Abstract: A polygonal device for teaching students who prefer kinesthetic learning methods is presented in which the polygonal device can represent two-dimensional polygons of varying shapes and sizes. One or more of the sides, or legs, of the polygonal device are extendable, and the angles of the polygonal device may be manipulated to a desired angle. The devices presented include, but are not limited to, triangles, quadrilaterals, parallelograms, rectangles, squares, trapezoids, and kites. In each of these devices, the legs of the device are non-detachable, i.e. the device does not come apart during normal manipulation and operation.

Abstract: A polygonal device for teaching students who prefer kinesthetic learning methods is presented in which the polygonal device can represent two-dimensional polygons of varying shapes and sizes. One or more of the sides, or legs, of the polygonal device are extendable, and the angles of the polygonal device may be manipulated to a desired angle. The devices presented include, but are not limited to, triangles, quadrilaterals, parallelograms, rectangles, squares, trapezoids, and kites. In each of these devices, the legs of the device are non-detachable, i.e. the device does not come apart during normal manipulation and operation.

Abstract: A radiation treatment system and method of commissioning the system, the system including a gantry, a radiation source operable to produce a beam of radiation, and a measurement device. The measurement device is physically connected to the gantry, and includes a multi-dimensional scanning arm, and a detector. The method includes generating radiation from the radiation source, passing the radiation through an attenuation block, and receiving radiation with the measurement device. The measurement device is positioned such that it is not in contact with water. Data is generated from the radiation received and the system is commissioned using the generated data to match system characteristics to a previously defined standard.

Abstract: Systems and methods for utilizing remote access to a radiation therapy treatment system. Remote access to the radiation therapy treatment system can assist in providing quality assurance processes, service and maintenance procedures, patient monitoring, and statistical analysis.

Abstract: Systems and methods for utilizing remote access to a radiation therapy system. Remote access to the radiation therapy system can assist in providing quality assurance processes, service and maintenance procedures, patient monitoring, and statistical analysis.

Abstract: Systems and methods for utilizing remote access to a radiation therapy treatment system. Remote access to the radiation therapy treatment system can assist in providing quality assurance processes, service and maintenance procedures, patient monitoring, and statistical analysis.

Abstract: An improved induction heating apparatus is provided for attaching membrane roofs. A top membrane layer is attached to attachment disks that hold sheets of thermal insulation to the top of roof substrates. The heating apparatus emits a magnetic field that raises the temperature of the disks and a heat-activated adhesive on top of the disks which, after cooling, becomes adhered to the bottom surface of the top membrane layer. The disks in turn are attached via fasteners to the substrate portion of the roof structure. The apparatus includes a set of bottom guides that allow a user to find the attachment disks mechanically, without actually seeing those disks beneath the top membrane layer. A fine locator circuit is provided, using a magnetic field, and the apparatus allows a user to stand upright while operating the apparatus.

Abstract: A portable induction tool is provided for soldering or brazing sections of metal pipe together. A work coil head (with induction coil) is U-shaped, allowing placement of the head around lengths of pipe, heating a susceptor (e.g., the pipe) to form a joint, and then to be withdrawn after the pipe joint is made. In one form, the tool uses heat pipes to remove thermal energy from the head, and also a heat exchanger for higher-powered units. Power capacitors are generally included with the induction (work) coil to create a tank circuit of a resonant frequency. The induction coil uses Litz wire, copper tubing, or heat pipes with a conductive outer skin to carry the high-current being delivered to the induction coil. The induction coil has a general racetrack configuration, which is typically wound in a U-shape (or as a semicircle) as a single winding, with multiple turns.

Abstract: An apparatus and method for aligning an optical fiber with an optical device having bond pads attached thereto. The apparatus includes a fiber mount assembly having a body portion with an opening provided therein to receive the optical fiber, and two leg portions integrally connecting to and extending from the body portion. Bond pads are also attached to the two leg portions. The apparatus further includes an optical device mount assembly having bond pads attached thereto, and a plurality of eutectic solder bumps provided on the bond pads. The eutectic solder bumps connect the bond pads of the optical device and the two leg portions of the fiber mount assembly to the bond pads of the optical device mount assembly.

