Abstract: A software product, system and method for a user to set and track lifestyle goals and related activities while collecting memories data along the way, and for a business, to gather and aggregate statistics about the user's lifestyle choices and offer access to the users lifestyle choices for a fee; comprising; matching the following through the internet; consumers and brands that interact together, through social media; the user managing receipts & expenses, goal setting and budgeting; brands to increase consumer loyalty and market awareness; organizing the user life, memories; and assisting the business to organize, market, and advertise and meet business goals.

Abstract: A method of joining a surface-mount component to a substrate includes placing a piece of solder on top of the substrate and temporarily bonding the piece of solder to the substrate with at least one temporary bond. The method also includes placing a surface-mount component on top of the substrate with a bottom face of the surface-mount component facing the substrate. The surface-mount component has at least one lateral side. The method further includes positioning the surface-mount component with the at least one lateral side proximate the piece of solder, heating the substrate and the piece of solder to a joining temperature for a time sufficient for the solder to flow into an area between the bottom face of the surface-mount component and the substrate, and cooling the substrate and solder.

Abstract: A method of joining a surface-mount component to a substrate includes placing a piece of solder on top of the substrate and temporarily bonding the piece of solder to the substrate with at least one temporary bond. The method also includes placing a surface-mount component on top of the substrate with a bottom face of the surface-mount component facing the substrate. The surface-mount component has at least one lateral side. The method further includes positioning the surface-mount component with the at least one lateral side proximate the piece of solder, heating the substrate and the piece of solder to a joining temperature for a time sufficient for the solder to flow into an area between the bottom face of the surface-mount component and the substrate, and cooling the substrate and solder.

Abstract: A method of joining a surface-mount component to a substrate includes placing a piece of solder on top of the substrate and temporarily bonding the piece of solder to the substrate with at least one temporary bond. The method also includes placing a surface-mount component on top of the substrate with a bottom face of the surface-mount component facing the substrate. The surface-mount component has at least one lateral side. The method further includes positioning the surface-mount component with the at least one lateral side proximate the piece of solder, heating the substrate and the piece of solder to a joining temperature for a time sufficient for the solder to flow into an area between the bottom face of the surface-mount component and the substrate, and cooling the substrate and solder.

Abstract: The invention provides a slip layer substrate which can reduce the thermal residual stresses between components induced by their mismatch of thermal expansion, thus greatly improve the reliability of electronic packages. The slip layer substrate comprises: a base material; a first metallization layer formed on the base material; a first diffusion barrier layer formed on the first metallization layer; a slip layer formed on the first diffusion barrier layer; a second diffusion barrier layer formed on the slip layer; and a second metallization layer formed on the second diffusion barrier layer.

Abstract: The invention provides a slip layer substrate which can reduce the thermal residual stresses between components induced by their mismatch of thermal expansion, thus greatly improve the reliability of electronic packages. The slip layer substrate comprises: a base material; a first metallization layer formed on the base material; a first diffusion barrier layer formed on the first metallization layer; a slip layer formed on the first diffusion barrier layer; a second diffusion barrier layer formed on the slip layer; and a second metallization layer formed on the second diffusion barrier layer.

Abstract: A heat sink comprises pins, located in a holding base plate, that are positioned so that the end of each pin is exposed and attached by a thermally conductive material to a heat generating source, such as an internal electronic insulator assembly or a semiconductor die. The pins have various diameters and shapes, such as circular, square, diamond, helical, elliptical, triangular and rectangular that can be made from any thermally conductive material, such as metals, ceramics, organic and inorganic compounds. The pins are located inside a holding base plate that can comprise a medium that will support the structure, such as metals, plastics, ceramics, polymeric, organic and inorganic compounds. The pins are arranged in a geometric pattern of any design shape, repetition of such patterns and concentration of such patterns. The ends of the pins can be straight flat cut or of nail head design.

Abstract: A snelled fishhook case has a spool and a sleeve that fit coaxially together, each being rotatable relative to the other about the common axis, with the sleeve positioned about the spool. A radial opening in the sleeve and an axial slit in the spool can be aligned in registry to provide radial access to a spool cavity that receives the whole hook portion of a snelled fishhook. An annular space is defined between the spool and the sleeve and extends axially opposite the sleeve opening. The leader portion of the snelled fishhook can be wound or unwound about the spool in the annular space covering the spool slit.