glass is provided, comprising providing a glass piece having a front surface, then irradiating the front surface of the glass piece with a UV laser beam focused to a focal point within +/?100 ?m of the front surface of the glass piece most desirably within +/?50 ?m of the front surface. The lens focusing the laser has a numerical aperture desirably in the range of from 0.1 to 0.4, more desirably in the range of from 0.1 to 0.15 for glass thickness between 0.3 mm and 0.63 mm, even more desirably in the range of from 0.12 to 0.13, so as to produce open holes extending into the glass piece 100 from the front surface 102 of the glass piece, the holes having an diameter the in range of from 5 to 15 ?m, and an aspect ratio of at least 20:1. For thinner glass, in the range of from 0.1-0.3 mm, the numerical aperture is desirably from 0.25 to 0.4, more desirably from 0.25 to 0.Type: ApplicationFiled: November 30, 2011Publication date: September 26, 2013Inventors: Heather Debra Boek, Robert Carl Burket, Daniel Ralph Harvey, Alexander Mikhailovich Streltsov