Abstract: A semiconductor device is formed from a die and a lead frame having one or more bus bars. Portions of the bus bars are overlain with an electrically insulative material while leaving bonding areas unobstructed, whereby bond wires which span the bus bar(s) may be bonded with a shorter wire and a lower loop, without the danger of shorting to the bus bar(s). The incidence of harmful wire sweep in the encapsulation step is also reduced.

Abstract: A method and apparatus for coating liquid films on to the surface of a wafer substrate by rotating the substrate at a speed sufficient to cause a liquid, through centrifugal effect, to flow outwardly toward the perimeter of the surface and form a substantially uniform thickness liquid coating thereon, and starting from one edge of the wafer surface and moving radially outward therefrom in a single direction, spraying a fine mist of the liquid to the surface of the wafer.

Abstract: A semiconductor device is formed from a die and a lead frame having one or more bus bars. Portions of the bus bars are overlain with an electrically insulative material while leaving bonding areas unobstructed, whereby bond wires which span the bus bar(s) may be bonded with a shorter wire and a lower loop, without the danger of shorting to the bus bar(s). The incidence of harmful wire sweep in the encapsulation step is also reduced.

Abstract: A novel method for coating a semiconductor die/leadframe assembly prior to ocncapsulation. The method of the invention comprises coating the exposed surfaces of the die and the inner lead fingers in a die/leadframe assembly with an adhesion promoting material, typically a polyimide. A solution of the adhesion promoting material is dispensed from a spray nozzle to coat the die and the inner lead fingers, Preferably all exposed surfaces of the die, the inner lead fingers and the bond wires are coated prior to encapsulation. The invention also provides an improved semiconductor package that includes a semiconductor dielleadframe assembly and a layer of adhesion promoting material coating the exposed surfaces of the die and the inner lead fingers. The die/leadframe assembly is encapsulated in a molded plastic package.

Abstract: A novel method for coating a semiconductor die/leadframe assembly prior to encapsulation. The method of the invention comprises coating the exposed surfaces of the die and the inner lead fingers in a die/leadframe assembly with an adhesion promoting material, typically a polyimide. A solution of the adhesion promoting material is dispensed from a spray nozzle to coat the die and the inner lead fingers. Preferably, all exposed surfaces of the die, the inner lead fingers and the bond wires are coated prior to encapsulation. The invention also provides an improved semiconductor package that includes a semiconductor die/leadframe assembly and a layer of adhesion promoting material coating the exposed surfaces of the die and the inner lead fingers. The die/leadframe assembly is encapsulated in a molded plastic package.