Abstract: The present disclosure is directed to an electrostatic charge measurement tool and dedicated system having a probe configured to scan the surface of a target, and methods for taking the electrostatic charge measurements. In an aspect, the probe is a non-contact electrostatic probe that may be moveable across the surface of the target and be adjustable in its height from the surface of the target. In another aspect, the target is an electrostatic chuck or semiconductor wafer. In a further aspect, the electrostatic charge measurement system may perform insitu measurement of targets without removing them from their working environment.

Abstract: The present disclosure is directed to an electrostatic charge measurement tool and dedicated system having a probe configured to scan the surface of a target, and methods for taking the electrostatic charge measurements. In an aspect, the probe is a non-contact electrostatic probe that may be moveable across the surface of the target and be adjustable in its height from the surface of the target. In another aspect, the target is an electrostatic chuck or semiconductor wafer. In a further aspect, the electrostatic charge measurement system may perform insitu measurement of targets without removing them from their working environment.