Abstract: Exemplary semiconductor processing systems may include a gas source coupled with a number of processing chambers. The gas source may include a controller. Each chamber may include an exhaust assembly having a foreline and a pump. The systems may include at least one abatement system coupled with each pump. The systems may include a plurality of exhaust lines that extend between each pump and the abatement system. The systems may include a dilution gas source coupled with each exhaust line. The systems may include a mass flow controller coupled between the dilution gas source and each exhaust line. The systems may include a temperature sensor coupled with each exhaust line between the pump and the abatement system. The temperature sensor may be communicatively coupled with the controller of the gas source, which may control flow of a gas to a chamber based on a measurement from the temperature sensor.

Abstract: Process for reducing the height of a box to the level of the apex of the stack of objects therein, wherein horizontal score lines are made at a height substantially equal to that of the apex of the stack of objects and such that the distance between the apex and the top of the box is greater than the half-width of the box. During a phase of simultaneous folding of the upper parts of the two side walls parallel to the length of the box toward the centre thereof, and before the upper edges or ridges of the upper parts meet, the angles of inclination of the upper parts are differentiated with respect to one another so that, when the upper parts meet, the upper edge of one covers the upper edge of the other, the upper parts sliding over one another during the final phase of folding the latter.

Abstract: Embodiments described herein generally relate to plasma assisted or plasma enhanced processing chambers. More specifically, embodiments herein relate to electrostatic chucking (ESC) substrate supports configured to provide pulsed DC voltage, and methods of applying a pulsed DC voltage, to a substrate during plasma assisted or plasma enhanced semiconductor manufacturing processes.

Abstract: Method and machine for reducing the height of a box without removing a section of the material of the box and without the use of any cutting tool whatsoever, but by folding high sections of side walls towards the centre of the box. The method includes: breaking the connections between the side walls along the upper section of the vertical ridges of the box, from the height of the vertical walls of the box to the level of the top of the stack of objects previously positioned in the box, by exerting a force, directed towards the exterior of the box, on the high section of at least two of the side walls; simultaneously folding towards the exterior the high sections on which force is exerted; then folding all the high sections towards the interior of the box, in order to bring the side walls into a substantially horizontal plane.

Abstract: Embodiments described herein generally relate to plasma assisted or plasma enhanced processing chambers. More specifically, embodiments herein relate to electrostatic chucking (ESC) substrate supports configured to provide pulsed DC voltage, and methods of applying a pulsed DC voltage, to a substrate during plasma assisted or plasma enhanced semiconductor manufacturing processes.

Abstract: Method and machine for reducing the height of a box without removing a section of the material of the box and without the use of any cutting tool whatsoever, but by folding high sections of side walls towards the centre of the box. The method includes: breaking the connections between the side walls along the upper section of the vertical ridges of the box, from the height of the vertical walls of the box to the level of the top of the stack of objects previously positioned in the box, by exerting a force, directed towards the exterior of the box, on the high section of at least two of the side walls; simultaneously folding towards the exterior the high sections on which force is exerted; then folding all the high sections towards the interior of the box, in order to bring the side walls into a substantially horizontal plane.

Abstract: Process for reducing the height of a box to the level of the apex of the stack of objects therein, wherein horizontal score lines are made at a height substantially equal to that of the apex of the stack of objects and such that the distance between the apex and the top of the box is greater than the half-width of the box. During a phase of simultaneous folding of the upper parts of the two side walls parallel to the length of the box toward the centre thereof, and before the upper edges or ridges of the upper parts meet, the angles of inclination of the upper parts are differentiated with respect to one another so that, when the upper parts meet, the upper edge of one covers the upper edge of the other, the upper parts sliding over one another during the final phase of folding the latter.

Abstract: A method for storing and distributing various articles, according to which the objects are stored on the trays of a rack structure. A suitable extraction system driven by a control and command system is movable in front of the rack structure in such a way that the extraction system is aligned in front of the bay of a tray carrying the stock of articles corresponding to the selected object so as to remove at least one of the articles. Objects or articles having the same reference are stored adjacent to each other on the upper side of one or several freely moving continuous conveyor belts, the conveyor belt(s) forming the receiving surface for one of the different bays of a storage tray. The conveyor belts are selectively motorized, causing the articles carried by the conveyor belts to be moved in the direction of a point of removal.