Abstract: A method of monitoring a subject for medical conditions includes causing light to impinge on at least one eye of the subject, directing reflected light from such light beam to photosensors, converting the received reflected light to corresponding electrical signals which are delivered to a processor. Processing the signals by effecting a comparison between stored information regarding the medical condition and the data provided by the monitoring to determine if an undesired medical condition exists and, if so, communicating such result. The cycle is repeated at predetermined intervals which may be short or prolonged. The method may be employed for a wide variety of medical conditions and preferably is employed with frequent cyclic monitoring for conditions such as miosis, carbon monoxide poisoning, and blood flow related conditions. A related apparatus is provided.

Abstract: A switching power supply which generates AC power, as opposed to DC power. A transistor opens and closes to thereby generate charge-discharge cycles through an inductor-resistor combination. Each charging current is compared with a reference waveform which changes slowly over time, compared with the opening and closing of the transistor. When each charging current exceeds the then-current value of the waveform, the transistor is opened, inducing a discharge cycle. This operation produces an output power waveform which is a replica of the reference waveform.

Abstract: A single-etch stop process for the manufacture of silicon-on-insulator wafers. The process includes forming a silicon-on-insulator bonded wafers comprising a substrate layer, an oxide layer, a device layer, and a device wafer. The device layer is situated between the device wafer and the oxide layer and the oxide layer is between the device layer and the substrate layer. The device wafer has a p.sup.+ or n.sup.+ conductivity type and a resistivity ranging from about 0.005 ohm-cm to about 0.1 ohm-cm. A portion of the device wafer is removed from the silicon-on-insulator bonded wafers and the remaining portion of the device wafer has a defect-free surface after such removal. The remaining portion of the device wafer is then etched to expose the device layer.

Abstract: A process for stripping the outer edge of a bonded BESOI wafer. The bonded BESOI wafer comprises a handle wafer, an oxide layer on one surface of the handle wafer, a device layer bonded to the oxide layer, and a p.sup.+ etch-stop layer on the device layer having an exposed face. The process comprises masking the exposed face of the p.sup.+ etch-stop layer, and abrading the periphery of the BESOI wafer to remove edge margins of the p.sup.+ etch-stop layer and device layer.

Abstract: A process for stripping the outer edge of a bonded BESOI wafer. The bonded BESOI wafer comprises a handle wafer, an oxide layer on one surface of the handle wafer, a device layer bonded to the oxide layer, and a p.sup.+ etch-stop layer on the device layer having an exposed face. The process comprises masking the exposed face of the p.sup.+ etch-stop layer, and abrading the periphery of the BESOI wafer to remove edge margins of the p.sup.+ etch-stop layer and device layer.

Abstract: A single-etch stop process for the manufacture of silicon-on-insulator substrates. The process includes forming a silicon-on-insulator bonded substrate comprising a handle wafer, a device wafer, a device layer having a thickness of between about 0.5 and 50 micrometers, and an oxide layer with the device layer being between the device wafer and the oxide layer and the oxide layer being between the device layer and the handle wafer, the device wafer having a boron concentration of at least about 1.times.10.sup.18 boron atoms/cm.sup.3 and a resistivity of about 0.01 to about 0.02 ohm-cm. A portion of the device wafer is mechanically removed from the silicon-on-insulator bonded substrate wherein the device wafer has a total thickness variation across the surface of the wafer of less than about 2 micrometers and a defect-free surface after the mechanical removal step.

Abstract: A method for detecting transition metal contamination in or on equipment and fluids used or being evaluated for use in the manufacture, handling, or shipping of silicon wafers and electronic devices manufactured on silicon wafers. A contamination monitor wafer having an average minority carrier lifetime greater than about 250 microseconds is processed using one or more pieces of equipment or fluids. As part of, or subsequent to the processing step, the contamination monitor wafer is exposed to a temperature of at least 600.degree. C. and the minority carrier lifetime values of the contamination monitor wafer is thereafter determined. To insure that the recombination process is dot dominated by the effects of oxygen precipitates, the contamination monitor wafer should have an oxygen precipitate density of less than 10.sup.8 oxygen precipitates per cubic centimeter before and after being exposed to said temperature of at least 600.degree. C.

Abstract: This invention is directed to a hydraulic multiplex unit for receiving continuously one or more samples of liquid from a liquid purification system of distribution system and redirecting such sample or samples randomly or in sequence to one or more analytical instruments. The sample collecting system and multiplex unit is periodically backflushed with ozone to maintain the collection and analysis system clean of impurities, particles and the like which adversely affect the composition of the fluid samples.