Patents by Inventor ROBERT CHOO

ROBERT CHOO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Laboratory experiment data exploration and visualization
    Patent number: 11955207
    Abstract: The disclosure provides systems and methods for data analysis of experimental data. The analysis can include reference data that are not directly generated from the present experiment, which reference data may be values of the experimental parameters that were either provided by a user, computed by the system with input from a user, or computed by the system without using any input from a user. Another example of such reference data may be information about the instrument, such as the calibration method of the instrument.
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: April 9, 2024
    Assignee: Emerald Cloud Lab, Inc.
    Inventors: Alex M. Yoshikawa, Anand V. Sastry, Asuka Ota, Ben C. Kline, Bradley M. Bond, Brian M. Frezza, Cameron R. Lamoureux, Catherine L. Hofler, Cheri Y. Li, Courtney E. Webster, Daniel J. Kleinbaum, George N. Stanley, George W. Fraser, Guillaume Robichaud, Hayley E. Buchman, James R. McKernan, Jonathan K. Leung, Paul R. Zurek, Robert M. Teed, Ruben E. Valas, Sean M. Fitzgerald, Sergio I. Villarreal, Shayna L. Hilburg, Shivani S. Baisiwala, Srikant Vaithilingam, Wyatt J. Woodson, Yang Choo, Yidan Y. Cong
  • High power thermally conductive radio frequency absorbers
    Patent number: 11508674
    Abstract: Radio frequency (“RF”) absorbing devices used as RF termination devices or free space absorbers, for example, are formed with a planar wafer made of an inorganic thermally conductive material. The planar wafer has a first surface and a second surface opposite the first surface. A metallized resistive film is disposed on the first surface. A metallized reflective heat sink is disposed on the second surface.
    Type: Grant
    Filed: December 6, 2016
    Date of Patent: November 22, 2022
    Assignee: THE BOEING COMPANY
    Inventors: Robert L. Reynolds, Martin W. Bieti, Robert Choo
  • HIGH POWER THERMALLY CONDUCTIVE RADIO FREQUENCY ABSORBERS
    Publication number: 20180158754
    Abstract: Radio frequency (“RF”) absorbing devices used as RF termination devices or free space absorbers, for example, are formed with a planar wafer made of an inorganic thermally conductive material. The planar wafer has a first surface and a second surface opposite the first surface. A metallized resistive film is disposed on the first surface. A metallized reflective heat sink is disposed on the second surface.
    Type: Application
    Filed: December 6, 2016
    Publication date: June 7, 2018
    Inventors: ROBERT L. REYNOLDS, MARTIN W. BIETI, ROBERT CHOO